IN150707B - - Google Patents

Info

Publication number: IN150707B
Authority: IN; India

Application number

IN274/CAL/79A

Other languages

English (en)

Inventor

Bulent Erturk Yoldas

Original Assignee

Westinghouse Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-04-18

Filing date

1979-03-20

Publication date

1982-11-20

1979-03-20 Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp

1982-11-20 Publication of IN150707B publication Critical patent/IN150707B/en

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

IN274/CAL/79A 1978-04-18 1979-03-20 IN150707B (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US05/897,323 US4168960A (en)	1978-04-18	1978-04-18	Method of making a glass encapsulated diode

Publications (1)

Publication Number	Publication Date
IN150707B true IN150707B (fr)	1982-11-20

Family

ID=25407754

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IN274/CAL/79A IN150707B (fr)	1978-04-18	1979-03-20

Country Status (9)

Country	Link
US (1)	US4168960A (fr)
JP (1)	JPS54140872A (fr)
BE (1)	BE875606A (fr)
BR (1)	BR7902283A (fr)
CA (1)	CA1123522A (fr)
DE (1)	DE2915631A1 (fr)
FR (1)	FR2423866B1 (fr)
GB (2)	GB2019089B (fr)
IN (1)	IN150707B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4235645A (en) *	1978-12-15	1980-11-25	Westinghouse Electric Corp.	Process for forming glass-sealed multichip semiconductor devices
DE3005301C2 (de) *	1980-02-13	1985-11-21	Telefunken electronic GmbH, 7100 Heilbronn	Varaktor- oder Mischerdiode
US5151118A (en) *	1988-07-08	1992-09-29	Kabushiki Kaisha Goto Seisakusho	Method for producing a package-type semiconductor assembly
EP0762494B1 (fr) *	1995-09-12	2002-07-24	Zowie Technology Corp.	Diode semi-conductrice en silicium, son module de circuit et structure avec un corps isolant et procédé de préparation
CN1074168C (zh) *	1996-06-05	2001-10-31	智威科技股份有限公司	全切面结玻璃钝化的硅半导体二极管芯片及其制造方法
EP0818820A1 (fr) *	1996-07-11	1998-01-14	Zowie Technology Corp.	Composant de diode semi-conducteur en silicium glassivé avec une jonction PN exposée et son procédé de fabrication
US20070084730A1 (en) *	2005-10-13	2007-04-19	Taiwan Semiconductor Manufacturing Co., Ltd.	Plating apparatuses and processes
CN112186044B (zh) *	2020-09-30	2024-11-19	中国振华集团永光电子有限公司（国营第八七三厂）	一种玻璃钝化实体封装低压二极管及其制造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2046545A (en) *	1935-11-18	1936-07-07	American Steel & Wire Co	Brake control conduit
GB940277A (en) *	1960-08-25	1963-10-30	Carman Lab Inc	Improvements in semiconductor devices
DE1237400C2 (de) *	1961-04-17	1967-10-12	Siemens Ag	Verfahren zum Vakuumaufdampfen eines feuchtigkeitsfesten isolierenden UEberzuges aufHalbleiterbauelemente, insbesondere auf Halbleiterbauelemente mit pn-UEbergang
US3271124A (en) *	1963-09-16	1966-09-06	Bell Telephone Labor Inc	Semiconductor encapsulation
US3328650A (en) *	1965-01-14	1967-06-27	Int Rectifier Corp	Compression bonded semiconductor device
US3446695A (en) *	1966-10-03	1969-05-27	Owens Illinois Inc	Vanadium-zinc borate solder glasses
US3506502A (en) *	1967-06-05	1970-04-14	Sony Corp	Method of making a glass passivated mesa semiconductor device
US3476987A (en) *	1967-09-27	1969-11-04	Westinghouse Electric Corp	Resin encapsulated semiconductor device
US3475662A (en) *	1967-11-22	1969-10-28	Westinghouse Electric Corp	Hermetically sealed electrical device
US3476988A (en) *	1968-01-31	1969-11-04	Westinghouse Electric Corp	Resin encapsulated semiconductor device
US3486084A (en) *	1968-03-19	1969-12-23	Westinghouse Electric Corp	Encapsulated semiconductor device
GB1250099A (fr) *	1969-04-14	1971-10-20
IE35247B1 (en) *	1970-06-08	1975-12-24	Gen Electric	Improvements in ceramic passivated semi-conductor device and process for its manufacture
JPS5117028B1 (fr) *	1970-06-15	1976-05-29
US3850687A (en) *	1971-05-26	1974-11-26	Rca Corp	Method of densifying silicate glasses
JPS5112334B2 (fr) *	1972-06-07	1976-04-19
JPS4914789A (fr) *	1972-06-07	1974-02-08
JPS56944B2 (fr) *	1973-03-06	1981-01-10
DE2548528C3 (de) *	1975-10-30	1979-03-08	Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt	Verfahren zum Passivieren von mit Metallkontaktbergen versehenen Halbleiteranordnungen
NL7604951A (nl) *	1976-05-10	1977-11-14	Philips Nv	Glas voor het passiveren van halfgeleider- inrichtingen.
JPS5819125B2 (ja) *	1976-08-11	1983-04-16	株式会社日立製作所	半導体装置の製造方法
US4161746A (en) *	1978-03-28	1979-07-17	Westinghouse Electric Corp.	Glass sealed diode

1978
- 1978-04-18 US US05/897,323 patent/US4168960A/en not_active Expired - Lifetime
- 1978-10-31 CA CA315,341A patent/CA1123522A/fr not_active Expired
1979
- 1979-03-20 IN IN274/CAL/79A patent/IN150707B/en unknown
- 1979-04-12 GB GB7913125A patent/GB2019089B/en not_active Expired
- 1979-04-12 GB GB08216382A patent/GB2101401B/en not_active Expired
- 1979-04-12 FR FR7909309A patent/FR2423866B1/fr not_active Expired
- 1979-04-13 BE BE0/194631A patent/BE875606A/fr not_active IP Right Cessation
- 1979-04-16 BR BR7902283A patent/BR7902283A/pt unknown
- 1979-04-18 JP JP4680879A patent/JPS54140872A/ja active Pending
- 1979-04-18 DE DE19792915631 patent/DE2915631A1/de not_active Ceased

Also Published As

Publication number	Publication date
CA1123522A (fr)	1982-05-11
JPS54140872A (en)	1979-11-01
FR2423866A1 (fr)	1979-11-16
BR7902283A (pt)	1979-10-23
GB2101401A (en)	1983-01-12
GB2019089B (en)	1983-02-16
GB2101401B (en)	1983-06-08
DE2915631A1 (de)	1979-10-31
US4168960A (en)	1979-09-25
GB2019089A (en)	1979-10-24
FR2423866B1 (fr)	1986-10-24
BE875606A (fr)	1979-10-15

Publication	Publication Date	Title
FR2414007B1 (fr)	1984-02-17
FR2416736B1 (fr)	1984-06-22
FR2416698B1 (fr)	1984-05-11
DE2829873C3 (fr)	1983-02-17
FR2416994B1 (fr)	1984-02-17
FR2415912B1 (fr)	1982-11-19
FR2414948B1 (fr)	1982-04-23
FR2415067B1 (fr)	1983-02-04
FR2415171B1 (fr)	1984-02-03
FR2415585B3 (fr)	1981-10-23
FR2416644B3 (fr)	1980-10-10
FR2415031B1 (fr)	1982-10-15
AU3898778A (fr)	1978-09-28
AU73950S (fr)	1978-04-07
AU3892778A (fr)	1978-10-13
BG25956A1 (fr)	1979-01-12
BG25806A1 (fr)	1979-01-12
BG25836A1 (fr)	1979-01-12
BG25897A1 (fr)	1979-01-12
BG25954A1 (fr)	1979-01-12
BG25875A1 (fr)	1979-01-12
BG26022A1 (fr)	1979-02-15
BE871570A (fr)	1979-02-15
BG26014A1 (fr)	1979-02-15
BG25922A1 (fr)	1979-01-12