IN192021B - - Google Patents

Info

Publication number: IN192021B
Authority: IN; India

Application number

Other languages

English (en)

Inventor

Kazunori Omoya

Oobayashi Takashi

Sakurai Wataru

Harada Mitsuru

Bessho Yoshihiro

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-06-12

Filing date

1996-11-06

Publication date

2004-02-07

1995-11-28 Priority claimed from JP07308798A external-priority patent/JP3093621B2/ja

1996-01-29 Priority claimed from US08/593,675 external-priority patent/US5641996A/en

1996-11-06 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

2004-02-07 Publication of IN192021B publication Critical patent/IN192021B/en

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01215—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps forming coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
- H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/221—Structures or relative sizes
- H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/221—Structures or relative sizes
- H10W72/225—Bumps having a filler embedded in a matrix
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/253—Materials not comprising solid metals or solid metalloids, e.g. polymers or ceramics
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/856—Bump connectors and die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

IN1083CA1996 1995-06-12 1996-11-06 IN192021B (id)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP14437395		1995-06-12
JP07308798A JP3093621B2 (ja)	1995-01-30	1995-11-28	半導体装置の実装方法
US08/593,675 US5641996A (en)	1995-01-30	1996-01-29	Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Publications (1)

Publication Number	Publication Date
IN192021B true IN192021B (id)	2004-02-07

Family

ID=27318812

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IN1083CA1996 IN192021B (id)	1995-06-12	1996-11-06

Country Status (9)

Country	Link
CN (1)	CN1101594C (id)
AU (1)	AU695142B2 (id)
CA (1)	CA2221286A1 (id)
FI (1)	FI974488A7 (id)
ID (2)	ID19376A (id)
IN (1)	IN192021B (id)
NO (1)	NO321429B1 (id)
SE (1)	SE522253C2 (id)
WO (1)	WO1996042106A1 (id)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100522223B1 (ko) *	1997-01-24	2005-12-21	로무 가부시키가이샤	반도체장치및그제조방법
JPH10270496A (ja)	1997-03-27	1998-10-09	Hitachi Ltd	電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
US6407461B1 (en) *	1997-06-27	2002-06-18	International Business Machines Corporation	Injection molded integrated circuit chip assembly
DE69934153T2 (de) *	1998-02-02	2007-09-20	Shin-Etsu Chemical Co., Ltd.	Verfahren zur Montage von Flip-Chip-Halbleiterbauelementen
CN1143375C (zh)	1998-07-01	2004-03-24	精工爱普生株式会社	半导体装置及其制造方法、电路基板和电子装置
US7834464B2 (en) *	2007-10-09	2010-11-16	Infineon Technologies Ag	Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
CN103477428B (zh) *	2011-05-13	2016-10-19	富士电机株式会社	半导体器件及其制造方法
JP5658088B2 (ja) *	2011-05-23	2015-01-21	パナソニックＩｐマネジメント株式会社	半導体パッケージ部品の実装構造体および製造方法
CN107034028B (zh) *	2015-12-04	2021-05-25	三星电子株式会社	用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统
US10894935B2 (en)	2015-12-04	2021-01-19	Samsung Electronics Co., Ltd.	Composition for removing silicone resins and method of thinning substrate by using the same
US10157887B2 (en) *	2017-03-09	2018-12-18	Advanced Semiconductor Engineering, Inc.	Semiconductor device package and method of manufacturing the same
US10297564B2 (en) *	2017-10-05	2019-05-21	Infineon Technologies Ag	Semiconductor die attach system and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63268724A (ja) *	1987-04-24	1988-11-07	Matsushita Electric Works Ltd	液状エポキシ樹脂組成物
JP2515344B2 (ja) *	1987-07-24	1996-07-10	松下電工株式会社	封止用一液性の液状エポキシ樹脂組成物
JPH04130633A (ja) *	1990-09-20	1992-05-01	Matsushita Electron Corp	半導体装置とその製造方法およびそれに用いるキャピラリ
US5194930A (en) *	1991-09-16	1993-03-16	International Business Machines	Dielectric composition and solder interconnection structure for its use
JP2826049B2 (ja) *	1992-11-18	1998-11-18	松下電子工業株式会社	半導体装置およびその製造方法
US5436503A (en) *	1992-11-18	1995-07-25	Matsushita Electronics Corporation	Semiconductor device and method of manufacturing the same
JPH06279654A (ja) *	1993-02-26	1994-10-04	Matsushita Electric Works Ltd	液状エポキシ樹脂組成物
JPH06313027A (ja) *	1993-05-06	1994-11-08	Matsushita Electric Works Ltd	封止用エポキシ樹脂成形材料

1996
- 1996-06-11 ID IDP980876A patent/ID19376A/id unknown
- 1996-06-11 ID IDP980877A patent/ID19377A/id unknown
- 1996-06-12 WO PCT/JP1996/001600 patent/WO1996042106A1/en not_active Ceased
- 1996-06-12 AU AU60154/96A patent/AU695142B2/en not_active Ceased
- 1996-06-12 CA CA002221286A patent/CA2221286A1/en not_active Abandoned
- 1996-06-12 CN CN96194158A patent/CN1101594C/zh not_active Expired - Fee Related
- 1996-11-06 IN IN1083CA1996 patent/IN192021B/en unknown
1997
- 1997-12-10 SE SE9704602A patent/SE522253C2/sv not_active IP Right Cessation
- 1997-12-11 NO NO19975833A patent/NO321429B1/no not_active IP Right Cessation
- 1997-12-11 FI FI974488A patent/FI974488A7/fi not_active Application Discontinuation

Also Published As

Publication number	Publication date
SE522253C2 (sv)	2004-01-27
WO1996042106A1 (en)	1996-12-27
CN1101594C (zh)	2003-02-12
CN1185231A (zh)	1998-06-17
NO321429B1 (no)	2006-05-08
AU695142B2 (en)	1998-08-06
NO975833D0 (no)	1997-12-11
NO975833L (no)	1998-02-03
CA2221286A1 (en)	1996-12-27
AU6015496A (en)	1997-01-09
ID19376A (id)	1998-07-09
SE9704602D0 (sv)	1997-12-10
SE9704602L (sv)	1998-02-05
FI974488A0 (fi)	1997-12-11
FI974488A7 (fi)	1998-02-09
ID19377A (id)	1998-07-09

Publication	Publication Date	Title
BR122012014331A2 (id)	1999-01-05
BRPI9612258B1 (id)	2011-05-31
BRPI9612138B1 (id)	2009-09-22
CH0741373H1 (id)	2011-10-14
AU1627395A (id)	1995-06-30
BR7501503U (id)	1997-11-25
BR7502120U (id)	1998-04-14
BY5258C1 (id)	2003-06-30
CN3029801S (id)	1995-01-25
CN3029928S (id)	1995-02-01
CN3030154S (id)	1995-02-15
CN3030197S (id)	1995-02-15
CN3030225S (id)	1995-02-15
CN3030296S (id)	1995-02-22
CN3030415S (id)	1995-03-01
CN3030489S (id)	1995-03-08
CN3030542S (id)	1995-03-08
CN3030543S (id)	1995-03-08
CN3030760S (id)	1995-03-22
CN3031001S (id)	1995-03-29
CN3031350S (id)	1995-04-19
CN3031655S (id)	1995-05-10
CN3031742S (id)	1995-05-10
CN3031926S (id)	1995-05-17
CN3032332S (id)	1995-05-31