IN2012DN00266A - - Google Patents

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Publication number
IN2012DN00266A
IN2012DN00266A IN266DEN2012A IN2012DN00266A IN 2012DN00266 A IN2012DN00266 A IN 2012DN00266A IN 266DEN2012 A IN266DEN2012 A IN 266DEN2012A IN 2012DN00266 A IN2012DN00266 A IN 2012DN00266A
Authority
IN
India
Prior art keywords
circuit board
printed circuit
filter unit
filter
matched
Prior art date
Application number
Other languages
English (en)
Inventor
Hans-Olof Vickes
Simon Kristiansson
Original Assignee
Saab Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saab Ab filed Critical Saab Ab
Publication of IN2012DN00266A publication Critical patent/IN2012DN00266A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20354—Non-comb or non-interdigital filters
    • H01P1/20372—Hairpin resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
IN266DEN2012 2009-07-14 2009-07-14 IN2012DN00266A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2009/050899 WO2011008142A1 (en) 2009-07-14 2009-07-14 Microwave filter

Publications (1)

Publication Number Publication Date
IN2012DN00266A true IN2012DN00266A (de) 2015-08-21

Family

ID=43449578

Family Applications (1)

Application Number Title Priority Date Filing Date
IN266DEN2012 IN2012DN00266A (de) 2009-07-14 2009-07-14

Country Status (5)

Country Link
US (1) US20120182093A1 (de)
EP (1) EP2454781A4 (de)
KR (1) KR101577370B1 (de)
IN (1) IN2012DN00266A (de)
WO (1) WO2011008142A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2977382A1 (fr) * 2011-06-29 2013-01-04 Thomson Licensing Filtre stop bande a rejection elevee et duplexeur utilisant de tels filtres
FR2999813B1 (fr) * 2012-12-14 2017-07-14 Cassidian Sas Structures de filtrage hyperfrequence
CN117199748A (zh) * 2019-02-28 2023-12-08 京瓷Avx元器件公司 高频、可表面安装的微带带通滤波器
WO2020207885A1 (de) 2019-04-10 2020-10-15 Saint-Gobain Glass France Fahrzeugscheibe mit antenne
CN114946082B (zh) 2020-03-11 2023-08-04 史莱福灵有限公司 带状线连接件
US11373965B2 (en) 2020-07-17 2022-06-28 Northrop Grumman Systems Corporation Channelized filter using semiconductor fabrication
EP4208746A1 (de) * 2020-09-03 2023-07-12 Telefonaktiebolaget LM Ericsson (publ) Hochfrequenzschnittstelle für leiterplatte zu leiterplatte
US12004288B2 (en) * 2021-02-25 2024-06-04 Teradyne, Inc. Resonant-coupled transmission line

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE6948645U (de) * 1969-12-17 1970-05-14 Saba Gmbh Mehrkreisiges bandfilter fuer fernseh- und rundfunkempfaenger.
US3668569A (en) * 1970-05-27 1972-06-06 Hazeltine Corp Distributed-constant dispersive network
US4701727A (en) * 1984-11-28 1987-10-20 General Dynamics, Pomona Division Stripline tapped-line hairpin filter
DE4135435A1 (de) * 1991-10-26 1993-04-29 Aeg Mobile Communication Kammleitungsfilter
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
JP3406830B2 (ja) * 1998-03-06 2003-05-19 京セラ株式会社 高周波用電子装置
JP2001060802A (ja) * 1999-08-19 2001-03-06 Sony Corp 回路素子基板と半導体装置及びその製造方法
EP1252655A1 (de) * 2000-01-13 2002-10-30 Alpha Industries, Inc. Mikrowellen-is-gehäuse mit dual-modus wellenleiter
US6617943B1 (en) * 2001-07-27 2003-09-09 Applied Micro Circuits Corporation Package substrate interconnect layout for providing bandpass/lowpass filtering
US6483404B1 (en) * 2001-08-20 2002-11-19 Xytrans, Inc. Millimeter wave filter for surface mount applications
US6700464B2 (en) * 2002-02-21 2004-03-02 Intel Corporation Low cost high speed board-to-board coaxial connector design with co-planar waveguide for PCB launch
DE10305855A1 (de) * 2003-02-13 2004-08-26 Robert Bosch Gmbh HF-Multilayer-Platine
US6791403B1 (en) * 2003-03-19 2004-09-14 Raytheon Company Miniature RF stripline linear phase filters
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US20080100394A1 (en) * 2004-06-30 2008-05-01 Emag Technologies, Inc. Microstrip to Coplanar Waveguide Transition
US20060226928A1 (en) * 2005-04-08 2006-10-12 Henning Larry C Ball coax interconnect
JP4308808B2 (ja) 2005-09-26 2009-08-05 アルプス電気株式会社 ストリップラインフィルタ
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
US7405477B1 (en) * 2005-12-01 2008-07-29 Altera Corporation Ball grid array package-to-board interconnect co-design apparatus

Also Published As

Publication number Publication date
KR20120051012A (ko) 2012-05-21
US20120182093A1 (en) 2012-07-19
KR101577370B1 (ko) 2015-12-14
WO2011008142A1 (en) 2011-01-20
EP2454781A1 (de) 2012-05-23
EP2454781A4 (de) 2013-01-16

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