IN2012DN00632A - - Google Patents

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Publication number
IN2012DN00632A
IN2012DN00632A IN632DEN2012A IN2012DN00632A IN 2012DN00632 A IN2012DN00632 A IN 2012DN00632A IN 632DEN2012 A IN632DEN2012 A IN 632DEN2012A IN 2012DN00632 A IN2012DN00632 A IN 2012DN00632A
Authority
IN
India
Prior art keywords
copper
copper foil
metal sheet
bonding
superconducting wire
Prior art date
Application number
Inventor
Okayama Hironao
Kurokawa Teppei
Nanbu Kouji
Isobe Yoshihiko
koshiro Takashi
Kaneko Arika
Ota Hajime
Ohki Kotaro
Yamaguchi Takashi
Ohmatsu Kazuya
Original Assignee
Toyo Kohan Co Ltd
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd, Sumitomo Electric Industries filed Critical Toyo Kohan Co Ltd
Publication of IN2012DN00632A publication Critical patent/IN2012DN00632A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06Films or wires on bases or cores
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0268Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12903Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Provided are a method of manufacturing a metal laminated substrate for an oxide superconducting wire and a metal laminated substrate for an oxide superconducting wire, where copper can have sharp biaxial texture and the formation of scratches and grooves on a surface of copper can be prevented. The method includes the steps of: removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300MPa to 1500MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
IN632DEN2012 2009-07-17 2010-07-08 IN2012DN00632A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009169531 2009-07-17
PCT/JP2010/004460 WO2011007527A1 (en) 2009-07-17 2010-07-08 Metal laminated substrate for use as an oxide superconducting wire material, and manufacturing method therefor

Publications (1)

Publication Number Publication Date
IN2012DN00632A true IN2012DN00632A (en) 2015-08-21

Family

ID=43449139

Family Applications (1)

Application Number Title Priority Date Filing Date
IN632DEN2012 IN2012DN00632A (en) 2009-07-17 2010-07-08

Country Status (7)

Country Link
US (1) US8815777B2 (en)
EP (1) EP2455949B1 (en)
JP (1) JP5723773B2 (en)
KR (1) KR101680756B1 (en)
CN (1) CN102473486B (en)
IN (1) IN2012DN00632A (en)
WO (1) WO2011007527A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5517196B2 (en) * 2009-11-20 2014-06-11 東洋鋼鈑株式会社 Superconducting compound substrate and manufacturing method thereof
JP5650098B2 (en) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 Rolled copper foil for superconducting film formation
JP5650099B2 (en) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 Rolled copper foil for superconducting film formation
JP5705107B2 (en) * 2011-12-28 2015-04-22 Jx日鉱日石金属株式会社 Rolled copper foil for superconducting film formation
US9002424B2 (en) * 2012-04-16 2015-04-07 Furukawa Electric Co., Ltd. Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method
JP5904869B2 (en) * 2012-05-11 2016-04-20 Jx金属株式会社 Method for producing rolled copper foil for superconducting film formation
WO2013180443A1 (en) * 2012-05-29 2013-12-05 한국생산기술연구원 Iron bus bar having copper layer, and method for manufacturing same
US10087552B2 (en) * 2012-10-05 2018-10-02 Toyo Kohan Co., Ltd. Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire
WO2015033808A1 (en) * 2013-09-04 2015-03-12 東洋鋼鈑株式会社 Method for depositing oxide layer, and layered substrate for epitaxial growth and process for producing same
JP6244142B2 (en) * 2013-09-04 2017-12-06 東洋鋼鈑株式会社 Superconducting wire substrate, manufacturing method thereof, and superconducting wire
CN104538543B (en) * 2014-12-11 2017-06-20 西部超导材料科技股份有限公司 A kind of low-temperature superconducting wire preparation method of NbTi rods
US11524486B2 (en) 2015-10-23 2022-12-13 Toyo Kohan Co., Ltd. Substrate for epitaxtail, growth and method for producing same
US11840045B2 (en) * 2017-03-29 2023-12-12 Toyo Kohan Co., Ltd. Roll-bonded laminate
JP7074190B2 (en) * 2018-06-15 2022-05-24 住友電気工業株式会社 Superconducting wire, laminated superconducting wire, superconducting coil and superconducting cable
JP7618390B2 (en) * 2020-04-22 2025-01-21 東洋鋼鈑株式会社 Metal laminated film and its manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3587956B2 (en) 1997-06-10 2004-11-10 古河電気工業株式会社 Oxide superconducting wire and its manufacturing method
US7816303B2 (en) * 2004-10-01 2010-10-19 American Superconductor Corporation Architecture for high temperature superconductor wire
JP5123462B2 (en) 2004-10-27 2013-01-23 住友電気工業株式会社 Film-forming alignment substrate, superconducting wire, and method for manufacturing film-forming alignment substrate
JP5074083B2 (en) * 2007-04-17 2012-11-14 中部電力株式会社 Clad-oriented metal substrate for epitaxial thin film formation and manufacturing method thereof
JP5382911B2 (en) 2008-11-12 2014-01-08 東洋鋼鈑株式会社 Method for producing metal laminated substrate for oxide superconducting wire and oxide superconducting wire using the substrate

Also Published As

Publication number Publication date
WO2011007527A1 (en) 2011-01-20
JPWO2011007527A1 (en) 2012-12-20
US8815777B2 (en) 2014-08-26
JP5723773B2 (en) 2015-05-27
EP2455949A4 (en) 2015-04-22
KR101680756B1 (en) 2016-11-29
EP2455949B1 (en) 2016-08-31
US20120208703A1 (en) 2012-08-16
KR20120038410A (en) 2012-04-23
EP2455949A1 (en) 2012-05-23
CN102473486A (en) 2012-05-23
CN102473486B (en) 2013-07-17

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