IN2012DN02784A - - Google Patents

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Publication number
IN2012DN02784A
IN2012DN02784A IN2784DEN2012A IN2012DN02784A IN 2012DN02784 A IN2012DN02784 A IN 2012DN02784A IN 2784DEN2012 A IN2784DEN2012 A IN 2784DEN2012A IN 2012DN02784 A IN2012DN02784 A IN 2012DN02784A
Authority
IN
India
Prior art keywords
nozzle
substrate
disposed
chamber
active cooling
Prior art date
Application number
Inventor
Paul E Burrows
Siddharth Harikrishna Mohan
Original Assignee
Universal Display Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Display Corp filed Critical Universal Display Corp
Publication of IN2012DN02784A publication Critical patent/IN2012DN02784A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A device is provided. The device includes a nozzle (310), a source of carrier gas and a source of organic molecules in fluid communication with the nozzle. The device also includes an active cooling system (322) disposed adjacent to the nozzle. Preferably, the device also includes a chamber, wherein the nozzle, and the active cooling system are disposed within the chamber. A substrate holder may also be disposed within the chamber, adapted to support a substrate beneath the nozzle, movable relative to the nozzle. Preferably, a substrate is held by the substrate holder, the substrate disposed at a distance of 0.1 to 10 mm from the active cooling system. Preferably, the device also includes a heating system (350) attached to the nozzle. The points at which the heating system are attached to the nozzle preferably includes at least one point that is zero to 5 mm from the tip of the nozzle.
IN2784DEN2012 2009-09-03 2010-09-02 IN2012DN02784A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23965609P 2009-09-03 2009-09-03
US12/870,125 US20110097495A1 (en) 2009-09-03 2010-08-27 Organic vapor jet printing with chiller plate
PCT/US2010/047625 WO2011028867A1 (en) 2009-09-03 2010-09-02 Organic vapor jet printing device with a chiller plate

Publications (1)

Publication Number Publication Date
IN2012DN02784A true IN2012DN02784A (en) 2015-09-18

Family

ID=43014428

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2784DEN2012 IN2012DN02784A (en) 2009-09-03 2010-09-02

Country Status (6)

Country Link
US (1) US20110097495A1 (en)
EP (1) EP2473646B1 (en)
KR (2) KR20160136469A (en)
CN (1) CN102597299B (en)
IN (1) IN2012DN02784A (en)
WO (1) WO2011028867A1 (en)

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CN103003464B (en) * 2010-07-22 2015-03-25 通用显示公司 Organic Vapor Jet Printing
US20130273239A1 (en) * 2012-03-13 2013-10-17 Universal Display Corporation Nozzle design for organic vapor jet printing
US8728858B2 (en) 2012-08-27 2014-05-20 Universal Display Corporation Multi-nozzle organic vapor jet printing
CN103972392A (en) * 2013-02-01 2014-08-06 中国科学院苏州纳米技术与纳米仿生研究所 Production method of organic thin-film field effect transistor
CN103972095B (en) * 2013-02-01 2017-06-13 中国科学院苏州纳米技术与纳米仿生研究所 The preparation method of metal-oxide film field-effect transistor
EP2960059B1 (en) 2014-06-25 2018-10-24 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11267012B2 (en) 2014-06-25 2022-03-08 Universal Display Corporation Spatial control of vapor condensation using convection
US11220737B2 (en) 2014-06-25 2022-01-11 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US9583707B2 (en) 2014-09-19 2017-02-28 Universal Display Corporation Micro-nozzle and micro-nozzle array for OVJP and method of manufacturing the same
US10704144B2 (en) 2015-10-12 2020-07-07 Universal Display Corporation Apparatus and method for printing multilayer organic thin films from vapor phase in an ultra-pure gas ambient
US10566534B2 (en) 2015-10-12 2020-02-18 Universal Display Corporation Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP)
US10170701B2 (en) 2016-03-04 2019-01-01 Universal Display Corporation Controlled deposition of materials using a differential pressure regime
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CN112424393A (en) * 2018-06-15 2021-02-26 应用材料公司 Cooling system for cooling a deposition area, arrangement for performing material deposition, and method of performing deposition on a substrate
US20190386256A1 (en) 2018-06-18 2019-12-19 Universal Display Corporation Sequential material sources for thermally challenged OLED materials
CN108909184A (en) * 2018-07-17 2018-11-30 深圳市华星光电技术有限公司 Printing head, printing equipment with temp regulating function
EP4380800A4 (en) * 2021-08-05 2025-06-18 Sekisui Kydex, LLC Multi-station dye sublimation apparatus for pre-heating and for facilitating simultaneous sublimation cycles
US20230063757A1 (en) * 2021-08-18 2023-03-02 Universal Display Corporation Actively cooled heat sink for OVJP print head
US20230357918A1 (en) * 2022-05-09 2023-11-09 Universal Display Corporation Organic vapor jet printing system
US20230363244A1 (en) * 2022-05-09 2023-11-09 Universal Display Corporation Organic vapor jet printing system

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Also Published As

Publication number Publication date
US20110097495A1 (en) 2011-04-28
CN102597299B (en) 2015-05-13
CN102597299A (en) 2012-07-18
WO2011028867A1 (en) 2011-03-10
KR20120058591A (en) 2012-06-07
EP2473646A1 (en) 2012-07-11
EP2473646B1 (en) 2018-12-05
KR101940328B1 (en) 2019-01-18
KR20160136469A (en) 2016-11-29

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