IN2013CH00566A - - Google Patents

Info

Publication number
IN2013CH00566A
IN2013CH00566A IN566CH2013A IN2013CH00566A IN 2013CH00566 A IN2013CH00566 A IN 2013CH00566A IN 566CH2013 A IN566CH2013 A IN 566CH2013A IN 2013CH00566 A IN2013CH00566 A IN 2013CH00566A
Authority
IN
India
Prior art keywords
robot
robot control
control device
substrate positioning
positioning device
Prior art date
Application number
Inventor
Minami Takashi
Katsuda Shinichi
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of IN2013CH00566A publication Critical patent/IN2013CH00566A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0084—Program-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1628—Program controls characterised by the control loop
    • B25J9/1633—Program controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1656—Program controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50036—Find center of circular mark, groove
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

A transfer system includes a substrate positioning device, robots having a first robot and a second robot; and robot control devices, the robot control devices including a first robot control device to which the first robot and the substrate positioning device are connected and a second robot control device to which the second robot is connected. The first robot control device includes an acquiring unit configured to acquire, from the substrate positioning device, at least an absolute deviation amount between the rotation center of the mounting table and a center position of the substrate positioned, and a transmitting unit configured to transmit correction information relying on the absolute deviation amount acquired by the acquiring unit, to the second robot control device to which the second robot is connected. Most Illustrative Drawing: Fig. 3
IN566CH2013 2012-02-16 2013-02-11 IN2013CH00566A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012031982A JP5573861B2 (en) 2012-02-16 2012-02-16 Transport system

Publications (1)

Publication Number Publication Date
IN2013CH00566A true IN2013CH00566A (en) 2015-04-24

Family

ID=48957803

Family Applications (1)

Application Number Title Priority Date Filing Date
IN566CH2013 IN2013CH00566A (en) 2012-02-16 2013-02-11

Country Status (6)

Country Link
US (1) US8989901B2 (en)
JP (1) JP5573861B2 (en)
KR (1) KR101446413B1 (en)
CN (1) CN103253512A (en)
IN (1) IN2013CH00566A (en)
TW (1) TW201347937A (en)

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JP6199199B2 (en) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 Substrate processing apparatus, misregistration correction method, and storage medium
JP6384195B2 (en) * 2014-08-20 2018-09-05 株式会社安川電機 Robot system and robot teaching method
US9824908B2 (en) * 2015-05-05 2017-11-21 Kawasaki Jukogyo Kabushiki Kaisha Conveying system, conveying robot and teaching method of the same
JP6587423B2 (en) * 2015-05-28 2019-10-09 キヤノン株式会社 Transport system and exposure system
WO2017104039A1 (en) * 2015-12-17 2017-06-22 株式会社安川電機 Teaching system, teaching method, and robot
US10099377B2 (en) * 2016-06-29 2018-10-16 Applied Materials, Inc. Methods and systems providing misalignment correction in robots
JP6741538B2 (en) * 2016-09-28 2020-08-19 川崎重工業株式会社 Robot, robot control device, and robot position teaching method
JP7199073B2 (en) * 2017-10-20 2023-01-05 株式会社キーレックス Teaching data creation system for vertical articulated robots
US12191168B2 (en) * 2018-04-09 2025-01-07 Tokyo Electron Limited Laser processing device, laser processing system and laser processing method
US11059178B2 (en) * 2018-12-27 2021-07-13 Kawasaki Jukogyo Kabushiki Kaisha Method of correcting position of robot and robot
US10974388B2 (en) * 2018-12-27 2021-04-13 Kawasaki Jukogyo Kabushiki Kaisha Method of correcting position of robot and robot
WO2021164664A1 (en) * 2020-02-19 2021-08-26 宋茂炎 Loading/unloading device of wafer carrying disc and loading/unloading method therefor
CN118578378A (en) * 2020-02-19 2024-09-03 总督科技股份有限公司 Wafer transfer mechanism robot arm calibration device
JP7515323B2 (en) * 2020-07-09 2024-07-12 東京エレクトロン株式会社 Inspection device and substrate transport method
JP7712078B2 (en) * 2020-12-25 2025-07-23 川崎重工業株式会社 Substrate transport robot control device and joint motor control method
TW202306022A (en) * 2021-06-18 2023-02-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Vapor deposition assembly, susceptor treatment apparatus, and method of cleaning substrate
CN114536339B (en) * 2022-03-03 2024-05-31 深圳市大族机器人有限公司 Control method and device of collaborative robot, collaborative robot and storage medium
WO2025002723A1 (en) 2023-06-29 2025-01-02 Asml Netherlands B.V. System and method for robot calibration

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JPH10173022A (en) * 1996-12-10 1998-06-26 Mecs:Kk Wafer transfer device
US6405101B1 (en) * 1998-11-17 2002-06-11 Novellus Systems, Inc. Wafer centering system and method
JP2003142417A (en) 2001-11-05 2003-05-16 Anelva Corp Robot control equipment installed in the film forming equipment
JP3760212B2 (en) * 2001-11-30 2006-03-29 川崎重工業株式会社 Alignment processing method and alignment processing apparatus
JP4071057B2 (en) * 2002-07-10 2008-04-02 東京エレクトロン株式会社 Substrate positioning device and substrate processing apparatus
US6748293B1 (en) * 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
KR100583727B1 (en) * 2004-01-07 2006-05-25 삼성전자주식회사 Substrate manufacturing apparatus and substrate transfer module used therein
CN1876529B (en) 2006-07-11 2010-12-01 友达光电股份有限公司 Glass substrate transfer device
JP2008173744A (en) * 2007-01-22 2008-07-31 Tokyo Electron Ltd Transport position adjustment method of transport system
KR100855877B1 (en) 2007-02-23 2008-09-03 세메스 주식회사 Substrate processing apparatus and substrate alignment method in the apparatus
US8060252B2 (en) * 2007-11-30 2011-11-15 Novellus Systems, Inc. High throughput method of in transit wafer position correction in system using multiple robots
CN103537811A (en) * 2008-08-26 2014-01-29 应用材料公司 Laser material removal methods and apparatus
JP2011108958A (en) * 2009-11-20 2011-06-02 Hitachi High-Tech Control Systems Corp Semiconductor wafer carrying device and carrying method using the same
JP5755844B2 (en) * 2010-05-31 2015-07-29 株式会社ダイヘン Work transfer system
JP5627518B2 (en) * 2011-03-16 2014-11-19 大日本スクリーン製造株式会社 Substrate processing apparatus and power management method

Also Published As

Publication number Publication date
TW201347937A (en) 2013-12-01
US8989901B2 (en) 2015-03-24
JP5573861B2 (en) 2014-08-20
JP2013168579A (en) 2013-08-29
KR101446413B1 (en) 2014-10-02
CN103253512A (en) 2013-08-21
KR20130094754A (en) 2013-08-26
US20130218337A1 (en) 2013-08-22

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