IN2014DN06962A - - Google Patents

Info

Publication number
IN2014DN06962A
IN2014DN06962A IN6962DEN2014A IN2014DN06962A IN 2014DN06962 A IN2014DN06962 A IN 2014DN06962A IN 6962DEN2014 A IN6962DEN2014 A IN 6962DEN2014A IN 2014DN06962 A IN2014DN06962 A IN 2014DN06962A
Authority
IN
India
Prior art keywords
solder
paste
becomes possible
power module
metallic member
Prior art date
Application number
Inventor
Shuji Nishimoto
Kimihito Nishikawa
Yoshiyuki Nagatomo
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012029646A external-priority patent/JP5915233B2/en
Priority claimed from JP2012029683A external-priority patent/JP2013168240A/en
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2014DN06962A publication Critical patent/IN2014DN06962A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes or wires
    • B23K35/0272—Rods, electrodes or wires with more than one layer of coating or sheathing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3602—Carbonates, basic oxides or hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3607—Silica or silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01961—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07334—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/925—Bond pads having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/953—Materials of bond pads not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A solder joint structure a power module utilizing the joint structure a heat sink attached substrate for a power module a method for producing the substrate and a paste for forming a solder underlayer. The paste is arranged on a metallic member and then fired thereby reacting with an oxide coating film generated on the surface of the metallic member to form a solder underlayer on the metallic member. In this manner it becomes possible to prevent the formation of swells or wrinkles on the surface of an aluminum member and it also becomes possible to improve the reliability of the joint between the aluminum member and a member to be joined to the aluminum member even under applying a power cycle or a heat cycle.
IN6962DEN2014 2012-02-14 2013-02-14 IN2014DN06962A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012029646A JP5915233B2 (en) 2012-02-14 2012-02-14 Solder joint structure, power module, power module substrate with heat sink, and manufacturing method thereof
JP2012029683A JP2013168240A (en) 2012-02-14 2012-02-14 Paste for formation of solder ground layer
PCT/JP2013/053488 WO2013122126A1 (en) 2012-02-14 2013-02-14 Solder joint structure, power module, heat-sink-attached substrate for power module, method for producing said substrate, and paste for forming solder underlayer

Publications (1)

Publication Number Publication Date
IN2014DN06962A true IN2014DN06962A (en) 2015-04-10

Family

ID=48984235

Family Applications (1)

Application Number Title Priority Date Filing Date
IN6962DEN2014 IN2014DN06962A (en) 2012-02-14 2013-02-14

Country Status (6)

Country Link
US (1) US9355986B2 (en)
EP (1) EP2816593B1 (en)
KR (1) KR102066300B1 (en)
CN (1) CN104126226B (en)
IN (1) IN2014DN06962A (en)
WO (1) WO2013122126A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6061276B2 (en) 2014-08-29 2017-01-18 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ Method for forming solder joints between metal layers
US9741878B2 (en) 2015-11-24 2017-08-22 PLANT PV, Inc. Solar cells and modules with fired multilayer stacks
WO2017091782A1 (en) * 2015-11-24 2017-06-01 Plant Pv, Inc Fired multilayer stacks for use in integrated circuits and solar cells
JP6463505B2 (en) * 2015-11-25 2019-02-06 三菱電機株式会社 Semiconductor device, inverter device and automobile
US10559659B2 (en) * 2016-04-06 2020-02-11 Mitsubishi Electric Corporation Power semiconductor device
CN109075159B (en) * 2016-04-21 2021-12-17 三菱电机株式会社 Semiconductor device and method for manufacturing the same
CN109643661B (en) * 2016-08-05 2022-09-09 三菱电机株式会社 power semiconductor device
CN106270871A (en) * 2016-11-01 2017-01-04 株洲中车时代电气股份有限公司 The welding method of a kind of semiconductor device and welding system
JP6717245B2 (en) 2017-03-17 2020-07-01 三菱マテリアル株式会社 Method for manufacturing joined body, method for manufacturing insulated circuit board, and method for manufacturing insulated circuit board with heat sink
JP6888401B2 (en) 2017-04-28 2021-06-16 日亜化学工業株式会社 Metal powder sintered paste and its manufacturing method, and conductive material manufacturing method
JP7043794B2 (en) * 2017-11-06 2022-03-30 三菱マテリアル株式会社 How to manufacture a board for a power module with a heat sink and a board for a power module with a heat sink
JP7200616B2 (en) * 2017-12-06 2023-01-10 三菱マテリアル株式会社 Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate
CN108346952B (en) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 Electrical connector holding device
JP7046643B2 (en) * 2018-02-23 2022-04-04 株式会社ノリタケカンパニーリミテド Heat dissipation board
EP3770950A4 (en) * 2018-03-23 2022-02-16 Mitsubishi Materials Corporation METHOD FOR MANUFACTURING MODULE MOUNTED ON ELECTRONIC COMPONENT
US10470314B1 (en) * 2018-08-06 2019-11-05 Lockheed Martin Corporation Methods of soldering and applications thereof
CN109396586B (en) * 2018-12-13 2020-09-01 华北水利水电大学 A kind of brazing method of epoxy resin device and PCB printed circuit board base material
JP7215273B2 (en) * 2019-03-22 2023-01-31 三菱マテリアル株式会社 junction structure
US12102007B2 (en) 2020-01-31 2024-09-24 National Institute Of Advanced Industrial Science And Technology Thermoelectric conversion module
CN112192085A (en) * 2020-10-14 2021-01-08 哈尔滨工业大学（深圳） Composite solder preformed sheet and preparation method and packaging method thereof
DE102020213850A1 (en) * 2020-11-04 2022-05-05 Robert Bosch Gesellschaft mit beschränkter Haftung Method for producing a heat sink and arrangement, comprising a heat sink
CN120356880B (en) * 2021-08-09 2026-03-31 华为技术有限公司 A power module, power supply circuit and chip
CN114700649B (en) * 2022-03-29 2023-01-13 郑州大学 A kind of zinc-aluminum brazing alloy with strong electrical conductivity and high strength for copper-aluminum brazing joints
KR20240003596A (en) * 2022-07-01 2024-01-09 현대자동차주식회사 Power module
TWI832349B (en) * 2022-07-21 2024-02-11 大陸商深圳興奇宏科技有限公司 Method for manufacturing heat dissipation device

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02230607A (en) * 1988-11-04 1990-09-13 Asahi Glass Co Ltd Conductor paste composition and ceramics substrate
DE3905276C1 (en) * 1989-02-21 1990-05-03 Demetron Gesellschaft Fuer Elektronik-Werkstoffe Mbh, 6450 Hanau, De
JP2795467B2 (en) * 1989-06-19 1998-09-10 第一工業製薬株式会社 Good adhesive metal paste
JPH0437009A (en) * 1990-05-31 1992-02-07 Kyocera Corp Conductive paste for forming terminal electrode of laminated type capacitor
US5333668A (en) * 1991-12-09 1994-08-02 Reynolds Metals Company Process for creation of metallurgically bonded inserts cast-in-place in a cast aluminum article
JP3685901B2 (en) * 1997-03-19 2005-08-24 本田技研工業株式会社 Method for producing Al-based composite
US6484790B1 (en) * 1999-08-31 2002-11-26 Cummins Inc. Metallurgical bonding of coated inserts within metal castings
US6443211B1 (en) * 1999-08-31 2002-09-03 Cummins Inc. Mettallurgical bonding of inserts having multi-layered coatings within metal castings
JP4587617B2 (en) * 2001-08-28 2010-11-24 京セラ株式会社 Ceramic wiring board
JP3982284B2 (en) * 2002-03-06 2007-09-26 住友電気工業株式会社 Submount and semiconductor device
JP3509809B2 (en) * 2002-04-30 2004-03-22 住友電気工業株式会社 Submount and semiconductor device
JP3882712B2 (en) * 2002-08-09 2007-02-21 住友電気工業株式会社 Submount and semiconductor device
SG130193A1 (en) * 2003-08-06 2007-03-20 Univ Michigan State Composite metal matrix castings and solder compositions, and methods
CN100544078C (en) 2004-02-18 2009-09-23 松下电器产业株式会社 Secondary battery
JP2005303218A (en) * 2004-04-16 2005-10-27 Renesas Technology Corp Semiconductor device and manufacturing method thereof
JP4826066B2 (en) * 2004-04-27 2011-11-30 住友金属鉱山株式会社 Amorphous transparent conductive thin film and method for producing the same, and sputtering target for obtaining the amorphous transparent conductive thin film and method for producing the same
JP4305430B2 (en) * 2005-08-24 2009-07-29 ソニー株式会社 Component mounting method and component mounting body
JP4904915B2 (en) * 2006-05-18 2012-03-28 三菱マテリアル株式会社 Power module substrate manufacturing method, power module substrate and power module
JP2008227336A (en) 2007-03-15 2008-09-25 Hitachi Metals Ltd Semiconductor module and circuit board used therefor
US7868465B2 (en) * 2007-06-04 2011-01-11 Infineon Technologies Ag Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
US20100132404A1 (en) * 2008-12-03 2010-06-03 Progressive Cooling Solutions, Inc. Bonds and method for forming bonds for a two-phase cooling apparatus
JP5212298B2 (en) 2009-05-15 2013-06-19 三菱マテリアル株式会社 Power module substrate, power module substrate with cooler, power module, and method of manufacturing power module substrate
JP5304508B2 (en) 2009-05-15 2013-10-02 三菱マテリアル株式会社 Conductive composition
EP2610540A4 (en) * 2010-08-26 2015-04-29 Nippon Electric Glass Co WAVE LENGTH CONVERTING ELEMENT, LIGHT SOURCE, AND BACKLIGHT UNIT FOR LIQUID CRYSTALS

Also Published As

Publication number Publication date
EP2816593A4 (en) 2016-07-06
US20150035137A1 (en) 2015-02-05
KR102066300B1 (en) 2020-03-02
WO2013122126A1 (en) 2013-08-22
EP2816593A1 (en) 2014-12-24
US9355986B2 (en) 2016-05-31
KR20140127250A (en) 2014-11-03
CN104126226B (en) 2018-05-04
CN104126226A (en) 2014-10-29
EP2816593B1 (en) 2020-01-15

Similar Documents

Publication Publication Date Title
IN2014DN06962A (en)
MY175032A (en) Photovoltaic cell and laminate metallization
TW201613037A (en) Substrate for power modules, substrate with heat sink for power modules and power module with heat sink
EP2294250A4 (en) Anti-corrosive hybrid sol-gel film on metallic substrates and method of producing the same
IN2014DN08029A (en)
IN2014CN03370A (en)
WO2012015982A3 (en) Electronics substrate with enhanced direct bonded metal
IN2015DN03283A (en)
WO2011119007A3 (en) Heat-dissipating tape and method for manufacturing same
WO2012174367A3 (en) Device with inverted large scale light extraction structures
PH12011000403A1 (en) Semiconductor device package and method of manufacturing thereof
EP2974859A4 (en) Bonded body, substrate for power modules, and substrate with heat sink for power modules
PL2718479T3 (en) Method of producing an aluminum or aluminum alloy strip with a heat-seal lacquer on a first surface and an epoxide based stove lacquer on the second surface previously coated with a chromium-free conversion coating
MY170538A (en) Process for producing metal-resin bonded object.
IN2014DN08074A (en)
GB2526464A (en) Methods of forming buried microelectricomechanical structures coupled with device substrates and structures formed thereby
PH12016501804A1 (en) Bonds for solar cell metallization
MY184180A (en) Wafer-processing tape
MX377984B (en) FLUOROPOLYMER ADHESION TO METAL.
EP4435152A3 (en) Structures and methods for low temperature bonding
MX2017001398A (en) Electrical connection element, method for producing an electrical connection element, and use of an electrical connection element.
JP2015037174A5 (en)
MY183221A (en) Anisotropic conductive film, connection method, and joined body
WO2012099466A3 (en) Method for manufacturing an electronic device by electrodeposition from an ionic liquid
WO2012015286A3 (en) Device for generating photovoltaic power and manufacturing method for same