IN2014DN10875A - - Google Patents

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Publication number
IN2014DN10875A
IN2014DN10875A IN10875DEN2014A IN2014DN10875A IN 2014DN10875 A IN2014DN10875 A IN 2014DN10875A IN 10875DEN2014 A IN10875DEN2014 A IN 10875DEN2014A IN 2014DN10875 A IN2014DN10875 A IN 2014DN10875A
Authority
IN
India
Prior art keywords
board
front surface
bottom board
top board
metal substrate
Prior art date
Application number
Other languages
English (en)
Inventor
Jichang Liao
Ning Sun
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of IN2014DN10875A publication Critical patent/IN2014DN10875A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
IN10875DEN2014 2012-08-10 2012-08-10 IN2014DN10875A (th)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/079979 WO2014023029A1 (en) 2012-08-10 2012-08-10 Radio module and relavent manufacturing method

Publications (1)

Publication Number Publication Date
IN2014DN10875A true IN2014DN10875A (th) 2015-09-11

Family

ID=50067409

Family Applications (1)

Application Number Title Priority Date Filing Date
IN10875DEN2014 IN2014DN10875A (th) 2012-08-10 2012-08-10

Country Status (5)

Country Link
US (1) US20150201496A1 (th)
EP (1) EP2883432A4 (th)
CN (1) CN104521338A (th)
IN (1) IN2014DN10875A (th)
WO (1) WO2014023029A1 (th)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150022978A1 (en) * 2013-07-19 2015-01-22 Motorola Mobility Llc Circuit Assembly and Corresponding Methods
US9363892B2 (en) * 2013-07-19 2016-06-07 Google Technology Holdings LLC Circuit assembly and corresponding methods
CN104777458A (zh) * 2015-04-22 2015-07-15 四川正冠科技有限公司 一体化雷达射频微波组件及其制作方法
US10548248B2 (en) * 2016-02-10 2020-01-28 Dell Products, Lp System and method of unified cooling solution in an IOT device
CN108235832B (zh) * 2017-03-09 2021-01-05 华为技术有限公司 一种消费电子产品的主板及终端

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339628A (en) * 1980-08-20 1982-07-13 Northern Telecom Limited RF Shielding support for stacked electrical circuit boards
TW212261B (en) * 1992-03-09 1993-09-01 Matsushita Electric Industrial Co Ltd Electronic circuit device and manufacturing method
JP2630241B2 (ja) * 1993-06-17 1997-07-16 日本電気株式会社 電子機器
JP2692619B2 (ja) * 1994-11-24 1997-12-17 日本電気株式会社 無線送受信装置
US5777856A (en) * 1996-08-06 1998-07-07 Motorola, Inc. Integrated shielding and mechanical support
JP2001111232A (ja) * 1999-10-06 2001-04-20 Sony Corp 電子部品実装多層基板及びその製造方法
US6385055B1 (en) * 2000-12-08 2002-05-07 Scientific-Atlanta, Inc. Hinged electrical shielding for communication device
JP4037810B2 (ja) * 2003-09-05 2008-01-23 Ｎｅｃアクセステクニカ株式会社 小型無線装置及びその実装方法
KR100617153B1 (ko) * 2004-08-25 2006-08-31 엘지전자 주식회사 이동통신 단말기
JP4844883B2 (ja) * 2006-07-20 2011-12-28 日本電気株式会社 電子機器及びプリント基板のｇｎｄ接続方法
CN201349392Y (zh) * 2008-12-05 2009-11-18 鸿富锦精密工业（深圳）有限公司 屏蔽装置及应用所述屏蔽装置的通信设备
US20100182765A1 (en) * 2009-01-21 2010-07-22 Delphi Technologies, Inc. Rf/emi shield

Also Published As

Publication number Publication date
EP2883432A4 (en) 2016-05-11
US20150201496A1 (en) 2015-07-16
WO2014023029A1 (en) 2014-02-13
CN104521338A (zh) 2015-04-15
EP2883432A1 (en) 2015-06-17

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