IN2014KN00897A - - Google Patents

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Publication number
IN2014KN00897A
IN2014KN00897A IN897KON2014A IN2014KN00897A IN 2014KN00897 A IN2014KN00897 A IN 2014KN00897A IN 897KON2014 A IN897KON2014 A IN 897KON2014A IN 2014KN00897 A IN2014KN00897 A IN 2014KN00897A
Authority
IN
India
Prior art keywords
group
formula
epoxy resin
polymerization initiator
cationic polymerization
Prior art date
Application number
Other languages
English (en)
Inventor
Shinya Yoshihisa
Yamamotojun
Aizaki Ryota
Hayashi Naoki
Konishi Misao
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of IN2014KN00897A publication Critical patent/IN2014KN00897A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
IN897KON2014 2007-06-15 2008-03-18 IN2014KN00897A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007158283A JP5190665B2 (ja) 2007-06-15 2007-06-15 エポキシ系樹脂組成物
PCT/JP2008/054924 WO2008152843A1 (fr) 2007-06-15 2008-03-18 Composition de résine époxy

Publications (1)

Publication Number Publication Date
IN2014KN00897A true IN2014KN00897A (fr) 2015-08-21

Family

ID=40129456

Family Applications (1)

Application Number Title Priority Date Filing Date
IN897KON2014 IN2014KN00897A (fr) 2007-06-15 2008-03-18

Country Status (8)

Country Link
US (1) US8431654B2 (fr)
EP (1) EP2161292B1 (fr)
JP (1) JP5190665B2 (fr)
KR (1) KR101167545B1 (fr)
CN (2) CN102633994B (fr)
IN (1) IN2014KN00897A (fr)
TW (1) TW200902582A (fr)
WO (1) WO2008152843A1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008303167A (ja) * 2007-06-07 2008-12-18 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体
JP4901889B2 (ja) * 2008-02-18 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 磁性シート組成物、磁性シート、及び磁性シートの製造方法
JP5444702B2 (ja) * 2008-12-05 2014-03-19 デクセリアルズ株式会社 新規なスルホニウムボレート錯体
JP4784698B1 (ja) * 2010-05-06 2011-10-05 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
WO2011155348A1 (fr) * 2010-06-09 2011-12-15 ソニーケミカル＆インフォメーションデバイス株式会社 Pâte électroconductrice anisotrope réfléchissante et dispositif électroluminescent
JP5707754B2 (ja) * 2010-07-12 2015-04-30 横浜ゴム株式会社 導電性組成物および太陽電池セル
WO2012042796A1 (fr) * 2010-09-29 2012-04-05 横浜ゴム株式会社 Initiateur de polymérisation cationique et composition de résine époxy thermodurcissable
JP5727316B2 (ja) * 2011-07-06 2015-06-03 積水化学工業株式会社 スルホニウム化合物の製造方法、並びにスルホニウムボレート錯体の製造方法
KR101391696B1 (ko) 2011-11-23 2014-05-07 제일모직주식회사 이방 전도성 조성물 및 필름
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
JP6251557B2 (ja) * 2013-12-05 2017-12-20 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート
JP2014131997A (ja) * 2013-12-26 2014-07-17 Dexerials Corp 新規なスルホニウムボレート錯体
KR101665171B1 (ko) * 2014-01-29 2016-10-11 제일모직주식회사 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
KR101706818B1 (ko) 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
JP6434748B2 (ja) * 2014-08-29 2018-12-05 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
KR101731677B1 (ko) 2014-08-29 2017-04-28 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
WO2016143474A1 (fr) * 2015-03-10 2016-09-15 横浜ゴム株式会社 Initiateur de polymérisation cationique et composition de résine époxyde
JP6776609B2 (ja) 2016-02-22 2020-10-28 デクセリアルズ株式会社 異方性導電フィルム
KR102363322B1 (ko) 2016-02-22 2022-02-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
JP7462408B2 (ja) 2019-12-13 2024-04-05 デクセリアルズ株式会社 接着剤組成物、接着フィルム及び接続構造体
JP7764146B2 (ja) 2021-06-03 2025-11-05 デクセリアルズ株式会社 接着剤組成物、接着フィルム、接続構造体および接続構造体の製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2797010B2 (ja) 1989-04-08 1998-09-17 三新化学工業株式会社 新規なスルホニウム化合物およびその製造方法
CA2014047A1 (fr) 1989-04-08 1990-10-08 Yoshinari Yamamoto Compose sulfonium et initiateur de polymerisation comportant ce compose comme ingredient principal
JP2797024B2 (ja) * 1989-10-13 1998-09-17 三新化学工業株式会社 スルホニウム化合物
JP2706833B2 (ja) * 1990-02-14 1998-01-28 三新化学工業株式会社 カチオン重合開始剤および重合性組成物
JPH05230189A (ja) * 1992-02-25 1993-09-07 Nippon Soda Co Ltd スルホニウム塩及び増感剤を含有する硬化性組成物
FR2727416A1 (fr) * 1994-11-24 1996-05-31 Rhone Poulenc Chimie Nouveaux amorceurs cationiques thermoactivables, de polymerisation et/ou de reticulation et compositions monomeres et/ou polymeres fonctionnels les mettant en oeuvre
JP3679438B2 (ja) * 1995-01-10 2005-08-03 三新化学工業株式会社 スルホニウム化合物の製造方法
JPH09179112A (ja) * 1995-12-21 1997-07-11 Citizen Watch Co Ltd 液晶表示装置
JP3937466B2 (ja) * 1995-12-28 2007-06-27 東洋インキ製造株式会社 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物および硬化性組成物
JPH10120766A (ja) * 1996-10-21 1998-05-12 Nippon Kayaku Co Ltd エネルギー線硬化性組成物及び物品
JPH10245378A (ja) 1997-02-28 1998-09-14 Nippon Kayaku Co Ltd 新規スルホニウム塩、それからなる光重合開始剤及びエネルギー線硬化性組成物
JP4215852B2 (ja) 1997-03-10 2009-01-28 株式会社日本触媒 テトラキス（フッ化アリール）ボレート誘導体の製造方法
JP4122085B2 (ja) * 1998-03-11 2008-07-23 三新化学工業株式会社 スルホニウム化合物の製造方法
JP2000191751A (ja) 1998-12-25 2000-07-11 Sumitomo Bakelite Co Ltd 紫外線硬化型樹脂組成物
JP2002097443A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物及びこれを用いた回路接続材料並びに接続体
EP1612623A4 (fr) 2003-04-09 2007-04-04 Konica Minolta Med & Graphic Support d'enregistrement holographique et procede d'enregistrement utilisant ce support
JP2005043862A (ja) * 2003-04-09 2005-02-17 Konica Minolta Medical & Graphic Inc ホログラフィック記録用組成物、ホログラフィック記録メディア及びその記録方法
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP2006282633A (ja) * 2005-04-04 2006-10-19 Sanshin Chem Ind Co Ltd スルホニウム化合物および重合組成物
JP5256570B2 (ja) * 2005-06-06 2013-08-07 東洋インキＳｃホールディングス株式会社 封止用組成物
JP2008303167A (ja) 2007-06-07 2008-12-18 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体

Also Published As

Publication number Publication date
CN102633994A (zh) 2012-08-15
JP2008308596A (ja) 2008-12-25
CN101778882B (zh) 2012-08-29
JP5190665B2 (ja) 2013-04-24
HK1170514A1 (en) 2013-03-01
WO2008152843A1 (fr) 2008-12-18
TW200902582A (en) 2009-01-16
TWI383002B (fr) 2013-01-21
US8431654B2 (en) 2013-04-30
CN102633994B (zh) 2015-06-17
EP2161292B1 (fr) 2012-06-20
EP2161292A4 (fr) 2010-09-22
US20100193228A1 (en) 2010-08-05
EP2161292A1 (fr) 2010-03-10
CN101778882A (zh) 2010-07-14
KR101167545B1 (ko) 2012-07-20
HK1142348A1 (en) 2010-12-03
KR20100029759A (ko) 2010-03-17

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