IN2015DN01149A - - Google Patents
Info
- Publication number
- IN2015DN01149A IN2015DN01149A IN1149DEN2015A IN2015DN01149A IN 2015DN01149 A IN2015DN01149 A IN 2015DN01149A IN 1149DEN2015 A IN1149DEN2015 A IN 1149DEN2015A IN 2015DN01149 A IN2015DN01149 A IN 2015DN01149A
- Authority
- IN
- India
- Prior art keywords
- electrode
- substrate
- energy source
- segmented
- bringing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000005334 plasma enhanced chemical vapour deposition Methods 0.000 abstract 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA877/2012A AT513190B9 (de) | 2012-08-08 | 2012-08-08 | Vorrichtung und Verfahren zur Plasmabeschichtung eines Substrats, insbesondere eines Pressblechs |
| PCT/AT2013/050152 WO2014022872A2 (fr) | 2012-08-08 | 2013-08-06 | Procédé et dispositif pour le revêtement au plasma d'un substrat, en particulier d'une tôle emboutie |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2015DN01149A true IN2015DN01149A (fr) | 2015-06-26 |
Family
ID=49584535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN1149DEN2015 IN2015DN01149A (fr) | 2012-08-08 | 2013-08-06 |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US9530624B2 (fr) |
| EP (1) | EP2882885B8 (fr) |
| JP (1) | JP6140286B2 (fr) |
| KR (1) | KR101742744B1 (fr) |
| CN (1) | CN104755653B (fr) |
| AT (1) | AT513190B9 (fr) |
| AU (1) | AU2013302202B2 (fr) |
| BR (1) | BR112015002657A8 (fr) |
| CA (1) | CA2881069C (fr) |
| CL (1) | CL2015000301A1 (fr) |
| DK (1) | DK2882885T3 (fr) |
| ES (1) | ES2587929T3 (fr) |
| IN (1) | IN2015DN01149A (fr) |
| MY (1) | MY176134A (fr) |
| NZ (1) | NZ704253A (fr) |
| PL (1) | PL2882885T3 (fr) |
| RU (1) | RU2615743C2 (fr) |
| WO (1) | WO2014022872A2 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017025389A (ja) * | 2015-07-24 | 2017-02-02 | 株式会社ユーテック | プラズマcvd装置及び成膜方法 |
| US11251019B2 (en) * | 2016-12-15 | 2022-02-15 | Toyota Jidosha Kabushiki Kaisha | Plasma device |
| CN107283551B (zh) * | 2017-08-21 | 2018-07-24 | 阜南盛原木业有限公司 | 一种具有良好防霉防虫性能的胶合板 |
| JP6863199B2 (ja) | 2017-09-25 | 2021-04-21 | トヨタ自動車株式会社 | プラズマ処理装置 |
| CN109055917B (zh) * | 2018-09-07 | 2020-09-08 | 信阳师范学院 | 一种单室双面镀膜等离子体化学气相沉积系统 |
| DE102019127659A1 (de) * | 2019-10-15 | 2021-04-15 | Hueck Rheinische Gmbh | Presswerkzeug und Verfahren zum Herstellen eines Presswerkzeugs |
| US11884426B2 (en) | 2020-07-08 | 2024-01-30 | Hamilton Sundstrand Corporation | Compression apparatus and methods of making and using the same |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3984043A (en) * | 1972-07-10 | 1976-10-05 | United Technologies Corporation | Method for bonding composite materials |
| NL8602357A (nl) * | 1985-10-07 | 1987-05-04 | Epsilon Ltd Partnership | Inrichting en werkwijze voor het chemisch uit damp neerslaan met gebruik van een axiaal symmetrische gasstroming. |
| US4885074A (en) | 1987-02-24 | 1989-12-05 | International Business Machines Corporation | Plasma reactor having segmented electrodes |
| US5156820A (en) * | 1989-05-15 | 1992-10-20 | Rapro Technology, Inc. | Reaction chamber with controlled radiant energy heating and distributed reactant flow |
| RU2176681C2 (ru) * | 1989-11-22 | 2001-12-10 | Волков Валерий Венедиктович | Способ получения покрытий в вакууме, устройство для получения покрытий в вакууме, способ изготовления устройства для получения покрытий в вакууме |
| JP2901317B2 (ja) | 1990-07-02 | 1999-06-07 | 株式会社日立製作所 | スパッタ装置及びそれを用いた成膜方法 |
| US5244375A (en) | 1991-12-19 | 1993-09-14 | Formica Technology, Inc. | Plasma ion nitrided stainless steel press plates and applications for same |
| DE4202425C2 (de) | 1992-01-29 | 1997-07-17 | Leybold Ag | Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
| US5273588A (en) * | 1992-06-15 | 1993-12-28 | Materials Research Corporation | Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means |
| DE4443608C1 (de) * | 1994-12-07 | 1996-03-21 | Siemens Ag | Plasmareaktor und Verfahren zu dessen Betrieb |
| DE19757141A1 (de) * | 1997-12-20 | 1999-06-24 | Philips Patentverwaltung | Array aus Diamant/wasserstoffhaltigen Elektroden |
| US6190514B1 (en) * | 1997-12-30 | 2001-02-20 | Premark Rwp Holdings, Inc. | Method for high scan sputter coating to produce coated, abrasion resistant press plates with reduced built-in thermal stress |
| JP3595853B2 (ja) * | 1999-03-18 | 2004-12-02 | 日本エー・エス・エム株式会社 | プラズマcvd成膜装置 |
| WO2001073814A2 (fr) * | 2000-03-28 | 2001-10-04 | Tokyo Electron Limited | Procede et appareil de commande de puissance fournie a une electrode a multiples segments |
| US20020155957A1 (en) * | 2001-02-14 | 2002-10-24 | Danly, James C. | Sintered anti-friction bearing surface |
| US6741446B2 (en) * | 2001-03-30 | 2004-05-25 | Lam Research Corporation | Vacuum plasma processor and method of operating same |
| DE20113503U1 (de) * | 2001-08-14 | 2002-01-17 | Espe, Oliver, 44799 Bochum | Presswerkzeug mit hochabriebfester Oberfläche |
| US7217471B2 (en) * | 2002-05-17 | 2007-05-15 | 3M Innovative Properties Company | Membrane electrode assembly with compression control gasket |
| DE10337117A1 (de) * | 2003-08-11 | 2005-03-17 | Dieffenbacher Gmbh + Co. Kg | Verfahren und Ein- oder Mehretagenpresse zur Herstellung von Holzwerkstoffplatten, insbesondere OSB-Platten |
| TWI283651B (en) * | 2004-04-23 | 2007-07-11 | Bobst Sa | Device for transferring a foil matter from outside to inside of a machine |
| RU2285742C2 (ru) * | 2004-07-27 | 2006-10-20 | Евгений Владимирович Берлин | Способ нанесения металлического покрытия на диэлектрическую подложку и устройство для его осуществления |
| WO2006091245A2 (fr) * | 2004-10-22 | 2006-08-31 | Dow Global Technologies Inc. | Articles composites en plastique et leurs procedes de production |
| JP4704088B2 (ja) * | 2005-03-31 | 2011-06-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US20070042131A1 (en) * | 2005-08-22 | 2007-02-22 | Applied Materials, Inc., A Delaware Corporation | Non-intrusive plasma monitoring system for arc detection and prevention for blanket CVD films |
| JP5085549B2 (ja) * | 2005-09-22 | 2012-11-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 誘電泳動に基づく2次元アダプティブ加速度計 |
| DK2115069T3 (da) * | 2007-02-08 | 2021-03-29 | Huntsman Adv Mat Licensing Switzerland Gmbh | Varmehærdende sammensætning |
| KR101297711B1 (ko) | 2007-02-09 | 2013-08-20 | 한국과학기술원 | 플라즈마 처리장치 및 플라즈마 처리방법 |
| JP4707693B2 (ja) * | 2007-05-01 | 2011-06-22 | 株式会社アルバック | スパッタリング装置及びスパッタリング方法 |
| JP5429771B2 (ja) * | 2008-05-26 | 2014-02-26 | 株式会社アルバック | スパッタリング方法 |
| US20100252744A1 (en) * | 2009-04-06 | 2010-10-07 | Koninklijke Philips Electronics N.V. | Radiation detector with a plurality of electrode systems |
| US8433401B2 (en) * | 2009-07-09 | 2013-04-30 | Incube Labs, Llc | Ring electrode assembly and applications thereof |
| JP2013500595A (ja) | 2009-07-26 | 2013-01-07 | ライボルト オプティクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | プロセスチャンバのクリーニング |
| JP5496073B2 (ja) * | 2010-12-21 | 2014-05-21 | 三菱電機株式会社 | 微結晶半導体薄膜製造装置および微結晶半導体薄膜製造方法 |
| US20120247543A1 (en) * | 2011-03-31 | 2012-10-04 | Integrated Photovoltaic, Inc. | Photovoltaic Structure |
-
2012
- 2012-08-08 AT ATA877/2012A patent/AT513190B9/de not_active IP Right Cessation
-
2013
- 2013-08-06 CA CA2881069A patent/CA2881069C/fr not_active Expired - Fee Related
- 2013-08-06 US US14/420,194 patent/US9530624B2/en not_active Expired - Fee Related
- 2013-08-06 BR BR112015002657A patent/BR112015002657A8/pt not_active IP Right Cessation
- 2013-08-06 CN CN201380042267.0A patent/CN104755653B/zh not_active Expired - Fee Related
- 2013-08-06 IN IN1149DEN2015 patent/IN2015DN01149A/en unknown
- 2013-08-06 KR KR1020157006106A patent/KR101742744B1/ko not_active Expired - Fee Related
- 2013-08-06 EP EP13791714.2A patent/EP2882885B8/fr not_active Not-in-force
- 2013-08-06 DK DK13791714.2T patent/DK2882885T3/en active
- 2013-08-06 AU AU2013302202A patent/AU2013302202B2/en not_active Ceased
- 2013-08-06 RU RU2015107784A patent/RU2615743C2/ru not_active IP Right Cessation
- 2013-08-06 WO PCT/AT2013/050152 patent/WO2014022872A2/fr not_active Ceased
- 2013-08-06 PL PL13791714.2T patent/PL2882885T3/pl unknown
- 2013-08-06 MY MYPI2015700347A patent/MY176134A/en unknown
- 2013-08-06 NZ NZ704253A patent/NZ704253A/en not_active IP Right Cessation
- 2013-08-06 JP JP2015525690A patent/JP6140286B2/ja not_active Expired - Fee Related
- 2013-08-06 ES ES13791714.2T patent/ES2587929T3/es active Active
-
2015
- 2015-02-06 CL CL2015000301A patent/CL2015000301A1/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BR112015002657A8 (pt) | 2019-07-30 |
| KR20150042817A (ko) | 2015-04-21 |
| RU2615743C2 (ru) | 2017-04-11 |
| US20150255254A1 (en) | 2015-09-10 |
| AU2013302202B2 (en) | 2015-12-03 |
| MY176134A (en) | 2020-07-24 |
| EP2882885A2 (fr) | 2015-06-17 |
| BR112015002657A2 (pt) | 2017-07-04 |
| CN104755653B (zh) | 2017-09-19 |
| PL2882885T3 (pl) | 2016-11-30 |
| WO2014022872A2 (fr) | 2014-02-13 |
| CA2881069C (fr) | 2017-11-07 |
| NZ704253A (en) | 2016-08-26 |
| ES2587929T3 (es) | 2016-10-27 |
| AT513190B1 (de) | 2014-03-15 |
| AT513190B9 (de) | 2014-05-15 |
| WO2014022872A3 (fr) | 2014-05-15 |
| EP2882885B8 (fr) | 2016-08-31 |
| AT513190A1 (de) | 2014-02-15 |
| US9530624B2 (en) | 2016-12-27 |
| KR101742744B1 (ko) | 2017-06-01 |
| EP2882885B1 (fr) | 2016-05-25 |
| AU2013302202A1 (en) | 2015-02-26 |
| RU2015107784A (ru) | 2016-09-27 |
| JP6140286B2 (ja) | 2017-05-31 |
| JP2015531820A (ja) | 2015-11-05 |
| CN104755653A (zh) | 2015-07-01 |
| DK2882885T3 (en) | 2016-09-05 |
| CA2881069A1 (fr) | 2014-02-13 |
| CL2015000301A1 (es) | 2015-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IN2015DN01149A (fr) | ||
| SG196762A1 (en) | High pressure, high power plasma activated conformal film deposition | |
| MY183557A (en) | Plasma cvd device and plasma cvd method | |
| WO2014158253A3 (fr) | Couche de structure sandwich thermiquement traitée pour amélioration de la résistance d'adhérence | |
| WO2014110446A3 (fr) | Procédé et système de formation de graphène | |
| SG10201402882PA (en) | Chamber wall of a plasma processing apparatus including a flowing protective liquid layer | |
| TW201614097A (en) | Improved defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas | |
| WO2012087737A3 (fr) | Traitement au plasma de densité variable de substrats semi-conducteurs | |
| IN2015DN03311A (fr) | ||
| WO2009104918A3 (fr) | Appareil et procédé pour traitement de substrat | |
| IN2014DN03041A (fr) | ||
| JP2012124168A5 (fr) | ||
| WO2010151057A3 (fr) | Dépôt par plasma d'un film mince | |
| TW200802549A (en) | Vertical plasma processing apparatus for semiconductor process | |
| WO2013022306A3 (fr) | Appareil de génération de plasma, procédé de fabrication d'électrodes rotatives pour appareil de génération de plasma, procédé de traitement par plasma de substrat, et procédé permettant de former une couche mince de structure mélangée au moyen de plasma | |
| WO2009134588A3 (fr) | Plaque frontale non plane pour chambre de traitement par plasma | |
| SG195296A1 (en) | Use of spectrum to synchronize rf switching with gas switching during etch | |
| WO2014011270A3 (fr) | Système et procédé produisant un fonctionnement de décharge à arc sous vide partiel pour chauffage contrôlé | |
| WO2013130046A3 (fr) | Pistolet à plasma en cascade étendu | |
| WO2009104919A3 (fr) | Appareil et procédé pour traitement de substrat | |
| WO2012087919A3 (fr) | Procédés et appareil pour distribution de gaz dans des chambres de traitement à plasma | |
| MY185232A (en) | Controlled radical assisted polymerization | |
| TW201129712A (en) | Plasma processing apparatus | |
| WO2009104917A3 (fr) | Appareil et procédé pour traitement de substrat | |
| MX352535B (es) | Aparato para el tratamiento por plasma de superficies y metodo para el tratamiento de superficies con plasma. |