IN2015DN04192A - - Google Patents

Info

Publication number
IN2015DN04192A
IN2015DN04192A IN4192DEN2015A IN2015DN04192A IN 2015DN04192 A IN2015DN04192 A IN 2015DN04192A IN 4192DEN2015 A IN4192DEN2015 A IN 4192DEN2015A IN 2015DN04192 A IN2015DN04192 A IN 2015DN04192A
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Satoshi Suzuki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of IN2015DN04192A publication Critical patent/IN2015DN04192A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H10F39/80373Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the gate of the transistor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/616Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/67Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
    • H04N25/671Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction
    • H04N25/677Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction for reducing the column or line fixed pattern noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/15Charge-coupled device [CCD] image sensors
    • H10F39/151Geometry or disposition of pixel elements, address lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8023Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
IN4192DEN2015 2012-10-19 2015-05-15 IN2015DN04192A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012232422 2012-10-19
PCT/JP2013/078483 WO2014061820A1 (ja) 2012-10-19 2013-10-21 固体撮像素子

Publications (1)

Publication Number Publication Date
IN2015DN04192A true IN2015DN04192A (de) 2015-10-16

Family

ID=50488372

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4192DEN2015 IN2015DN04192A (de) 2012-10-19 2015-05-15

Country Status (7)

Country Link
US (3) US9620558B2 (de)
EP (1) EP2911203B1 (de)
JP (3) JP6135677B2 (de)
KR (1) KR102125673B1 (de)
CN (3) CN108551558B (de)
IN (1) IN2015DN04192A (de)
WO (1) WO2014061820A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9620558B2 (en) * 2012-10-19 2017-04-11 Nikon Corporation Solid-state image sensor
CN106537897B (zh) * 2014-07-09 2020-01-24 瑞萨电子株式会社 半导体器件
JP6704677B2 (ja) * 2015-03-31 2020-06-03 キヤノン株式会社 固体撮像装置
TWI701819B (zh) * 2015-06-09 2020-08-11 日商索尼半導體解決方案公司 攝像元件、驅動方法及電子機器
EP3358831B1 (de) * 2015-09-30 2023-12-20 Nikon Corporation Bildaufnahmeelement und elektronische kamera
KR102437162B1 (ko) * 2015-10-12 2022-08-29 삼성전자주식회사 이미지 센서
JP7005125B2 (ja) * 2016-04-22 2022-01-21 キヤノン株式会社 撮像素子、撮像システム、および撮像素子の製造方法
JP6889571B2 (ja) 2017-02-24 2021-06-18 キヤノン株式会社 撮像装置および撮像システム
CN110463190B (zh) 2017-03-30 2022-01-11 株式会社尼康 摄像元件、焦点调节装置及摄像装置
US10593714B2 (en) * 2017-07-24 2020-03-17 Panasonic Intellectual Property Management Co., Ltd. Imaging device
DE102022125838A1 (de) * 2022-10-06 2024-04-11 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Bildsensor

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1458028B1 (de) * 1999-12-02 2011-05-11 Nikon Corporation Festkörperbildsensor und dessen Herstellungsverfahren
JP2002314062A (ja) * 2001-04-18 2002-10-25 Canon Inc 固体撮像装置および撮像システム
US7145122B2 (en) * 2004-06-14 2006-12-05 Omnivision Technologies, Inc. Imaging sensor using asymmetric transfer transistor
JP4826127B2 (ja) * 2005-04-25 2011-11-30 ソニー株式会社 固体撮像装置及びその製造方法
KR100690912B1 (ko) * 2005-08-12 2007-03-09 삼성전자주식회사 전하 전송 특성이 향상된 4 공유 픽셀형 이미지 센서
JP5034215B2 (ja) * 2005-11-02 2012-09-26 株式会社ニコン 焦点検出用信号の生成機能を有する固体撮像装置
JP2007127756A (ja) * 2005-11-02 2007-05-24 Nikon Corp 像振れ補正装置、光学装置、交換レンズ、及びカメラシステム
JP4710660B2 (ja) * 2006-03-10 2011-06-29 株式会社ニコン 固体撮像素子及びこれを用いた電子カメラ
JP4952060B2 (ja) 2006-05-26 2012-06-13 株式会社ニコン 撮像装置
JP5076528B2 (ja) * 2007-02-06 2012-11-21 株式会社ニコン 光電変換部の連結/分離構造、固体撮像素子及び撮像装置
JP2008270298A (ja) * 2007-04-16 2008-11-06 Nikon Corp 固体撮像素子及びこれを用いた撮像装置
JP2009289927A (ja) * 2008-05-28 2009-12-10 Panasonic Corp 固体撮像装置及びその製造方法
JP5629995B2 (ja) * 2009-09-07 2014-11-26 株式会社ニコン 撮像素子および撮像装置
JP5651976B2 (ja) * 2010-03-26 2015-01-14 ソニー株式会社 固体撮像素子およびその製造方法、並びに電子機器
JP2011221253A (ja) 2010-04-08 2011-11-04 Sony Corp 撮像装置、固体撮像素子、撮像方法およびプログラム
JP5126291B2 (ja) * 2010-06-07 2013-01-23 株式会社ニコン 固体撮像素子
US8742309B2 (en) * 2011-01-28 2014-06-03 Aptina Imaging Corporation Imagers with depth sensing capabilities
US9620558B2 (en) * 2012-10-19 2017-04-11 Nikon Corporation Solid-state image sensor
KR102009192B1 (ko) * 2013-02-05 2019-08-09 삼성전자주식회사 이미지 센서의 단위 픽셀 및 이를 포함하는 이미지 센서

Also Published As

Publication number Publication date
JP2017135422A (ja) 2017-08-03
EP2911203A1 (de) 2015-08-26
US10580810B2 (en) 2020-03-03
JP6421836B2 (ja) 2018-11-14
EP2911203B1 (de) 2020-07-08
CN104871315B (zh) 2018-07-13
EP2911203A4 (de) 2016-09-14
US20170179175A1 (en) 2017-06-22
KR102125673B1 (ko) 2020-06-23
CN108551559A (zh) 2018-09-18
CN108551558A (zh) 2018-09-18
JPWO2014061820A1 (ja) 2016-09-05
US20180308885A1 (en) 2018-10-25
JP2018207121A (ja) 2018-12-27
JP7012619B2 (ja) 2022-01-28
CN104871315A (zh) 2015-08-26
KR20150070376A (ko) 2015-06-24
CN108551559B (zh) 2021-06-22
JP6135677B2 (ja) 2017-05-31
US20160111469A1 (en) 2016-04-21
US10038020B2 (en) 2018-07-31
US9620558B2 (en) 2017-04-11
WO2014061820A1 (ja) 2014-04-24
CN108551558B (zh) 2021-03-09

Similar Documents

Publication Publication Date Title
BR112014017635A2 (de)
BR112014017625A2 (de)
BR112014017659A2 (de)
BR112014017592A2 (de)
BR112014017646A2 (de)
BR112014019393A2 (de)
BR112014017638A2 (de)
BR112013027865A2 (de)
BR112014017644A2 (de)
BR112014017634A2 (de)
BR112014025881A2 (de)
BR112014017949A2 (de)
BR112014017588A2 (de)
BR112014017647A2 (de)
BR112014013184A8 (de)
BR112014017627A2 (de)
BR112014017623A2 (de)
BR112014017652A2 (de)
BR112014017630A2 (de)
BR112014017631A2 (de)
BR112014017641A2 (de)
IN2015DN04192A (de)
BR112014019802A2 (de)
BR112014017671A2 (de)
BR112014017589A2 (de)