IT1022912B - Procedimento per fabbricare un dispositivo a semiconduttori - Google Patents
Procedimento per fabbricare un dispositivo a semiconduttoriInfo
- Publication number
- IT1022912B IT1022912B IT28472/74A IT2847274A IT1022912B IT 1022912 B IT1022912 B IT 1022912B IT 28472/74 A IT28472/74 A IT 28472/74A IT 2847274 A IT2847274 A IT 2847274A IT 1022912 B IT1022912 B IT 1022912B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/928—Front and rear surface processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/951—Lift-off
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19732352138 DE2352138A1 (de) | 1973-10-17 | 1973-10-17 | Verfahren zum herstellen einer halbleiteranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1022912B true IT1022912B (it) | 1978-04-20 |
Family
ID=5895702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT28472/74A IT1022912B (it) | 1973-10-17 | 1974-10-16 | Procedimento per fabbricare un dispositivo a semiconduttori |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3984588A (it) |
| JP (1) | JPS5080084A (it) |
| CA (1) | CA1021469A (it) |
| DE (1) | DE2352138A1 (it) |
| FR (1) | FR2248614B1 (it) |
| GB (1) | GB1447843A (it) |
| IT (1) | IT1022912B (it) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3837826A1 (de) * | 1988-11-08 | 1990-05-10 | Nokia Unterhaltungselektronik | Verfahren zum beschichten einer substratplatte fuer eine fluessigkristallzelle |
| US5772104A (en) * | 1996-08-26 | 1998-06-30 | Peerless Of America Incorporated | Methods of brazing and preparing articles for brazing, and coating composition for use in such methods |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3020156A (en) * | 1957-05-10 | 1962-02-06 | Mycalex Corp Of America | Method of coating metal on dielectric material |
| US3222173A (en) * | 1961-05-15 | 1965-12-07 | Vitramon Inc | Method of making an electrical unit |
| US3443944A (en) * | 1963-10-23 | 1969-05-13 | United Aircraft Corp | Method of depositing conductive patterns on a substrate |
| US3518751A (en) * | 1967-05-25 | 1970-07-07 | Hughes Aircraft Co | Electrical connection and/or mounting arrays for integrated circuit chips |
| US3775117A (en) * | 1971-07-13 | 1973-11-27 | Siemens Ag | Process for selective metallization of insulating material bodies |
| GB1384028A (en) * | 1972-08-21 | 1974-02-12 | Hughes Aircraft Co | Method of making a semiconductor device |
| US3936531A (en) * | 1973-05-01 | 1976-02-03 | Union Carbide Corporation | Masking process with thermal destruction of edges of mask |
-
1973
- 1973-10-17 DE DE19732352138 patent/DE2352138A1/de active Pending
-
1974
- 1974-10-03 GB GB4287974A patent/GB1447843A/en not_active Expired
- 1974-10-10 FR FR7434080A patent/FR2248614B1/fr not_active Expired
- 1974-10-16 IT IT28472/74A patent/IT1022912B/it active
- 1974-10-16 CA CA211,481A patent/CA1021469A/en not_active Expired
- 1974-10-17 JP JP49119854A patent/JPS5080084A/ja active Pending
- 1974-10-17 US US05/515,604 patent/US3984588A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| FR2248614B1 (it) | 1978-11-24 |
| JPS5080084A (it) | 1975-06-28 |
| FR2248614A1 (it) | 1975-05-16 |
| CA1021469A (en) | 1977-11-22 |
| GB1447843A (en) | 1976-09-02 |
| DE2352138A1 (de) | 1975-04-30 |
| US3984588A (en) | 1976-10-05 |
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