IT1038208B - Metodo per applicare un filo di connessione ad un dispositivo semiconduttore - Google Patents

Metodo per applicare un filo di connessione ad un dispositivo semiconduttore

Info

Publication number
IT1038208B
IT1038208B IT2343475A IT2343475A IT1038208B IT 1038208 B IT1038208 B IT 1038208B IT 2343475 A IT2343475 A IT 2343475A IT 2343475 A IT2343475 A IT 2343475A IT 1038208 B IT1038208 B IT 1038208B
Authority
IT
Italy
Prior art keywords
welding
wire
ball
tool
discharge
Prior art date
Application number
IT2343475A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT1038208B publication Critical patent/IT1038208B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
IT2343475A 1974-05-21 1975-05-16 Metodo per applicare un filo di connessione ad un dispositivo semiconduttore IT1038208B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7406783A NL7406783A (nl) 1974-05-21 1974-05-21 Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.

Publications (1)

Publication Number Publication Date
IT1038208B true IT1038208B (it) 1979-11-20

Family

ID=19821385

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2343475A IT1038208B (it) 1974-05-21 1975-05-16 Metodo per applicare un filo di connessione ad un dispositivo semiconduttore

Country Status (7)

Country Link
JP (1) JPS5118477A (it)
DE (1) DE2522022C3 (it)
FR (1) FR2272491B1 (it)
GB (1) GB1502965A (it)
HK (1) HK1079A (it)
IT (1) IT1038208B (it)
NL (1) NL7406783A (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
NL8005922A (nl) * 1980-10-29 1982-05-17 Philips Nv Werkwijze voor het vormen van een draadverbinding.
AU569998B2 (en) * 1981-03-27 1988-03-03 Dow Chemical Company, The Process for preparation of diene styrene alpha- methylstyrene block polymers
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
CH673908A5 (it) * 1987-05-26 1990-04-12 Vyacheslav Gennadievich Sizov
JPH0614322U (ja) * 1992-07-28 1994-02-22 東洋化学株式会社 合成樹脂製軒樋継手

Also Published As

Publication number Publication date
FR2272491A1 (it) 1975-12-19
HK1079A (en) 1979-01-12
NL7406783A (nl) 1975-11-25
JPS5118477A (en) 1976-02-14
DE2522022B2 (de) 1979-05-17
FR2272491B1 (it) 1978-10-27
JPS5310427B2 (it) 1978-04-13
DE2522022C3 (de) 1980-01-10
GB1502965A (en) 1978-03-08
DE2522022A1 (de) 1975-12-11

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