IT1052833B - Dispositivo di raffreddamento per componenti a forte dissipazione termica - Google Patents
Dispositivo di raffreddamento per componenti a forte dissipazione termicaInfo
- Publication number
- IT1052833B IT1052833B IT52689/75A IT5268975A IT1052833B IT 1052833 B IT1052833 B IT 1052833B IT 52689/75 A IT52689/75 A IT 52689/75A IT 5268975 A IT5268975 A IT 5268975A IT 1052833 B IT1052833 B IT 1052833B
- Authority
- IT
- Italy
- Prior art keywords
- cooling device
- thermal dissipation
- strong thermal
- dissipation components
- components
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/083—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Measuring And Other Instruments (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7441523A FR2295571A2 (fr) | 1973-04-03 | 1974-12-17 | Dispositif de refroidissement pour composants a forte dissipation thermique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1052833B true IT1052833B (it) | 1981-07-20 |
Family
ID=9146261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT52689/75A IT1052833B (it) | 1974-12-17 | 1975-12-15 | Dispositivo di raffreddamento per componenti a forte dissipazione termica |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4029141A (it) |
| JP (1) | JPS5185675A (it) |
| GB (1) | GB1518138A (it) |
| IT (1) | IT1052833B (it) |
| SE (1) | SE7514225L (it) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
| US4559580A (en) * | 1983-11-04 | 1985-12-17 | Sundstrand Corporation | Semiconductor package with internal heat exchanger |
| US4720981A (en) * | 1986-12-23 | 1988-01-26 | American Standard Inc. | Cooling of air conditioning control electronics |
| US5043797A (en) * | 1990-04-03 | 1991-08-27 | General Electric Company | Cooling header connection for a thyristor stack |
| FR2725684A1 (fr) * | 1994-10-18 | 1996-04-19 | Thomson Csf | Bouee aeroportee largable |
| FR2744870B1 (fr) * | 1996-02-13 | 1998-03-06 | Thomson Csf | Procede pour controler la navigation d'une antenne acoustique lineaire remorquee, et dispositifs pour la mise en oeuvre d'un tel procede |
| US5920457A (en) * | 1996-09-25 | 1999-07-06 | International Business Machines Corporation | Apparatus for cooling electronic devices using a flexible coolant conduit |
| US6152213A (en) * | 1997-03-27 | 2000-11-28 | Fujitsu Limited | Cooling system for electronic packages |
| FR2764160B1 (fr) * | 1997-05-27 | 1999-08-27 | Thomson Marconi Sonar Sas | Transducteur electrodynamique pour acoustique sous-marine |
| FR2776161B1 (fr) | 1998-03-10 | 2000-05-26 | Thomson Marconi Sonar Sas | Antenne d'emission acoustique annulaire demontable |
| US5940273A (en) * | 1998-06-08 | 1999-08-17 | Inductotherm Corp. | Semiconductor clamping device |
| US6188575B1 (en) * | 1998-06-30 | 2001-02-13 | Intersil Corporation | Heat exchanging chassis and method |
| DE19830424A1 (de) * | 1998-07-08 | 2000-01-13 | Asea Brown Boveri | Formteil zur Halterung von Kühlkörpern in einem Spannstapel |
| US6081427A (en) * | 1999-09-30 | 2000-06-27 | Rockwell Technologies, Llc | Retainer for press-pack semi-conductor device |
| FR2809580B1 (fr) | 2000-05-26 | 2002-08-30 | Thomson Marconi Sonar Sas | Transducteur electrodynamique pour acoustique sous-marine |
| US6532154B2 (en) | 2001-01-09 | 2003-03-11 | Rockwell Automation Technologies, Inc. | Stack assembly housing |
| US6980450B2 (en) * | 2002-01-24 | 2005-12-27 | Inverters Unlimited, Inc. | High power density inverter and components thereof |
| US20100038774A1 (en) * | 2008-08-18 | 2010-02-18 | General Electric Company | Advanced and integrated cooling for press-packages |
| US8120915B2 (en) * | 2008-08-18 | 2012-02-21 | General Electric Company | Integral heat sink with spiral manifolds |
| US7817422B2 (en) * | 2008-08-18 | 2010-10-19 | General Electric Company | Heat sink and cooling and packaging stack for press-packages |
| US8218320B2 (en) | 2010-06-29 | 2012-07-10 | General Electric Company | Heat sinks with C-shaped manifolds and millichannel cooling |
| CN109119219B (zh) * | 2017-06-26 | 2020-07-31 | 株洲变流技术国家工程研究中心有限公司 | 一种大功率水冷电阻 |
| CN114597181A (zh) * | 2020-12-07 | 2022-06-07 | 株洲中车时代半导体有限公司 | 一种液冷散热器 |
| US11488927B2 (en) | 2021-02-18 | 2022-11-01 | Abb Schweiz Ag | Press-pack semiconductor fixtures |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3523215A (en) * | 1968-03-19 | 1970-08-04 | Westinghouse Electric Corp | Stack module for flat package semiconductor device assemblies |
| US3768548A (en) * | 1972-03-02 | 1973-10-30 | Motor Co | Cooling apparatus for semiconductor devices |
-
1975
- 1975-12-15 GB GB51361/75A patent/GB1518138A/en not_active Expired
- 1975-12-15 IT IT52689/75A patent/IT1052833B/it active
- 1975-12-15 US US05/640,912 patent/US4029141A/en not_active Expired - Lifetime
- 1975-12-16 SE SE7514225A patent/SE7514225L/xx unknown
- 1975-12-17 JP JP50149650A patent/JPS5185675A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| SE7514225L (sv) | 1976-06-18 |
| JPS5185675A (it) | 1976-07-27 |
| GB1518138A (en) | 1978-07-19 |
| US4029141A (en) | 1977-06-14 |
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