IT1052833B - Dispositivo di raffreddamento per componenti a forte dissipazione termica - Google Patents

Dispositivo di raffreddamento per componenti a forte dissipazione termica

Info

Publication number
IT1052833B
IT1052833B IT52689/75A IT5268975A IT1052833B IT 1052833 B IT1052833 B IT 1052833B IT 52689/75 A IT52689/75 A IT 52689/75A IT 5268975 A IT5268975 A IT 5268975A IT 1052833 B IT1052833 B IT 1052833B
Authority
IT
Italy
Prior art keywords
cooling device
thermal dissipation
strong thermal
dissipation components
components
Prior art date
Application number
IT52689/75A
Other languages
English (en)
Original Assignee
Thomson Csf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR7441523A external-priority patent/FR2295571A2/fr
Application filed by Thomson Csf filed Critical Thomson Csf
Application granted granted Critical
Publication of IT1052833B publication Critical patent/IT1052833B/it

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/083Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611Bolts or screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
IT52689/75A 1974-12-17 1975-12-15 Dispositivo di raffreddamento per componenti a forte dissipazione termica IT1052833B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7441523A FR2295571A2 (fr) 1973-04-03 1974-12-17 Dispositif de refroidissement pour composants a forte dissipation thermique

Publications (1)

Publication Number Publication Date
IT1052833B true IT1052833B (it) 1981-07-20

Family

ID=9146261

Family Applications (1)

Application Number Title Priority Date Filing Date
IT52689/75A IT1052833B (it) 1974-12-17 1975-12-15 Dispositivo di raffreddamento per componenti a forte dissipazione termica

Country Status (5)

Country Link
US (1) US4029141A (it)
JP (1) JPS5185675A (it)
GB (1) GB1518138A (it)
IT (1) IT1052833B (it)
SE (1) SE7514225L (it)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4720981A (en) * 1986-12-23 1988-01-26 American Standard Inc. Cooling of air conditioning control electronics
US5043797A (en) * 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
FR2725684A1 (fr) * 1994-10-18 1996-04-19 Thomson Csf Bouee aeroportee largable
FR2744870B1 (fr) * 1996-02-13 1998-03-06 Thomson Csf Procede pour controler la navigation d'une antenne acoustique lineaire remorquee, et dispositifs pour la mise en oeuvre d'un tel procede
US5920457A (en) * 1996-09-25 1999-07-06 International Business Machines Corporation Apparatus for cooling electronic devices using a flexible coolant conduit
US6152213A (en) * 1997-03-27 2000-11-28 Fujitsu Limited Cooling system for electronic packages
FR2764160B1 (fr) * 1997-05-27 1999-08-27 Thomson Marconi Sonar Sas Transducteur electrodynamique pour acoustique sous-marine
FR2776161B1 (fr) 1998-03-10 2000-05-26 Thomson Marconi Sonar Sas Antenne d'emission acoustique annulaire demontable
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
US6188575B1 (en) * 1998-06-30 2001-02-13 Intersil Corporation Heat exchanging chassis and method
DE19830424A1 (de) * 1998-07-08 2000-01-13 Asea Brown Boveri Formteil zur Halterung von Kühlkörpern in einem Spannstapel
US6081427A (en) * 1999-09-30 2000-06-27 Rockwell Technologies, Llc Retainer for press-pack semi-conductor device
FR2809580B1 (fr) 2000-05-26 2002-08-30 Thomson Marconi Sonar Sas Transducteur electrodynamique pour acoustique sous-marine
US6532154B2 (en) 2001-01-09 2003-03-11 Rockwell Automation Technologies, Inc. Stack assembly housing
US6980450B2 (en) * 2002-01-24 2005-12-27 Inverters Unlimited, Inc. High power density inverter and components thereof
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
CN109119219B (zh) * 2017-06-26 2020-07-31 株洲变流技术国家工程研究中心有限公司 一种大功率水冷电阻
CN114597181A (zh) * 2020-12-07 2022-06-07 株洲中车时代半导体有限公司 一种液冷散热器
US11488927B2 (en) 2021-02-18 2022-11-01 Abb Schweiz Ag Press-pack semiconductor fixtures

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3523215A (en) * 1968-03-19 1970-08-04 Westinghouse Electric Corp Stack module for flat package semiconductor device assemblies
US3768548A (en) * 1972-03-02 1973-10-30 Motor Co Cooling apparatus for semiconductor devices

Also Published As

Publication number Publication date
SE7514225L (sv) 1976-06-18
JPS5185675A (it) 1976-07-27
GB1518138A (en) 1978-07-19
US4029141A (en) 1977-06-14

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