IT1059950B - Composizione per la ramatura anelettrica autocatalitica - Google Patents
Composizione per la ramatura anelettrica autocataliticaInfo
- Publication number
- IT1059950B IT1059950B IT6805176A IT6805176A IT1059950B IT 1059950 B IT1059950 B IT 1059950B IT 6805176 A IT6805176 A IT 6805176A IT 6805176 A IT6805176 A IT 6805176A IT 1059950 B IT1059950 B IT 1059950B
- Authority
- IT
- Italy
- Prior art keywords
- anelectric
- coppering
- autocatalytic
- composition
- autocatalytic anelectric
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT6805176A IT1059950B (it) | 1976-04-30 | 1976-04-30 | Composizione per la ramatura anelettrica autocatalitica |
| DE19762656617 DE2656617A1 (de) | 1976-04-30 | 1976-12-14 | Mittel zum stromlosen autokatalytischen verkupfern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT6805176A IT1059950B (it) | 1976-04-30 | 1976-04-30 | Composizione per la ramatura anelettrica autocatalitica |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1059950B true IT1059950B (it) | 1982-06-21 |
Family
ID=11307476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT6805176A IT1059950B (it) | 1976-04-30 | 1976-04-30 | Composizione per la ramatura anelettrica autocatalitica |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE2656617A1 (it) |
| IT (1) | IT1059950B (it) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1135903A (en) * | 1978-09-13 | 1982-11-23 | John F. Mccormack | Electroless copper deposition process having faster plating rates |
| JP4482744B2 (ja) * | 2001-02-23 | 2010-06-16 | 株式会社日立製作所 | 無電解銅めっき液、無電解銅めっき方法、配線板の製造方法 |
-
1976
- 1976-04-30 IT IT6805176A patent/IT1059950B/it active
- 1976-12-14 DE DE19762656617 patent/DE2656617A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE2656617A1 (de) | 1977-11-10 |
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