IT1083481B - Procedimento per attaccare con mastice piastrine di semiconduttori - Google Patents

Procedimento per attaccare con mastice piastrine di semiconduttori

Info

Publication number
IT1083481B
IT1083481B IT48216/77A IT4821677A IT1083481B IT 1083481 B IT1083481 B IT 1083481B IT 48216/77 A IT48216/77 A IT 48216/77A IT 4821677 A IT4821677 A IT 4821677A IT 1083481 B IT1083481 B IT 1083481B
Authority
IT
Italy
Prior art keywords
mastic
procedure
semiconductor plates
attaching semiconductor
attaching
Prior art date
Application number
IT48216/77A
Other languages
English (en)
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Application granted granted Critical
Publication of IT1083481B publication Critical patent/IT1083481B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
IT48216/77A 1976-03-01 1977-02-25 Procedimento per attaccare con mastice piastrine di semiconduttori IT1083481B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2608427A DE2608427C2 (de) 1976-03-01 1976-03-01 Verfahren zum Aufkitten von Halbleiterscheiben

Publications (1)

Publication Number Publication Date
IT1083481B true IT1083481B (it) 1985-05-21

Family

ID=5971267

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48216/77A IT1083481B (it) 1976-03-01 1977-02-25 Procedimento per attaccare con mastice piastrine di semiconduttori

Country Status (10)

Country Link
US (1) US4300965A (it)
JP (1) JPS52106683A (it)
BE (1) BE851892A (it)
CA (1) CA1075579A (it)
DE (1) DE2608427C2 (it)
FR (1) FR2343330A1 (it)
GB (1) GB1505488A (it)
IT (1) IT1083481B (it)
NL (1) NL7614209A (it)
SE (1) SE7702273L (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809274A1 (de) * 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
US4517041A (en) * 1982-09-30 1985-05-14 Magnetic Peripherals Inc. Method for attaching a workpiece to a workpiece carrier
US4530138A (en) * 1982-09-30 1985-07-23 Westinghouse Electric Corp. Method of making a transducer assembly
EP0256150B1 (en) * 1986-08-13 1990-04-04 Kabushiki Kaisha Toshiba Apparatus for bonding semiconductor wafers
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
DE10052293A1 (de) * 2000-10-20 2002-04-25 B L E Lab Equipment Gmbh Verfahren zum Aufbringen eines Substrats

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1950468A (en) * 1930-04-18 1934-03-13 Nat Aniline & Chem Co Inc Alkyd resinous composition
US2394689A (en) * 1944-01-07 1946-02-12 American Viscose Corp Method of dyeing
US3335087A (en) * 1965-12-20 1967-08-08 Pennsalt Chemical Corp Method of stripping resins
US3452133A (en) * 1966-03-07 1969-06-24 Schjeldahl Co G T Annealing of metal-plastic laminates
US3475867A (en) * 1966-12-20 1969-11-04 Monsanto Co Processing of semiconductor wafers
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements
US3586559A (en) * 1968-07-01 1971-06-22 Rohr Corp Method of temporarily securing a workpiece to a workholder
JPS5121334B2 (it) * 1971-08-27 1976-07-01
DE2247067C3 (de) * 1972-09-26 1979-08-09 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece

Also Published As

Publication number Publication date
DE2608427C2 (de) 1984-07-19
JPS52106683A (en) 1977-09-07
NL7614209A (nl) 1977-09-05
FR2343330B1 (it) 1978-10-20
CA1075579A (en) 1980-04-15
GB1505488A (en) 1978-03-30
JPS5641167B2 (it) 1981-09-26
BE851892A (fr) 1977-08-29
SE7702273L (sv) 1977-09-02
DE2608427A1 (de) 1977-09-08
FR2343330A1 (fr) 1977-09-30
US4300965A (en) 1981-11-17

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