IT1092484B - Procedimento e dispositivo per produrre piastre a circuiti stampati munite di una o piu resistenze - Google Patents

Procedimento e dispositivo per produrre piastre a circuiti stampati munite di una o piu resistenze

Info

Publication number
IT1092484B
IT1092484B IT19816/78A IT1981678A IT1092484B IT 1092484 B IT1092484 B IT 1092484B IT 19816/78 A IT19816/78 A IT 19816/78A IT 1981678 A IT1981678 A IT 1981678A IT 1092484 B IT1092484 B IT 1092484B
Authority
IT
Italy
Prior art keywords
resistances
procedure
printed circuits
producing plates
plates
Prior art date
Application number
IT19816/78A
Other languages
English (en)
Other versions
IT7819816A0 (it
Original Assignee
Ruf Kg Wilhelm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruf Kg Wilhelm filed Critical Ruf Kg Wilhelm
Publication of IT7819816A0 publication Critical patent/IT7819816A0/it
Application granted granted Critical
Publication of IT1092484B publication Critical patent/IT1092484B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881Coating only between conductors, i.e. flush with the conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981Metallised walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0338Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1453Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
IT19816/78A 1977-02-25 1978-01-31 Procedimento e dispositivo per produrre piastre a circuiti stampati munite di una o piu resistenze IT1092484B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772708229 DE2708229A1 (de) 1977-02-25 1977-02-25 Verfahren und vorrichtung zur herstellung von mit einem oder mehreren widerstaenden bestueckten leiterplatten

Publications (2)

Publication Number Publication Date
IT7819816A0 IT7819816A0 (it) 1978-01-31
IT1092484B true IT1092484B (it) 1985-07-12

Family

ID=6002172

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19816/78A IT1092484B (it) 1977-02-25 1978-01-31 Procedimento e dispositivo per produrre piastre a circuiti stampati munite di una o piu resistenze

Country Status (5)

Country Link
DE (1) DE2708229A1 (it)
ES (1) ES466324A1 (it)
FR (1) FR2382148A1 (it)
GB (1) GB1592436A (it)
IT (1) IT1092484B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
DE3741918A1 (de) * 1987-12-10 1989-06-22 Heino Pachschwoell Verfahren zur herstellung einer elektronischen schaltungsvorrichtung

Also Published As

Publication number Publication date
DE2708229A1 (de) 1978-08-31
IT7819816A0 (it) 1978-01-31
FR2382148B3 (it) 1980-09-12
GB1592436A (en) 1981-07-08
FR2382148A1 (fr) 1978-09-22
ES466324A1 (es) 1978-10-01

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