IT1123672B - Processo per la fabbricazione di uno strato di mascheramento per corpi di silicio - Google Patents
Processo per la fabbricazione di uno strato di mascheramento per corpi di silicioInfo
- Publication number
- IT1123672B IT1123672B IT29129/76A IT2912976A IT1123672B IT 1123672 B IT1123672 B IT 1123672B IT 29129/76 A IT29129/76 A IT 29129/76A IT 2912976 A IT2912976 A IT 2912976A IT 1123672 B IT1123672 B IT 1123672B
- Authority
- IT
- Italy
- Prior art keywords
- manufacture
- masking layer
- silicon bodies
- bodies
- silicon
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
- H10P14/6506—Formation of intermediate materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/694—Inorganic materials composed of nitrides
- H10P14/6943—Inorganic materials composed of nitrides containing silicon
- H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Weting (AREA)
- Local Oxidation Of Silicon (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2557079A DE2557079C2 (de) | 1975-12-18 | 1975-12-18 | Verfahren zum Herstellen einer Maskierungsschicht |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1123672B true IT1123672B (it) | 1986-04-30 |
Family
ID=5964757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT29129/76A IT1123672B (it) | 1975-12-18 | 1976-11-09 | Processo per la fabbricazione di uno strato di mascheramento per corpi di silicio |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4091169A (it) |
| JP (1) | JPS5275986A (it) |
| CA (1) | CA1078972A (it) |
| DE (1) | DE2557079C2 (it) |
| FR (1) | FR2335952A1 (it) |
| GB (1) | GB1500238A (it) |
| IT (1) | IT1123672B (it) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5922381B2 (ja) * | 1975-12-03 | 1984-05-26 | 株式会社東芝 | ハンドウタイソシノ セイゾウホウホウ |
| JPS5617988A (en) * | 1979-07-24 | 1981-02-20 | Toshio Hirai | Electroconductive si3n44c type noncrystalline material by chemical gas phase deposition and its manufacture |
| US4254161A (en) * | 1979-08-16 | 1981-03-03 | International Business Machines Corporation | Prevention of low pressure chemical vapor deposition silicon dioxide undercutting and flaking |
| US4289801A (en) * | 1980-05-21 | 1981-09-15 | United Technologies Corporation | Method for producing fine grained pyrolytic silicon nitride |
| US4333964A (en) * | 1980-09-15 | 1982-06-08 | General Electric Company | Method of making integrated circuits |
| US4420497A (en) * | 1981-08-24 | 1983-12-13 | Fairchild Camera And Instrument Corporation | Method of detecting and repairing latent defects in a semiconductor dielectric layer |
| JPS59143362A (ja) * | 1983-02-03 | 1984-08-16 | Fuji Xerox Co Ltd | パツシベ−シヨン膜 |
| US4870745A (en) * | 1987-12-23 | 1989-10-03 | Siemens-Bendix Automotive Electronics L.P. | Methods of making silicon-based sensors |
| US4888988A (en) * | 1987-12-23 | 1989-12-26 | Siemens-Bendix Automotive Electronics L.P. | Silicon based mass airflow sensor and its fabrication method |
| US5459346A (en) * | 1988-06-28 | 1995-10-17 | Ricoh Co., Ltd. | Semiconductor substrate with electrical contact in groove |
| US5310446A (en) * | 1990-01-10 | 1994-05-10 | Ricoh Company, Ltd. | Method for producing semiconductor film |
| DE69213898T2 (de) * | 1991-12-13 | 1997-02-06 | Ford Werke Ag | Metallnitridfilm |
| FR2759362B1 (fr) | 1997-02-10 | 1999-03-12 | Saint Gobain Vitrage | Substrat transparent muni d'au moins une couche mince a base de nitrure ou d'oxynitrure de silicium et son procede d'obtention |
| AU4251001A (en) * | 2000-04-28 | 2001-11-12 | Merck Patent Gmbh | Etching pastes for inorganic surfaces |
| DE10103524A1 (de) * | 2001-01-26 | 2002-08-22 | Infineon Technologies Ag | Verfahren und Halbleiteranordnung zur Ätzung einer Schicht eines Halbleitersubstrats mittels einer siliziumhaltigen Ätzmaske |
| DE10150040A1 (de) * | 2001-10-10 | 2003-04-17 | Merck Patent Gmbh | Kombinierte Ätz- und Dotiermedien |
| JP4385206B2 (ja) * | 2003-01-07 | 2009-12-16 | 日本電気株式会社 | 電界効果トランジスタ |
| JP4403824B2 (ja) * | 2003-05-26 | 2010-01-27 | 東京エレクトロン株式会社 | シリコン窒化膜の成膜方法 |
| US20050287747A1 (en) * | 2004-06-29 | 2005-12-29 | International Business Machines Corporation | Doped nitride film, doped oxide film and other doped films |
| US20070048906A1 (en) * | 2005-08-23 | 2007-03-01 | Han Seung H | Method for fabricating semiconductor device |
| US7501355B2 (en) * | 2006-06-29 | 2009-03-10 | Applied Materials, Inc. | Decreasing the etch rate of silicon nitride by carbon addition |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3419761A (en) * | 1965-10-11 | 1968-12-31 | Ibm | Method for depositing silicon nitride insulating films and electric devices incorporating such films |
| FR1492719A (fr) * | 1965-10-11 | 1967-08-18 | Ibm | Procédé de dépôt de films de nitrure de silicium continus ne présentant pas de trous et produits obtenus par ce procédé |
| DE1544287B2 (de) * | 1966-04-29 | 1975-12-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen einer Schutzschicht aus Siliciumnitrid |
| NL6703526A (it) * | 1966-05-02 | 1967-11-03 | ||
| JPS5128983B1 (it) * | 1966-10-28 | 1976-08-23 | ||
| US3520722A (en) * | 1967-05-10 | 1970-07-14 | Rca Corp | Fabrication of semiconductive devices with silicon nitride coatings |
| US3549411A (en) * | 1967-06-27 | 1970-12-22 | Texas Instruments Inc | Method of preparing silicon nitride films |
| US3652331A (en) * | 1968-03-22 | 1972-03-28 | Shumpei Yamazaki | Process for forming a film on the surface of a substrate by a gas phase |
| US3652324A (en) * | 1968-08-15 | 1972-03-28 | Westinghouse Electric Corp | A METHOD OF VAPOR DEPOSITING A LAYER OF Si{11 N{11 {0 ON A SILICON BASE |
| US3637423A (en) * | 1969-02-10 | 1972-01-25 | Westinghouse Electric Corp | Pyrolytic deposition of silicon nitride films |
| DE1957952A1 (de) * | 1969-11-18 | 1971-05-27 | Siemens Ag | Siliciumnitridbeschichtung an Quarzwaenden fuer Diffusions- und Oxydationsreaktoren |
| US3874919A (en) * | 1974-03-13 | 1975-04-01 | Ibm | Oxidation resistant mask layer and process for producing recessed oxide region in a silicon body |
| US4036653A (en) | 1975-05-28 | 1977-07-19 | E. I. Du Pont De Nemours And Company | Amorphous silicon nitride composition containing carbon, and vapor phase process |
-
1975
- 1975-12-18 DE DE2557079A patent/DE2557079C2/de not_active Expired
-
1976
- 1976-09-07 US US05/720,542 patent/US4091169A/en not_active Expired - Lifetime
- 1976-10-18 FR FR7632458A patent/FR2335952A1/fr active Granted
- 1976-11-03 GB GB45667/76A patent/GB1500238A/en not_active Expired
- 1976-11-09 IT IT29129/76A patent/IT1123672B/it active
- 1976-12-02 JP JP51144080A patent/JPS5275986A/ja active Granted
- 1976-12-17 CA CA268,095A patent/CA1078972A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1500238A (en) | 1978-02-08 |
| JPS5275986A (en) | 1977-06-25 |
| DE2557079C2 (de) | 1984-05-24 |
| CA1078972A (en) | 1980-06-03 |
| DE2557079A1 (de) | 1977-06-30 |
| FR2335952A1 (fr) | 1977-07-15 |
| US4091169A (en) | 1978-05-23 |
| JPS5320390B2 (it) | 1978-06-26 |
| FR2335952B1 (it) | 1979-09-21 |
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