IT1135038B - Apparato per unire elettricamente le estremita' di linee di materiale semiconduttore,sostanzialmente parallele - Google Patents

Apparato per unire elettricamente le estremita' di linee di materiale semiconduttore,sostanzialmente parallele

Info

Publication number
IT1135038B
IT1135038B IT19135/81A IT1913581A IT1135038B IT 1135038 B IT1135038 B IT 1135038B IT 19135/81 A IT19135/81 A IT 19135/81A IT 1913581 A IT1913581 A IT 1913581A IT 1135038 B IT1135038 B IT 1135038B
Authority
IT
Italy
Prior art keywords
extremities
substantially parallel
semiconductor material
material lines
electrically join
Prior art date
Application number
IT19135/81A
Other languages
English (en)
Other versions
IT8119135A0 (it
Inventor
Roger Stewart Green
Mazin Moshe
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of IT8119135A0 publication Critical patent/IT8119135A0/it
Application granted granted Critical
Publication of IT1135038B publication Critical patent/IT1135038B/it

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66Conductive materials thereof
    • H10W70/662Semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Read Only Memory (AREA)
  • Semiconductor Memories (AREA)
IT19135/81A 1980-01-28 1981-01-14 Apparato per unire elettricamente le estremita' di linee di materiale semiconduttore,sostanzialmente parallele IT1135038B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11631280A 1980-01-28 1980-01-28

Publications (2)

Publication Number Publication Date
IT8119135A0 IT8119135A0 (it) 1981-01-14
IT1135038B true IT1135038B (it) 1986-08-20

Family

ID=22366443

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19135/81A IT1135038B (it) 1980-01-28 1981-01-14 Apparato per unire elettricamente le estremita' di linee di materiale semiconduttore,sostanzialmente parallele

Country Status (5)

Country Link
JP (1) JPS56119993A (it)
DE (1) DE3102106A1 (it)
FR (1) FR2474762A1 (it)
GB (1) GB2068638B (it)
IT (1) IT1135038B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161061A (ja) * 1983-02-10 1984-09-11 Fujitsu Ltd 半導体記憶装置
JPH0642536B2 (ja) * 1985-08-16 1994-06-01 富士通株式会社 半導体記憶装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB981735A (en) * 1960-12-23 1965-01-27 Standard Telephones Cables Ltd Improvements in or relating to intelligence storage devices
GB1441004A (en) * 1972-11-13 1976-06-30 Siemens Ag Integrated storage circuits
US3965568A (en) * 1973-08-27 1976-06-29 Texas Instruments Incorporated Process for fabrication and assembly of semiconductor devices
US4088546A (en) * 1977-03-01 1978-05-09 Westinghouse Electric Corp. Method of electroplating interconnections

Also Published As

Publication number Publication date
GB2068638B (en) 1984-04-04
IT8119135A0 (it) 1981-01-14
GB2068638A (en) 1981-08-12
FR2474762A1 (fr) 1981-07-31
DE3102106A1 (de) 1982-01-07
JPS56119993A (en) 1981-09-19

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