IT1135519B - Metodo per saldare piedini di collegamento,uniti a strisce di supporto,su pannelli a circuito stampato e bagno di saldatura ad immersione,per lo svolgimento di questo metodo - Google Patents

Metodo per saldare piedini di collegamento,uniti a strisce di supporto,su pannelli a circuito stampato e bagno di saldatura ad immersione,per lo svolgimento di questo metodo

Info

Publication number
IT1135519B
IT1135519B IT19828/81A IT1982881A IT1135519B IT 1135519 B IT1135519 B IT 1135519B IT 19828/81 A IT19828/81 A IT 19828/81A IT 1982881 A IT1982881 A IT 1982881A IT 1135519 B IT1135519 B IT 1135519B
Authority
IT
Italy
Prior art keywords
welding
units
performance
printed circuit
support strips
Prior art date
Application number
IT19828/81A
Other languages
English (en)
Other versions
IT8119828A0 (it
Inventor
Manfred Bodewig
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of IT8119828A0 publication Critical patent/IT8119828A0/it
Application granted granted Critical
Publication of IT1135519B publication Critical patent/IT1135519B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
IT19828/81A 1980-02-21 1981-02-18 Metodo per saldare piedini di collegamento,uniti a strisce di supporto,su pannelli a circuito stampato e bagno di saldatura ad immersione,per lo svolgimento di questo metodo IT1135519B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3006431A DE3006431C2 (de) 1980-02-21 1980-02-21 Verfahren zum Anlöten von an Trägerstreifen angeordneten Anschlußstiften an Schaltungsplatten und Tauchlötbad zur Durchführung des Verfahrens

Publications (2)

Publication Number Publication Date
IT8119828A0 IT8119828A0 (it) 1981-02-18
IT1135519B true IT1135519B (it) 1986-08-27

Family

ID=6095149

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19828/81A IT1135519B (it) 1980-02-21 1981-02-18 Metodo per saldare piedini di collegamento,uniti a strisce di supporto,su pannelli a circuito stampato e bagno di saldatura ad immersione,per lo svolgimento di questo metodo

Country Status (6)

Country Link
US (1) US4410127A (it)
JP (1) JPS56134751A (it)
DE (1) DE3006431C2 (it)
FR (1) FR2476520A1 (it)
GB (1) GB2069905B (it)
IT (1) IT1135519B (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3111809C2 (de) * 1981-03-25 1985-05-15 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
JPS59130675A (ja) * 1983-01-18 1984-07-27 Kenji Kondo はんだ槽
GB8324231D0 (en) * 1983-09-09 1983-10-12 Dolphin Machinery Soldering apparatus
US4637541A (en) * 1985-06-28 1987-01-20 Unit Industries, Inc. Circuit board soldering device
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
US5439158A (en) * 1994-02-22 1995-08-08 Sund; William Atmosphere controlled soldering apparatus with incorporated solder pump
US6273317B1 (en) * 1998-10-29 2001-08-14 Denso Corporation Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism
KR100849414B1 (ko) 2007-02-07 2008-08-20 (주)환화 커런트 리드의 솔더링 장치
JP6590232B1 (ja) * 2019-04-22 2019-10-16 千住金属工業株式会社 はんだ付け装置及びはんだ付け方法
CN112164954B (zh) * 2020-09-15 2021-10-29 国网山东省电力公司济南供电公司 一种压接线鼻子的工具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB862722A (en) * 1958-08-26 1961-03-15 Sylvania Electric Prod Wave soldering of circuit components to electrical circuit boards
US3198414A (en) * 1963-07-30 1965-08-03 Electrovert Mfg Co Ltd Molten solder bath with uniformly dispersed additive
US3604609A (en) * 1968-12-02 1971-09-14 Western Electric Co Apparatus for eliminating iciclelike formations on wave-soldered connections on circuit substrates
US3726465A (en) * 1971-01-15 1973-04-10 Hollis Engineering Wave soldering apparatus
CA972631A (en) * 1973-03-20 1975-08-12 Amp Incorporated Method of and apparatus for selectively soldering a workpiece
CA1002391A (en) * 1974-10-07 1976-12-28 Electrovert Ltd. - Electrovert Ltee Wave-soldering of printed circuits
JPS5347803A (en) * 1976-10-12 1978-04-28 Mitsubishi Electric Corp Automatic focus controller
US4170326A (en) * 1978-01-09 1979-10-09 Gte Automatic Electric Laboratories Incorporated Method and holding fixture for soldering lead frames to hybrid substrates
FR2435884A1 (fr) * 1978-09-07 1980-04-04 Cit Alcatel Machine a souder un connecteur a une plaque de circuit imprime

Also Published As

Publication number Publication date
IT8119828A0 (it) 1981-02-18
US4410127A (en) 1983-10-18
DE3006431C2 (de) 1981-07-02
DE3006431B1 (de) 1980-10-16
JPS56134751A (en) 1981-10-21
GB2069905A (en) 1981-09-03
FR2476520A1 (fr) 1981-08-28
GB2069905B (en) 1983-10-12

Similar Documents

Publication Publication Date Title
FR2554389B1 (fr) Stratifie revetu de metal et procede de fabrication
DE3676744D1 (de) Leiterplattenherstellungsverfahren.
DE3482645D1 (de) Mehrschichtfilm oder mehrschichtbogen.
ATA239381A (de) Mehrebenen-leiterplatte und verfahren zu deren herstellung
IT8024318A0 (it) Dispositivo e metodo di montaggiodi parti su pannelli a circuito stampato.
FR2496126B1 (fr) Dispositif cathodique et procede d
ES546967A0 (es) Un procedimiento de mecanizado quimico,aplicable particular-mente a paneles de circuito impreso
DE3482368D1 (de) Leiterplatte.
IT1135519B (it) Metodo per saldare piedini di collegamento,uniti a strisce di supporto,su pannelli a circuito stampato e bagno di saldatura ad immersione,per lo svolgimento di questo metodo
IT8068208A0 (it) Sistema di sicurezza per persone a bordo di imbarcazioni
IT8467448A1 (it) Procedimento e apparecchiatura per formare un rivestimento su un substrato vetroso caldo.
IT1174108B (it) Metodo e apparecchiature per la produzione di un foglio dimateriale
IT1170779B (it) Metodo per la fabbricazione di pannelli a circuito stampato con fori aventi pareti metallizzate
FR2498125B1 (fr) Stratifie revetu de cuivre et procede de fabrication
AT381278B (de) Beschichtetes stahlblech
IT8319877A0 (it) Metodo ed apparato per la fabbricazione di pannelli a circuito stampato, a piu' strati.
IT1184362B (it) Procedimento per effittuare la saldatura di componenti elettronici su un supporto
NL189310C (nl) Beklede stalen plaat met verbeterde lasbaarheid en werkwijze voor de vervaardiging.
FI843654L (fi) Metod att bearbeta trae.
ES504230A0 (es) Un metodo mejorado para el estanado de un panel de circuito impreso
FI862842L (fi) Galvaniskt utfaelld kopparfolie.
ES507138A0 (es) Conjunto de rodillo de laminador y su metodo de ensamblaje.
ES517350A0 (es) Un metodo para conectar los bordes de la tarjetas de circuito impreso.
DE3670751D1 (de) System gegen die schwingungen von elektronischen leiterplatten.
IT8367405A0 (it) Macchina per scrivere elettronica portatile