IT1147576B - Perfezionamento nelle confezioni di diodi a semiconduttore,in particolare diodi a pastiglie - Google Patents
Perfezionamento nelle confezioni di diodi a semiconduttore,in particolare diodi a pastiglieInfo
- Publication number
- IT1147576B IT1147576B IT47549/82A IT4754982A IT1147576B IT 1147576 B IT1147576 B IT 1147576B IT 47549/82 A IT47549/82 A IT 47549/82A IT 4754982 A IT4754982 A IT 4754982A IT 1147576 B IT1147576 B IT 1147576B
- Authority
- IT
- Italy
- Prior art keywords
- diodes
- improvement
- semiconductor diode
- diode packages
- particular pad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
- H10W72/387—Flow barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22969681A | 1981-01-30 | 1981-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8247549A0 IT8247549A0 (it) | 1982-01-13 |
| IT1147576B true IT1147576B (it) | 1986-11-19 |
Family
ID=22862335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT47549/82A IT1147576B (it) | 1981-01-30 | 1982-01-13 | Perfezionamento nelle confezioni di diodi a semiconduttore,in particolare diodi a pastiglie |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0070862A4 (it) |
| BR (1) | BR8108967A (it) |
| CA (1) | CA1177580A (it) |
| IT (1) | IT1147576B (it) |
| MX (1) | MX151124A (it) |
| WO (1) | WO1982002798A1 (it) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2841940B2 (ja) * | 1990-12-19 | 1998-12-24 | 富士電機株式会社 | 半導体素子 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3430335A (en) * | 1965-06-08 | 1969-03-04 | Hughes Aircraft Co | Method of treating semiconductor devices or components |
| US3532944A (en) * | 1966-11-04 | 1970-10-06 | Rca Corp | Semiconductor devices having soldered joints |
| US3548268A (en) * | 1968-10-22 | 1970-12-15 | Unitrode Corp | High-power semiconductor devices |
| US3821614A (en) * | 1971-05-05 | 1974-06-28 | Bosch Gmbh Robert | Semi conductor unit with flow deposited solder |
| FR2160759B1 (it) * | 1971-11-26 | 1974-05-31 | Thomson Csf | |
| US3844029A (en) * | 1972-02-02 | 1974-10-29 | Trw Inc | High power double-slug diode package |
| FR2328286A1 (fr) * | 1975-10-14 | 1977-05-13 | Thomson Csf | Procede de fabrication de dispositifs a semiconducteurs, presentant une tres faible resistance thermique, et dispositifs obtenus par ledit procede |
| US4069498A (en) * | 1976-11-03 | 1978-01-17 | International Business Machines Corporation | Studded heat exchanger for integrated circuit package |
-
1981
- 1981-12-21 EP EP19820900484 patent/EP0070862A4/en not_active Withdrawn
- 1981-12-21 BR BR8108967A patent/BR8108967A/pt unknown
- 1981-12-21 WO PCT/US1981/001731 patent/WO1982002798A1/en not_active Ceased
-
1982
- 1982-01-08 CA CA000393799A patent/CA1177580A/en not_active Expired
- 1982-01-13 IT IT47549/82A patent/IT1147576B/it active
- 1982-01-29 MX MX191200A patent/MX151124A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO1982002798A1 (en) | 1982-08-19 |
| CA1177580A (en) | 1984-11-06 |
| BR8108967A (pt) | 1983-01-11 |
| EP0070862A4 (en) | 1985-04-25 |
| IT8247549A0 (it) | 1982-01-13 |
| EP0070862A1 (en) | 1983-02-09 |
| MX151124A (es) | 1984-10-03 |
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