IT1200402B - Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati - Google Patents

Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati

Info

Publication number: IT1200402B
Authority: IT; Italy
Prior art keywords: main dimension; wave; pref; feed direction; circuit board
Prior art date: 1985-03-06

Application number

IT8519785A

Other languages

English (en)

Other versions

IT8519785A0 (it

Inventor

Roberto Scorta

Original Assignee

Roberto Scorta

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-03-06

Filing date

1985-03-06

Publication date

1989-01-18

1985-03-06 Application filed by Roberto Scorta filed Critical Roberto Scorta

1985-03-06 Priority to IT8519785A priority Critical patent/IT1200402B/it

1985-03-06 Publication of IT8519785A0 publication Critical patent/IT8519785A0/it

1986-03-03 Priority to EP86200329A priority patent/EP0203623B1/en

1986-03-03 Priority to DE198686200329T priority patent/DE203623T1/de

1986-03-03 Priority to DE8686200329T priority patent/DE3685688T2/de

1989-01-18 Application granted granted Critical

1989-01-18 Publication of IT1200402B publication Critical patent/IT1200402B/it

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3468—Application of molten solder, e.g. dip soldering
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Mechanical Engineering (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Molten Solder (AREA)

IT8519785A 1985-03-06 1985-03-06 Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati IT1200402B (it)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
IT8519785A IT1200402B (it)	1985-03-06	1985-03-06	Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati
EP86200329A EP0203623B1 (en)	1985-03-06	1986-03-03	Wavesoldering device, particularly for printed circuits
DE198686200329T DE203623T1 (de)	1985-03-06	1986-03-03	Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.
DE8686200329T DE3685688T2 (de)	1985-03-06	1986-03-03	Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
IT8519785A IT1200402B (it)	1985-03-06	1985-03-06	Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati

Publications (2)

Publication Number	Publication Date
IT8519785A0 IT8519785A0 (it)	1985-03-06
IT1200402B true IT1200402B (it)	1989-01-18

Family

ID=11161193

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IT8519785A IT1200402B (it)	1985-03-06	1985-03-06	Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati

Country Status (3)

Country	Link
EP (1)	EP0203623B1 (it)
DE (2)	DE203623T1 (it)
IT (1)	IT1200402B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0280022A1 (de) *	1987-01-28	1988-08-31	Epm Ag	Verfahren und Anlage zum Löten von bestückten Leiterplatten
GB8705931D0 (en) *	1987-03-12	1987-04-15	British Aerospace	Solder coating processes
IT1216594B (it) *	1988-04-19	1990-03-08	Italtel Spa	Metodo e dispositivo per la saldatura ad onda.
MY104879A (en) *	1988-12-31	1994-06-30	Yokota Kikai Kk	An automatic soldering method and the apparatus thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2487857A1 (fr) *	1980-07-29	1982-02-05	Silicium Semiconducteur Ssc	Procede et dispositif d'etamage des fils de connexion d'un composant electrique
DE3205276C2 (de) *	1981-03-25	1984-03-08	Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen	Vorrichtung zum maschinellen Löten von Werkstücken
EP0159425B1 (en) *	1984-04-17	1988-06-15	Nihon Den-Netsu Keiki Co., Ltd.	Soldering apparatus

1985
- 1985-03-06 IT IT8519785A patent/IT1200402B/it active
1986
- 1986-03-03 EP EP86200329A patent/EP0203623B1/en not_active Expired - Lifetime
- 1986-03-03 DE DE198686200329T patent/DE203623T1/de active Pending
- 1986-03-03 DE DE8686200329T patent/DE3685688T2/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0203623A3 (en)	1987-12-23
EP0203623B1 (en)	1992-06-17
EP0203623A2 (en)	1986-12-03
IT8519785A0 (it)	1985-03-06
DE3685688D1 (de)	1992-07-23
DE203623T1 (de)	1987-02-26
DE3685688T2 (de)	1993-01-14

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Legal Events

Date	Code	Title	Description
1999-10-27	TA	Fee payment date (situation as of event date), data collected since 19931001	Effective date: 19970313