IT1200509B - Procedimento ed apparecchio ebulliometrico per rivelare punti caldi localizzati su piccoli oggetti,in particolare circuiti integrati - Google Patents

Procedimento ed apparecchio ebulliometrico per rivelare punti caldi localizzati su piccoli oggetti,in particolare circuiti integrati

Info

Publication number
IT1200509B
IT1200509B IT49590/82A IT4959082A IT1200509B IT 1200509 B IT1200509 B IT 1200509B IT 49590/82 A IT49590/82 A IT 49590/82A IT 4959082 A IT4959082 A IT 4959082A IT 1200509 B IT1200509 B IT 1200509B
Authority
IT
Italy
Prior art keywords
boiling
ebulliometric
procedure
integrated circuits
points located
Prior art date
Application number
IT49590/82A
Other languages
English (en)
Other versions
IT8249590A0 (it
Inventor
Robert D Hancock
Kenneth F Hollman
Original Assignee
Hancock Robert Dean
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hancock Robert Dean filed Critical Hancock Robert Dean
Publication of IT8249590A0 publication Critical patent/IT8249590A0/it
Application granted granted Critical
Publication of IT1200509B publication Critical patent/IT1200509B/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
    • G01N25/08—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering of boiling point
    • G01N25/085—Investigating nucleation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Control Of Combustion (AREA)
  • Measuring Fluid Pressure (AREA)
  • Fire-Detection Mechanisms (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Air Bags (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
IT49590/82A 1981-12-01 1982-11-30 Procedimento ed apparecchio ebulliometrico per rivelare punti caldi localizzati su piccoli oggetti,in particolare circuiti integrati IT1200509B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/326,224 US4466746A (en) 1981-12-01 1981-12-01 Ebulliometric hot spot detector

Publications (2)

Publication Number Publication Date
IT8249590A0 IT8249590A0 (it) 1982-11-30
IT1200509B true IT1200509B (it) 1989-01-18

Family

ID=23271321

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49590/82A IT1200509B (it) 1981-12-01 1982-11-30 Procedimento ed apparecchio ebulliometrico per rivelare punti caldi localizzati su piccoli oggetti,in particolare circuiti integrati

Country Status (18)

Country Link
US (1) US4466746A (it)
EP (1) EP0094966B1 (it)
JP (1) JPS58502064A (it)
KR (1) KR910008823B1 (it)
AT (1) ATE22977T1 (it)
AU (1) AU1100283A (it)
BR (1) BR8208000A (it)
CA (1) CA1186526A (it)
DE (1) DE3273835D1 (it)
GB (1) GB2110823B (it)
IE (1) IE53723B1 (it)
IL (1) IL67307A (it)
IN (1) IN157325B (it)
IT (1) IT1200509B (it)
MX (1) MX158366A (it)
NZ (1) NZ202509A (it)
PH (1) PH20743A (it)
WO (1) WO1983001989A1 (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3410789A1 (de) * 1984-03-23 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zur orientierung einer fluessigkristallinen substanz bezueglich einer unterlage
US4640626A (en) * 1984-09-13 1987-02-03 Siemens Aktiengesellschaft Method and apparatus for localizing weak points within an electrical circuit
US4710707A (en) * 1985-01-16 1987-12-01 Zenith Electronics Corporation High voltage electronic component test apparatus
DE3600421A1 (de) * 1986-01-09 1987-07-16 Kraftwerk Union Ag Verfahren und vorrichtung zur feststellung und ortung von lokalen uebererwaermungen in fluessigkeits-gekuehlten wicklungen elektrischer maschinen
US4964737A (en) * 1989-03-17 1990-10-23 Ibm Removable thermocouple template for monitoring temperature of multichip modules
US5119021A (en) * 1989-07-13 1992-06-02 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5004973A (en) * 1989-07-13 1991-04-02 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5396068A (en) * 1993-03-30 1995-03-07 At&T Corp. Method of making a semiconductor device including infrared imaging, and apparatus for use in the imaging
US5504017A (en) * 1994-12-20 1996-04-02 Advanced Micro Devices, Inc. Void detection in metallization patterns
GB9706990D0 (en) * 1997-04-05 1997-05-21 Univ Heriot Watt Dew point and bubble point measurement
US6033107A (en) * 1997-07-15 2000-03-07 Temptronic Corporation Temperature mapping system
US6559670B1 (en) * 1999-11-16 2003-05-06 Lsi Logic Corporation Backside liquid crystal analysis technique for flip-chip packages
US6842021B1 (en) * 2003-11-07 2005-01-11 National Semiconductor Corporation System and method for detecting location of a defective electrical connection within an integrated circuit
US20110094556A1 (en) * 2009-10-25 2011-04-28 Digital Angel Corporation Planar thermoelectric generator
US10600664B2 (en) * 2017-05-03 2020-03-24 Applied Materials, Inc. Fluorescence based thermometry for packaging applications

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2578265A (en) * 1948-10-11 1951-12-11 Milton Roy Co Bellows pump
US3264863A (en) * 1963-05-27 1966-08-09 Maropis Nicholas Method and apparatus for detecting incipient boiling of a liquid
US3361037A (en) * 1965-10-21 1968-01-02 Holley Carburetor Co Fail-safe pressur responsive device
US3396335A (en) * 1966-08-26 1968-08-06 Circuit Res Company Method of testing printed circuit conductors
US3510762A (en) * 1967-04-14 1970-05-05 John Robert Alexander Leslie Electrical cable temperature monitoring and hot-spot locating system and method utilizing a transmission line having a liquid dielectric
JPS5651631A (en) * 1979-10-02 1981-05-09 Chiyou Lsi Gijutsu Kenkyu Kumiai Measuring instrument for surface temperature distribution

Also Published As

Publication number Publication date
BR8208000A (pt) 1983-10-18
ATE22977T1 (de) 1986-11-15
IE53723B1 (en) 1989-01-18
MX158366A (es) 1989-01-27
IE822846L (en) 1983-06-01
EP0094966B1 (en) 1986-10-15
WO1983001989A1 (en) 1983-06-09
IT8249590A0 (it) 1982-11-30
KR910008823B1 (ko) 1991-10-21
GB2110823A (en) 1983-06-22
NZ202509A (en) 1985-11-08
IN157325B (it) 1986-03-01
IL67307A0 (en) 1983-03-31
IL67307A (en) 1988-03-31
PH20743A (en) 1987-04-02
US4466746A (en) 1984-08-21
EP0094966A1 (en) 1983-11-30
KR840002522A (ko) 1984-07-02
GB2110823B (en) 1985-08-21
EP0094966A4 (en) 1984-04-06
DE3273835D1 (de) 1986-11-20
CA1186526A (en) 1985-05-07
AU1100283A (en) 1983-06-17
JPS58502064A (ja) 1983-12-01

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951124