IT1212708B - Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo. - Google Patents

Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo.

Info

Publication number
IT1212708B
IT1212708B IT8319832A IT1983283A IT1212708B IT 1212708 B IT1212708 B IT 1212708B IT 8319832 A IT8319832 A IT 8319832A IT 1983283 A IT1983283 A IT 1983283A IT 1212708 B IT1212708 B IT 1212708B
Authority
IT
Italy
Prior art keywords
multiplicity
parallel
power device
elements connected
active elements
Prior art date
Application number
IT8319832A
Other languages
English (en)
Other versions
IT8319832A0 (it
Inventor
Luciano Gandolfi
Giuseppe Perla
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT8319832A priority Critical patent/IT1212708B/it
Publication of IT8319832A0 publication Critical patent/IT8319832A0/it
Priority to FR8402394A priority patent/FR2541824B1/fr
Priority to DE19843406420 priority patent/DE3406420A1/de
Priority to US06/582,793 priority patent/US4881117A/en
Priority to GB08405012A priority patent/GB2135824B/en
Priority to JP59035474A priority patent/JPS59165441A/ja
Application granted granted Critical
Publication of IT1212708B publication Critical patent/IT1212708B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT8319832A 1983-02-28 1983-02-28 Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo. IT1212708B (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT8319832A IT1212708B (it) 1983-02-28 1983-02-28 Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo.
FR8402394A FR2541824B1 (fr) 1983-02-28 1984-02-17 Dispositif de puissance a semi-conducteur constitue par une multiplicite d'elements semblables montes en parallele
DE19843406420 DE3406420A1 (de) 1983-02-28 1984-02-22 Halbleiter-leistungsvorrichtung mit mehreren parallel geschalteten, gleichen elementen
US06/582,793 US4881117A (en) 1983-02-28 1984-02-23 Semiconductor power device formed of a multiplicity of identical parallel-connected elements
GB08405012A GB2135824B (en) 1983-02-28 1984-02-27 Semiconductor device
JP59035474A JPS59165441A (ja) 1983-02-28 1984-02-28 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8319832A IT1212708B (it) 1983-02-28 1983-02-28 Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo.

Publications (2)

Publication Number Publication Date
IT8319832A0 IT8319832A0 (it) 1983-02-28
IT1212708B true IT1212708B (it) 1989-11-30

Family

ID=11161650

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8319832A IT1212708B (it) 1983-02-28 1983-02-28 Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo.

Country Status (6)

Country Link
US (1) US4881117A (it)
JP (1) JPS59165441A (it)
DE (1) DE3406420A1 (it)
FR (1) FR2541824B1 (it)
GB (1) GB2135824B (it)
IT (1) IT1212708B (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3529341A1 (de) * 1985-08-16 1987-02-19 Telefunken Electronic Gmbh Solarzellen-modul
FR2617636A1 (fr) * 1987-07-02 1989-01-06 Neiman Sa Procede de fabrication d'un composant electronique de puissance et composants obtenus par ce procede
FR2620862B1 (fr) * 1987-09-17 1990-04-06 Thomson Semiconducteurs Montage en parallele de transistors mos de puissance
DE3802821A1 (de) * 1988-01-30 1989-08-03 Bosch Gmbh Robert Leistungstransistor
FR2652983B1 (fr) * 1989-10-11 1993-04-30 Alsthom Gec Montage en cascade d'etages de transistors en parallele realise en circuit hybride.
EP0473260B1 (en) * 1990-08-28 1995-12-27 International Business Machines Corporation Fabrication of semiconductor packages
DE59107655D1 (de) * 1991-02-22 1996-05-09 Asea Brown Boveri Abschaltbares Hochleistungs-Halbleiterbauelement
US5250847A (en) * 1991-06-27 1993-10-05 Motorola, Inc. Stress isolating signal path for integrated circuits
DE4130160A1 (de) * 1991-09-11 1993-03-25 Export Contor Aussenhandel Elektronische schaltung
DE19638090C2 (de) * 1996-09-18 2001-11-29 Infineon Technologies Ag Stromanschluß für Leistungshalbleiterbauelement
EP1209742A1 (de) * 2000-11-22 2002-05-29 ABB Schweiz AG Hochleistungshalbleitermodul sowie Anwendung eines solchen Hochleistungshalbleitermoduls
DE102004056984A1 (de) * 2004-11-25 2006-06-08 Siemens Ag Stromrichteranordnung
DE102004061936A1 (de) * 2004-12-22 2006-07-06 Siemens Ag Anordnung eines Halbleitermoduls und einer elektrischen Verschienung
DE102004061908B4 (de) * 2004-12-22 2009-07-30 Siemens Ag Verfahren zum Herstellen einer Schaltungsanordnung auf einem Substrat
US8833169B2 (en) * 2011-12-09 2014-09-16 General Electric Company System and method for inspection of a part with dual multi-axis robotic devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1250009B (it) * 1962-07-28
US3996603A (en) * 1974-10-18 1976-12-07 Motorola, Inc. RF power semiconductor package and method of manufacture
JPS5442986A (en) * 1977-09-09 1979-04-05 Omron Tateisi Electronics Co Menufacture of semiconductor device
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern

Also Published As

Publication number Publication date
US4881117A (en) 1989-11-14
GB8405012D0 (en) 1984-04-04
FR2541824B1 (fr) 1985-12-27
GB2135824B (en) 1986-10-01
GB2135824A (en) 1984-09-05
IT8319832A0 (it) 1983-02-28
DE3406420A1 (de) 1984-08-30
FR2541824A1 (fr) 1984-08-31
JPS59165441A (ja) 1984-09-18

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970227