IT1215267B - Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale. - Google Patents

Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale.

Info

Publication number
IT1215267B
IT1215267B IT8520503A IT2050385A IT1215267B IT 1215267 B IT1215267 B IT 1215267B IT 8520503 A IT8520503 A IT 8520503A IT 2050385 A IT2050385 A IT 2050385A IT 1215267 B IT1215267 B IT 1215267B
Authority
IT
Italy
Prior art keywords
container
conductors
circuit board
cooling plate
coupling
Prior art date
Application number
IT8520503A
Other languages
English (en)
Other versions
IT8520503A0 (it
Inventor
Bruno Murari
Carlo Cognetti De Martiis
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT8520503A priority Critical patent/IT1215267B/it
Publication of IT8520503A0 publication Critical patent/IT8520503A0/it
Priority to DE3614086A priority patent/DE3614086C2/de
Priority to FR868606059A priority patent/FR2581250B1/fr
Priority to NL8601072A priority patent/NL193232C/nl
Application granted granted Critical
Publication of IT1215267B publication Critical patent/IT1215267B/it
Priority to US07/602,926 priority patent/US5237485A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT8520503A 1985-04-26 1985-04-26 Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale. IT1215267B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT8520503A IT1215267B (it) 1985-04-26 1985-04-26 Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale.
DE3614086A DE3614086C2 (de) 1985-04-26 1986-04-25 Vorrichtung zur Wärmeableitung von einer elektronische Komponenten enthaltenden Baueinheit und Verfahren zum thermischen Koppeln einer elektronische Komponenten enthaltenden Baueinheit
FR868606059A FR2581250B1 (fr) 1985-04-26 1986-04-25 Appareil et procede pour etablir une liaison thermique entre un boitier de semi-conducteur et la plaque de refroidissement et une liaison electrique entre les conducteurs du boitier, et un panneau de circuit imprime
NL8601072A NL193232C (nl) 1985-04-26 1986-04-25 Elektronisch samenstel.
US07/602,926 US5237485A (en) 1985-04-26 1990-10-22 Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8520503A IT1215267B (it) 1985-04-26 1985-04-26 Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale.

Publications (2)

Publication Number Publication Date
IT8520503A0 IT8520503A0 (it) 1985-04-26
IT1215267B true IT1215267B (it) 1990-01-31

Family

ID=11167919

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8520503A IT1215267B (it) 1985-04-26 1985-04-26 Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale.

Country Status (4)

Country Link
DE (1) DE3614086C2 (it)
FR (1) FR2581250B1 (it)
IT (1) IT1215267B (it)
NL (1) NL193232C (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3633625A1 (de) * 1985-12-04 1987-06-11 Vdo Schindling Traegerplatte
DE4037488A1 (de) * 1990-11-24 1992-05-27 Bosch Gmbh Robert Leistungsbausteine mit elektrisch isolierender thermischer ankopplung
DE4141650C2 (de) * 1991-12-17 1997-03-13 Vero Electronics Gmbh Kühlkörper mit abnehmbarer Andruckklammer
DE4218224A1 (de) * 1992-06-03 1993-12-09 Asea Brown Boveri Vorrichtung zum Befestigen mindestens eines Bauelementes an einem Träger
US5283467A (en) * 1992-06-05 1994-02-01 Eaton Corporation Heat sink mounting system for semiconductor devices
DE4331377A1 (de) * 1993-09-15 1995-03-16 Siemens Matsushita Components Elektrisches Bauelement
DE19952768A1 (de) * 1999-11-02 2001-05-31 Wincor Nixdorf Gmbh & Co Kg Vorrichtung zum thermischen Verbinden eines elektronischen Bauelementes mit einem Kühlkörper
DE102015219851B4 (de) * 2015-10-13 2018-05-17 Zf Friedrichshafen Ag Steuergerät

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
IT7821073U1 (it) * 1978-03-09 1979-09-09 Sgs Ates Componenti Elettr S P A Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore
DE2823699A1 (de) * 1978-05-31 1979-12-06 Bosch Gmbh Robert Anordnung mit einem kuehlkoerper fuer zwei halbleiterbauelemente
DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
DE8024180U1 (de) * 1980-09-10 1980-12-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Baugruppe
DE3128856A1 (de) * 1981-07-22 1983-02-10 Oelsch KG, 1000 Berlin Vorrichtung zum befestigen elektronischer bauteile auf einer leiterplatte
DE8130512U1 (de) * 1981-10-19 1982-06-16 GARDENA Präzisionstechnik GmbH, 7907 Niederstotzingen Clip zur befestigung von kuehlblechen an transistoren und dioden
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards
DE3315583A1 (de) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul
JPS59208762A (ja) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ソリツドステ−ト装置を放熱部材に圧接する装置
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique

Also Published As

Publication number Publication date
NL193232B (nl) 1998-11-02
FR2581250B1 (fr) 1991-06-21
DE3614086A1 (de) 1986-10-30
IT8520503A0 (it) 1985-04-26
DE3614086C2 (de) 1998-06-04
NL8601072A (nl) 1986-11-17
NL193232C (nl) 1999-03-03
FR2581250A1 (fr) 1986-10-31

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Effective date: 19970429