IT1217802B - Dispositivo a semiconduttore in contenitore in plastica con mezzo du abcioraggio tra lastrina porta "chip" e corpo in plastic - Google Patents

Dispositivo a semiconduttore in contenitore in plastica con mezzo du abcioraggio tra lastrina porta "chip" e corpo in plastic

Info

Publication number
IT1217802B
IT1217802B IT20885/88A IT2088588A IT1217802B IT 1217802 B IT1217802 B IT 1217802B IT 20885/88 A IT20885/88 A IT 20885/88A IT 2088588 A IT2088588 A IT 2088588A IT 1217802 B IT1217802 B IT 1217802B
Authority
IT
Italy
Prior art keywords
chip
semiconductor device
plastic
abcioraggio
door plate
Prior art date
Application number
IT20885/88A
Other languages
English (en)
Other versions
IT8820885A0 (it
Inventor
Cognetti De Martiis Carlo
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT20885/88A priority Critical patent/IT1217802B/it
Publication of IT8820885A0 publication Critical patent/IT8820885A0/it
Priority to EP19890110302 priority patent/EP0345760A3/en
Application granted granted Critical
Publication of IT1217802B publication Critical patent/IT1217802B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
IT20885/88A 1988-06-08 1988-06-08 Dispositivo a semiconduttore in contenitore in plastica con mezzo du abcioraggio tra lastrina porta "chip" e corpo in plastic IT1217802B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT20885/88A IT1217802B (it) 1988-06-08 1988-06-08 Dispositivo a semiconduttore in contenitore in plastica con mezzo du abcioraggio tra lastrina porta "chip" e corpo in plastic
EP19890110302 EP0345760A3 (en) 1988-06-08 1989-06-07 Semiconductor device in plastic case with means of anchoring between chip-bearing slice and plastic body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT20885/88A IT1217802B (it) 1988-06-08 1988-06-08 Dispositivo a semiconduttore in contenitore in plastica con mezzo du abcioraggio tra lastrina porta "chip" e corpo in plastic

Publications (2)

Publication Number Publication Date
IT8820885A0 IT8820885A0 (it) 1988-06-08
IT1217802B true IT1217802B (it) 1990-03-30

Family

ID=11173549

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20885/88A IT1217802B (it) 1988-06-08 1988-06-08 Dispositivo a semiconduttore in contenitore in plastica con mezzo du abcioraggio tra lastrina porta "chip" e corpo in plastic

Country Status (2)

Country Link
EP (1) EP0345760A3 (it)
IT (1) IT1217802B (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233152A (en) * 1989-06-10 1991-01-02 Plessey Co Plc Bonding a device to a substrate
US5397915A (en) * 1991-02-12 1995-03-14 Matsushita Electronics Corporation Semiconductor element mounting die pad including a plurality of extending portions
DE19639181B4 (de) * 1996-09-24 2006-08-17 Infineon Technologies Ag Mikroelektronisches Bauelement mit einem Zuleitungsrahmen und einem integrierten Schaltkreis
GB2320612A (en) * 1996-12-20 1998-06-24 Motorola Inc Encapsulating a component mounted on a substrate
JPH11307713A (ja) * 1998-04-24 1999-11-05 Sony Corp 半導体装置用リードフレーム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902189A (en) * 1974-04-10 1975-08-26 Hunt Electronics Prefabricated article and methods of maintaining the orientation of parts being bonded thereto
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS5916357A (ja) * 1982-07-19 1984-01-27 Nec Corp 半導体装置
JPS61185955A (ja) * 1985-02-13 1986-08-19 Toshiba Corp 半導体装置
JPS62200751A (ja) * 1986-02-28 1987-09-04 Dainippon Printing Co Ltd 半導体装置用リ−ドフレ−ム
JPS62268151A (ja) * 1986-05-16 1987-11-20 Hitachi Ltd 集積回路用リ−ドフレ−ム

Also Published As

Publication number Publication date
IT8820885A0 (it) 1988-06-08
EP0345760A2 (en) 1989-12-13
EP0345760A3 (en) 1990-11-14

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