IT1218088B - Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi - Google Patents

Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi

Info

Publication number
IT1218088B
IT1218088B IT20991/88A IT2099188A IT1218088B IT 1218088 B IT1218088 B IT 1218088B IT 20991/88 A IT20991/88 A IT 20991/88A IT 2099188 A IT2099188 A IT 2099188A IT 1218088 B IT1218088 B IT 1218088B
Authority
IT
Italy
Prior art keywords
equipment
electronic circuits
ceramic tiles
hybrid electronic
automatic separation
Prior art date
Application number
IT20991/88A
Other languages
English (en)
Other versions
IT8820991A0 (it
Inventor
Gian Piero Barozzi
Original Assignee
Aisa Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisa Spa filed Critical Aisa Spa
Priority to IT20991/88A priority Critical patent/IT1218088B/it
Publication of IT8820991A0 publication Critical patent/IT8820991A0/it
Priority to US07/365,458 priority patent/US5069195A/en
Priority to DE89201533T priority patent/DE68909316T2/de
Priority to EP19890201533 priority patent/EP0346997B1/en
Priority to JP1150650A priority patent/JPH0278504A/ja
Application granted granted Critical
Publication of IT1218088B publication Critical patent/IT1218088B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/329—Plural breakers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
IT20991/88A 1988-06-16 1988-06-16 Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi IT1218088B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT20991/88A IT1218088B (it) 1988-06-16 1988-06-16 Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
US07/365,458 US5069195A (en) 1988-06-16 1989-06-13 Apparatus for automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits
DE89201533T DE68909316T2 (de) 1988-06-16 1989-06-14 Vorrichtung zum automatischen Trennen entlang vorherbestimmter Biegebruchlinien in keramischen Grundplättchen von elektronischen Hybridschaltungen.
EP19890201533 EP0346997B1 (en) 1988-06-16 1989-06-14 Apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits
JP1150650A JPH0278504A (ja) 1988-06-16 1989-06-15 セラミック基板自動分離装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT20991/88A IT1218088B (it) 1988-06-16 1988-06-16 Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi

Publications (2)

Publication Number Publication Date
IT8820991A0 IT8820991A0 (it) 1988-06-16
IT1218088B true IT1218088B (it) 1990-04-12

Family

ID=11175072

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20991/88A IT1218088B (it) 1988-06-16 1988-06-16 Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi

Country Status (5)

Country Link
US (1) US5069195A (it)
EP (1) EP0346997B1 (it)
JP (1) JPH0278504A (it)
DE (1) DE68909316T2 (it)
IT (1) IT1218088B (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1953886A2 (en) 2007-02-05 2008-08-06 Bticino S.P.A. Box for wall mounting electrical apparatuses
CN112008900A (zh) * 2020-08-31 2020-12-01 广东东唯新材料有限公司 陶瓷岩板热加工弯曲成型装置及其成型方法

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NL9100658A (nl) * 1991-04-15 1992-11-02 Europ Patentverwertung Opstelling van scheidingsinrichtingen.
DE69208063T2 (de) * 1991-12-06 1996-05-30 James W Loomis Verfahren zum Schneiden von zerbrechlichen Halbleiterplättchen mit Anwendung von Anritzen und Brechen
JPH0553900U (ja) * 1991-12-24 1993-07-20 富士通テン株式会社 基板分割機
US5927582A (en) * 1997-08-05 1999-07-27 Duecker; Peter Separator for stacked corrugated board
JP3326384B2 (ja) * 1998-03-12 2002-09-24 古河電気工業株式会社 半導体ウエハーの劈開方法およびその装置
IL124199A (en) * 1998-04-23 2001-03-19 Sela Semiconductor Enginering Apparatus for cleaving crystals
US6267282B1 (en) * 1999-04-01 2001-07-31 Agere Systems Optoelectronics Guardian Corp. Method and apparatus for handling laser bars
DE29919961U1 (de) 1999-11-15 2000-04-27 Baumann GmbH, 92224 Amberg Vorrichtung zum Vereinzeln von elektrischen oder elektronischen Substraten aus eine Vielzahl solcher Substrate aufweisenden Mehrfachsubstraten
US6655566B1 (en) 2002-08-28 2003-12-02 Martin Family Trust Bundle breaker improvement
TW565688B (en) * 2002-09-25 2003-12-11 Au Optronics Corp Equal-arm linear glass breaker device
DE10314179A1 (de) * 2003-03-17 2004-10-07 Baumann Gmbh Brechvorrichtung für das Vereinzeln von Keramikleiterplatten
US20060261117A1 (en) * 2003-03-17 2006-11-23 Josef Konrad Breaking device for separating ceramic printed circuit boards
DE10311693B3 (de) * 2003-03-17 2004-12-02 Baumann Gmbh Brechvorrichtung für das Vereinzelnen von Keramikleiterplatten
DE102004022430A1 (de) * 2004-05-06 2005-12-01 Siemens Ag Verfahren zum maschinellen Vereinzeln von Schaltungsträgern aus einem Leiterplattennutzen
DE102004040671B4 (de) * 2004-08-20 2006-05-11 Sieghard Schiller Gmbh & Co. Kg Verfahren und Vorrichtung zum Brechen eines dünnen, plattenförmigen Gegenstands
US7262115B2 (en) * 2005-08-26 2007-08-28 Dynatex International Method and apparatus for breaking semiconductor wafers
US8220685B1 (en) * 2005-09-08 2012-07-17 Micro Processing Technology, Inc. System for breaking a semiconductor wafer or other workpiece along a scribe line
ATE554896T1 (de) * 2007-06-29 2012-05-15 J & L Group International Llc Jlgi Vorrichtung und verfahren zur trennung eines stapels von blättern von einem haufen von blättern
KR100959104B1 (ko) * 2008-07-16 2010-05-25 삼성모바일디스플레이주식회사 평판 디스플레이 패널 절단 장치
US20100108732A1 (en) * 2008-10-03 2010-05-06 Craig Gendreau Bundle breaker
KR20120107722A (ko) * 2011-03-22 2012-10-04 삼성디스플레이 주식회사 기판 절단 장치 및 그것을 이용한 기판 절단 방법
US10065340B2 (en) * 2011-11-10 2018-09-04 LatticeGear, LLC Device and method for cleaving
US10773420B2 (en) 2011-11-10 2020-09-15 LatticeGear, LLC Device and method for cleaving a substrate
JP4999029B1 (ja) * 2011-11-11 2012-08-15 株式会社Ｍａｒｕｗａ 裁断焼結セラミックシート及びその製造方法
FR2986175A1 (fr) * 2012-01-31 2013-08-02 St Microelectronics Tours Sas Procede et dispositif de decoupe d'une plaquette
KR102048921B1 (ko) * 2012-06-20 2019-11-27 삼성디스플레이 주식회사 셀 절단 장치 및 셀 절단 방법
EP2869440B1 (en) * 2012-07-02 2017-02-01 Nissan Motor Co., Ltd. Apparatus and method for manufacturing magnet segments constituting field pole magnetic body
CN102879937B (zh) * 2012-10-16 2015-04-22 深圳市华星光电技术有限公司 液晶面板的裂片装置及方法
JP6428642B2 (ja) * 2013-12-27 2018-11-28 Ａｇｃ株式会社 脆性板の加工方法、および脆性板の加工装置
JP2015191993A (ja) * 2014-03-28 2015-11-02 株式会社東京精密 半導体製造装置及び半導体の製造方法
US9685579B2 (en) 2014-12-05 2017-06-20 Solarcity Corporation Photovoltaic structure cleaving system
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
DE102016205902A1 (de) * 2015-04-29 2016-11-03 Tridonic Jennersdorf Gmbh Trennvorrichtung für Leiterplatten
CN105058609B (zh) * 2015-07-29 2017-07-25 高佳太阳能股份有限公司 硅锭切割用定位工装
CN107032114B (zh) * 2016-02-04 2023-04-14 苏州沃特维自动化系统有限公司 一种掰片装置
JP7015668B2 (ja) 2017-10-11 2022-02-03 株式会社ディスコ 板状物の分割装置
JP7098173B2 (ja) * 2020-02-12 2022-07-11 三星ダイヤモンド工業株式会社 脆性材料基板の分断機構
JP7137238B2 (ja) * 2020-09-30 2022-09-14 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
WO2023136103A1 (ja) * 2022-01-11 2023-07-20 三菱電機株式会社 基板分割治具
CN118288435A (zh) * 2024-03-22 2024-07-05 重庆两江联创电子有限公司 一种lcd板自动分粒装置及分粒方法

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FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1953886A2 (en) 2007-02-05 2008-08-06 Bticino S.P.A. Box for wall mounting electrical apparatuses
CN112008900A (zh) * 2020-08-31 2020-12-01 广东东唯新材料有限公司 陶瓷岩板热加工弯曲成型装置及其成型方法

Also Published As

Publication number Publication date
JPH0278504A (ja) 1990-03-19
EP0346997A2 (en) 1989-12-20
EP0346997B1 (en) 1993-09-22
US5069195A (en) 1991-12-03
IT8820991A0 (it) 1988-06-16
EP0346997A3 (en) 1990-12-12
DE68909316D1 (de) 1993-10-28
DE68909316T2 (de) 1994-04-28

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970628