IT1222092B - Condensatore di disaccoppiamento per un contenitore a schiera a griglia di piedini - Google Patents

Condensatore di disaccoppiamento per un contenitore a schiera a griglia di piedini

Info

Publication number
IT1222092B
IT1222092B IT21390/87A IT2139087A IT1222092B IT 1222092 B IT1222092 B IT 1222092B IT 21390/87 A IT21390/87 A IT 21390/87A IT 2139087 A IT2139087 A IT 2139087A IT 1222092 B IT1222092 B IT 1222092B
Authority
IT
Italy
Prior art keywords
grilled
feet
based container
decoupling condenser
decoupling
Prior art date
Application number
IT21390/87A
Other languages
English (en)
Other versions
IT8721390A0 (it
Inventor
Jorge M Hernandez
Aleta Gilderdale
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of IT8721390A0 publication Critical patent/IT8721390A0/it
Application granted granted Critical
Publication of IT1222092B publication Critical patent/IT1222092B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
IT21390/87A 1986-07-25 1987-07-22 Condensatore di disaccoppiamento per un contenitore a schiera a griglia di piedini IT1222092B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/890,489 US4667267A (en) 1985-01-22 1986-07-25 Decoupling capacitor for pin grid array package

Publications (2)

Publication Number Publication Date
IT8721390A0 IT8721390A0 (it) 1987-07-22
IT1222092B true IT1222092B (it) 1990-08-31

Family

ID=25396743

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21390/87A IT1222092B (it) 1986-07-25 1987-07-22 Condensatore di disaccoppiamento per un contenitore a schiera a griglia di piedini

Country Status (8)

Country Link
US (1) US4667267A (it)
JP (1) JPS63132415A (it)
BE (1) BE1001747A4 (it)
BR (1) BR8703752A (it)
DE (1) DE3724703A1 (it)
FR (1) FR2606206A1 (it)
GB (1) GB2193038B (it)
IT (1) IT1222092B (it)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734819A (en) * 1985-12-20 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package
US4864465A (en) * 1988-05-10 1989-09-05 The United States Of America Viad chip capacitor and method for making same
US4916576A (en) * 1989-02-27 1990-04-10 Fmtt, Inc. Matrix capacitor
US5422782A (en) * 1992-11-24 1995-06-06 Circuit Components Inc. Multiple resonant frequency decoupling capacitor
KR100277314B1 (ko) 1996-11-08 2001-01-15 모기 쥰이찌 박막콘덴서 및 이를탑재한반도체장치
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6159764A (en) * 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
US6400576B1 (en) 1999-04-05 2002-06-04 Sun Microsystems, Inc. Sub-package bypass capacitor mounting for an array packaged integrated circuit
US6806568B2 (en) * 2001-07-20 2004-10-19 The Board Of Trustees Of The University Of Arkansas Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods
JP3718161B2 (ja) * 2001-11-22 2005-11-16 ヒロセ電機株式会社 電子部品組立体及びそのためのユニット体
WO2006104613A2 (en) 2005-03-01 2006-10-05 X2Y Attenuators, Llc Conditioner with coplanar conductors
US20060273432A1 (en) * 2005-06-06 2006-12-07 Texas Instruments Incorporated Lead frame with attached components
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante
US20080218932A1 (en) * 2007-03-08 2008-09-11 Berlin Carl W Embedded capacitor
US20090073664A1 (en) * 2007-09-18 2009-03-19 Research In Motion Limited Decoupling capacitor assembly, integrated circuit/decoupling capacitor assembly and method for fabricating same
KR101024241B1 (ko) * 2008-12-26 2011-03-29 주식회사 하이닉스반도체 반도체 장치 및 그를 포함하는 반도체 패키지
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9258895B1 (en) * 2014-12-11 2016-02-09 John O. Tate Electronic device socket with an integrated decoupling capacitor and heat sink
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
CN112166484B (zh) * 2018-05-25 2022-05-03 松下知识产权经营株式会社 电容器
CN111225493B (zh) * 2018-11-26 2021-06-18 海信视像科技股份有限公司 一种电路板的布线结构及电路板
JP7405460B1 (ja) * 2022-07-04 2023-12-26 Ｎｅｃプラットフォームズ株式会社 回路基板および電子部品の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB948903A (it) *
GB619193A (en) * 1946-11-26 1949-03-04 Standard Telephones Cables Ltd Improvements in or relating to electrical condensers
US2939059A (en) * 1955-03-21 1960-05-31 Clevite Corp Capacitor of high permittivity ceramic
GB1000032A (en) * 1960-10-07 1965-08-04 Walter Schick Improvements relating to electrical capacitors
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies
US3467898A (en) * 1968-08-07 1969-09-16 Erie Technological Prod Inc Capacitor with terminal means
US3496435A (en) * 1968-12-09 1970-02-17 Corning Glass Works Encapsulated electrical capacitor
US4312026A (en) * 1979-04-11 1982-01-19 Tdk Electronics Co., Ltd. Chip ceramic capacitor
JPS594060A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置
US4502101A (en) * 1982-07-30 1985-02-26 Rogers Corporation Decoupled integrated circuit package
US4521828A (en) * 1982-12-23 1985-06-04 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads
US4475143A (en) * 1983-01-10 1984-10-02 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4513355A (en) * 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
US4494169A (en) * 1983-11-14 1985-01-15 Rogers Corporation Decoupling capacitor and method of manufacture thereof
JPS60117705A (ja) * 1983-11-30 1985-06-25 日本メクトロン株式会社 集積回路用バイパスコンデンサ
LU85135A1 (fr) * 1983-12-14 1985-09-12 Bonameau Jean Marie Dispositif de protection contre les perturbations et/ou des parasites au voisinage de circuits integres
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
DE3669614D1 (de) * 1985-01-17 1990-04-19 Eurofarad Keramischer hochfrequenzmehrschichtkondensator mit hoher kapazitaet.
FR2576448B1 (fr) * 1985-01-22 1989-04-14 Rogers Corp Condensateur de decouplage pour assemblage avec disposition a grille de broches
DE200670T1 (de) * 1985-05-03 1987-07-23 Rogers Corp., Rogers, Conn. Entkopplungskondensator und verfahren zu seiner herstellung.

Also Published As

Publication number Publication date
GB2193038A (en) 1988-01-27
DE3724703A1 (de) 1988-01-28
BE1001747A4 (fr) 1990-02-27
GB8717633D0 (en) 1987-09-03
US4667267A (en) 1987-05-19
IT8721390A0 (it) 1987-07-22
GB2193038B (en) 1990-07-25
JPS63132415A (ja) 1988-06-04
BR8703752A (pt) 1988-03-29
FR2606206A1 (fr) 1988-05-06

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