IT1223044B - Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto - Google Patents

Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto

Info

Publication number
IT1223044B
IT1223044B IT22491/87A IT2249187A IT1223044B IT 1223044 B IT1223044 B IT 1223044B IT 22491/87 A IT22491/87 A IT 22491/87A IT 2249187 A IT2249187 A IT 2249187A IT 1223044 B IT1223044 B IT 1223044B
Authority
IT
Italy
Prior art keywords
welding
procedure
support element
semiconductor component
semiconductor
Prior art date
Application number
IT22491/87A
Other languages
English (en)
Other versions
IT8722491A0 (it
Inventor
Francesco Blandano
Original Assignee
Italtel Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Italtel Spa filed Critical Italtel Spa
Priority to IT22491/87A priority Critical patent/IT1223044B/it
Publication of IT8722491A0 publication Critical patent/IT8722491A0/it
Priority to EP88202277A priority patent/EP0316026A1/en
Application granted granted Critical
Publication of IT1223044B publication Critical patent/IT1223044B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
IT22491/87A 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto IT1223044B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT22491/87A IT1223044B (it) 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto
EP88202277A EP0316026A1 (en) 1987-11-03 1988-10-12 Procedure for soldering a semiconductor component (chip) to a supporting unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT22491/87A IT1223044B (it) 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto

Publications (2)

Publication Number Publication Date
IT8722491A0 IT8722491A0 (it) 1987-11-03
IT1223044B true IT1223044B (it) 1990-09-12

Family

ID=11196985

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22491/87A IT1223044B (it) 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto

Country Status (2)

Country Link
EP (1) EP0316026A1 (it)
IT (1) IT1223044B (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2325080A (en) * 1997-05-07 1998-11-11 Mitel Semiconductor Ab Mountings for semiconductor light emitting devices
RU2313156C1 (ru) * 2006-05-03 2007-12-20 Государственное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Способ бессвинцовой контактно-реактивной пайки полупроводникового кристалла к корпусу
RU2347297C1 (ru) * 2007-05-28 2009-02-20 Федеральное государственное унитарное предприятие "Научно-исследовательский институт электронной техники" Способ монтажа кремниевых кристаллов на покрытую золотом поверхность
RU2636034C1 (ru) * 2016-05-25 2017-11-20 Акционерное общество "Научно-производственное предприятие "Пульсар" Способ пайки кристаллов дискретных полупроводниковых приборов к корпусу
RU2688037C1 (ru) * 2018-07-11 2019-05-17 Акционерное общество "Научно-производственное предприятие "Пульсар" Способ сборки гибридной фотоэлектрической схемы при непараллельном монтаже элементов

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1331980A (en) * 1970-12-15 1973-09-26 Mullard Ltd Mounting semiconductor bodies
GB2137131B (en) * 1983-03-15 1986-06-25 Standard Telephones Cables Ltd Bonding semiconductive bodies

Also Published As

Publication number Publication date
IT8722491A0 (it) 1987-11-03
EP0316026A1 (en) 1989-05-17

Similar Documents

Publication Publication Date Title
IT1223922B (it) Supporto oscillante per tenditori
IT1218677B (it) Dispositivo per la spremitura di pomidoro
IT1200765B (it) Elemento di fissaggio per tubazioni
DE3874469D1 (de) Messverfahren fuer halbleiteranordnung.
FI890123L (fi) Menetelmä valmistaa terapeuttisesti vaikuttavia indolyylipiperidiiniyhdisteitä
DK280088D0 (da) Grf-analoger vii
IT1184362B (it) Procedimento per effittuare la saldatura di componenti elettronici su un supporto
IT1182896B (it) Cinghia di supporto per fucile
FI874789L (fi) Menetelmä valmistaa farmakologisesti aktiivisia substituoituja 1H-imidatsoleja
IT1223044B (it) Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto
IT1227622B (it) Dispositivo per il supporto di una lente
IT1222892B (it) Elemento di serraggio
DK14488A (da) Grf-analoger v
FI864046A7 (fi) Menetelmä terapeuttisesti aktiivisen yhdisteen valmistamiseksi.
IT8767530A0 (it) Elemento di fissaggio particolarmente fascetta tubolare
IT8922316A0 (it) Elemento di fissaggio per il collegamento di almeno due corpi
IT1194216B (it) Elemento di supporto per macchine
IT1206267B (it) Dispositivo tenditore per fili
IT8348305A0 (it) Procedimento per la manifattura di un elemento di tetto
IT8821574A0 (it) Pinza di contatto per guardiaordito
IT8822148A0 (it) Profilato per il supporto di elementi strutturali
DD260367B5 (de) Rohrreaktor fuer Halbleiterprozesse
BR6602172U (pt) Elemento sustentador aperfeicoado
IT8429505V0 (it) Supporto a pilastrini
KR890014837U (ko) 반도체 리이드 프레임의 서포트 바

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951116