IT1225624B - Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet - Google Patents

Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet

Info

Publication number
IT1225624B
IT1225624B IT8883674A IT8367488A IT1225624B IT 1225624 B IT1225624 B IT 1225624B IT 8883674 A IT8883674 A IT 8883674A IT 8367488 A IT8367488 A IT 8367488A IT 1225624 B IT1225624 B IT 1225624B
Authority
IT
Italy
Prior art keywords
self
devices containing
integrated devices
semiconductor contact
contact procedure
Prior art date
Application number
IT8883674A
Other languages
English (en)
Other versions
IT8883674A0 (it
Inventor
Pier Luigi Crotti
Nadia Iazzi
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT8883674A priority Critical patent/IT1225624B/it
Publication of IT8883674A0 publication Critical patent/IT8883674A0/it
Priority to DE68916165T priority patent/DE68916165T2/de
Priority to EP89830445A priority patent/EP0365492B1/en
Priority to JP1274760A priority patent/JPH02164027A/ja
Priority to US07/424,446 priority patent/US4966867A/en
Application granted granted Critical
Publication of IT1225624B publication Critical patent/IT1225624B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/069—Manufacture or treatment of conductive parts of the interconnections by forming self-aligned vias or self-aligned contact plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H10D64/0113—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/911—Differential oxidation and etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers
IT8883674A 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet IT1225624B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT8883674A IT1225624B (it) 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet
DE68916165T DE68916165T2 (de) 1988-10-20 1989-10-16 Verfahren zum Herstellen von selbstjustierenden Metallhalbleiterkontakten in integrierten MISFET-Strukturen.
EP89830445A EP0365492B1 (en) 1988-10-20 1989-10-16 Process for forming self-aligned, metal-semiconductor contacts in integrated misfet structures
JP1274760A JPH02164027A (ja) 1988-10-20 1989-10-20 集積ｍｉｓｆｅｔ構造中の自己整列金属―半導体コンタクトの形成方法
US07/424,446 US4966867A (en) 1988-10-20 1989-10-20 Process for forming self-aligned, metal-semiconductor contacts in integrated MISFET structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8883674A IT1225624B (it) 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet

Publications (2)

Publication Number Publication Date
IT8883674A0 IT8883674A0 (it) 1988-10-20
IT1225624B true IT1225624B (it) 1990-11-22

Family

ID=11323765

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8883674A IT1225624B (it) 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet

Country Status (5)

Country Link
US (1) US4966867A (it)
EP (1) EP0365492B1 (it)
JP (1) JPH02164027A (it)
DE (1) DE68916165T2 (it)
IT (1) IT1225624B (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920010129B1 (ko) * 1989-11-30 1992-11-16 현대전자산업 주식회사 콘택홀의 패턴형성방법
US5240872A (en) * 1990-05-02 1993-08-31 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing semiconductor device having interconnection layer contacting source/drain regions
JP2934325B2 (ja) * 1990-05-02 1999-08-16 三菱電機株式会社 半導体装置およびその製造方法
KR930006128B1 (ko) * 1991-01-31 1993-07-07 삼성전자 주식회사 반도체장치의 금속 배선 형성방법
US5229325A (en) * 1991-01-31 1993-07-20 Samsung Electronics Co., Ltd. Method for forming metal wirings of semiconductor device
DE69229265T2 (de) * 1991-03-18 1999-09-23 Trustees Of Boston University, Boston Verfahren zur herstellung und dotierung hochisolierender dünner schichten aus monokristallinem galliumnitrid
US6953703B2 (en) * 1991-03-18 2005-10-11 The Trustees Of Boston University Method of making a semiconductor device with exposure of sapphire substrate to activated nitrogen
US5633192A (en) * 1991-03-18 1997-05-27 Boston University Method for epitaxially growing gallium nitride layers
US5231043A (en) * 1991-08-21 1993-07-27 Sgs-Thomson Microelectronics, Inc. Contact alignment for integrated circuits
US5200358A (en) * 1991-11-15 1993-04-06 At&T Bell Laboratories Integrated circuit with planar dielectric layer
US5250464A (en) * 1992-03-11 1993-10-05 Texas Instruments Incorporated Method of making a low capacitance, low resistance sidewall antifuse structure
US5302551A (en) * 1992-05-11 1994-04-12 National Semiconductor Corporation Method for planarizing the surface of an integrated circuit over a metal interconnect layer
KR950011986B1 (ko) * 1992-12-16 1995-10-13 현대전자산업주식회사 고집적 반도체 접속장치 제조방법
US5399533A (en) * 1993-12-01 1995-03-21 Vlsi Technology, Inc. Method improving integrated circuit planarization during etchback
US5597764A (en) * 1996-07-15 1997-01-28 Vanguard International Semiconductor Corporation Method of contact formation and planarization for semiconductor processes
US5994228A (en) * 1997-04-11 1999-11-30 Vanguard International Semiconductor Corporation Method of fabricating contact holes in high density integrated circuits using taper contact and self-aligned etching processes
KR100451500B1 (ko) * 1998-12-28 2004-12-08 주식회사 하이닉스반도체 반도체소자의제조방법
US7777321B2 (en) * 2002-04-22 2010-08-17 Gann Keith D Stacked microelectronic layer and module with three-axis channel T-connects
US6806559B2 (en) * 2002-04-22 2004-10-19 Irvine Sensors Corporation Method and apparatus for connecting vertically stacked integrated circuit chips
EP1917245A1 (de) 2005-08-21 2008-05-07 Abbott GmbH & Co. KG Heterocyclische verbindungen und ihre verwendung als bindungspartner für 5-ht5-rezeptoren
DE102007052167B4 (de) * 2007-10-31 2010-04-08 Advanced Micro Devices, Inc., Sunnyvale Halbleiterbauelement und Verfahren zum Einstellen der Höhe einer Gateelektrode in dem Halbleiterbauelement
WO2013032906A1 (en) * 2011-08-29 2013-03-07 Efficient Power Conversion Corporation Parallel connection methods for high performance transistors
US8921136B2 (en) * 2013-01-17 2014-12-30 Taiwan Semiconductor Manufacturing Co., Ltd. Self aligned contact formation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057895A (en) * 1976-09-20 1977-11-15 General Electric Company Method of forming sloped members of N-type polycrystalline silicon
US4319954A (en) * 1981-02-27 1982-03-16 Rca Corporation Method of forming polycrystalline silicon lines and vias on a silicon substrate
US4464824A (en) * 1982-08-18 1984-08-14 Ncr Corporation Epitaxial contact fabrication process
FR2537779B1 (fr) * 1982-12-10 1986-03-14 Commissariat Energie Atomique Procede de positionnement d'un trou de contact electrique entre deux lignes d'interconnexion d'un circuit integre
JPS59214239A (ja) * 1983-05-16 1984-12-04 Fujitsu Ltd 半導体装置の製造方法
US4508815A (en) * 1983-11-03 1985-04-02 Mostek Corporation Recessed metallization
US4523372A (en) * 1984-05-07 1985-06-18 Motorola, Inc. Process for fabricating semiconductor device
US4545852A (en) * 1984-06-20 1985-10-08 Hewlett-Packard Company Planarization of dielectric films on integrated circuits
JPS61260639A (ja) * 1985-05-14 1986-11-18 Sony Corp 半導体装置の製造方法
JPS63248145A (ja) * 1987-04-03 1988-10-14 Seiko Instr & Electronics Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH02164027A (ja) 1990-06-25
DE68916165T2 (de) 1994-09-22
EP0365492A3 (en) 1992-07-08
US4966867A (en) 1990-10-30
EP0365492B1 (en) 1994-06-15
IT8883674A0 (it) 1988-10-20
EP0365492A2 (en) 1990-04-25
DE68916165D1 (de) 1994-07-21

Similar Documents

Publication Publication Date Title
IT8883674A0 (it) Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet
EP0428247A3 (en) Semiconductor memory device with improved contact layout
EP0341000A3 (en) Gated turn-off semiconductor device
NO873944D0 (no) Elektrisk kontaktanordning med kontaktbeskyttelse.
NO871394L (no) Elektrisk kontakt-enhet.
KR920003677B1 (en) Metal-semiconductor mesfet device
IT8421688A0 (it) Procedimento e dispositivo per diffondere una o una pluralita' di impurita' in un corpo di semiconduttore.
EP0220517A3 (en) Semiconductor device having a contact area
DE69024680D1 (de) Halbleiter-Speichereinrichtung
FI863076A7 (fi) Kontaktanordning.
DK446887D0 (da) Elektrisk kontakteringsapparat med kontaktbeskyttelsesorgan
NL193883B (nl) Geïntegreerde halfgeleiderinrichting.
DK43887D0 (da) Kontaktploek
IT1242119B (it) Dispositivo di contatto elettrico.
DE3672198D1 (de) Kontaktiereinrichtung.
DE69512850D1 (de) Halbleiter-Diamant-Vorrichtung mit verbessertem Metall-Diamant-Kontakt
ATA240488A (de) Kontaktanordnung
EP0432796A3 (en) Semiconductor device and electrode block therefor
EP0296248A4 (en) SEMICONDUCTOR THERAPEUTIC DEVICE.
DE3683731D1 (de) Kontaktdurchgaenge in halbleiteranordnungen.
IT1228167B (it) Dispositivo di contatto.
GB2162366B (en) Semiconductor device contact arrangements
DE69020621D1 (de) Kontaktvorrichtung.
GB2185850B (en) Semiconductor device contact jig
GB8825678D0 (en) Semiconductor contact arrangement

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971030