IT1228105B - Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette - Google Patents

Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette

Info

Publication number
IT1228105B
IT1228105B IT8823031A IT2303188A IT1228105B IT 1228105 B IT1228105 B IT 1228105B IT 8823031 A IT8823031 A IT 8823031A IT 2303188 A IT2303188 A IT 2303188A IT 1228105 B IT1228105 B IT 1228105B
Authority
IT
Italy
Prior art keywords
slices
robotic
clamp
advantageously
handling
Prior art date
Application number
IT8823031A
Other languages
English (en)
Other versions
IT8823031A0 (it
Inventor
Mauro Alessanri
Giulio Iannuzzi
Renzo Carrera
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT8823031A priority Critical patent/IT1228105B/it
Publication of IT8823031A0 publication Critical patent/IT8823031A0/it
Priority to US07/446,196 priority patent/US5054834A/en
Application granted granted Critical
Publication of IT1228105B publication Critical patent/IT1228105B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
IT8823031A 1988-12-20 1988-12-20 Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette IT1228105B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT8823031A IT1228105B (it) 1988-12-20 1988-12-20 Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette
US07/446,196 US5054834A (en) 1988-12-20 1989-12-05 Gripper for the advantageously robotized handling of one or more silicon wafers and/or of a support for such wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8823031A IT1228105B (it) 1988-12-20 1988-12-20 Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette

Publications (2)

Publication Number Publication Date
IT8823031A0 IT8823031A0 (it) 1988-12-20
IT1228105B true IT1228105B (it) 1991-05-28

Family

ID=11203081

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8823031A IT1228105B (it) 1988-12-20 1988-12-20 Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette

Country Status (2)

Country Link
US (1) US5054834A (it)
IT (1) IT1228105B (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0446609A3 (en) * 1990-02-09 1992-04-08 Tadao Tozuka Robot finger structure
US5609376A (en) * 1995-09-08 1997-03-11 Micron Technology, Inc. Wafer carrier handle assembly
US5755475A (en) * 1996-04-04 1998-05-26 Zaytran, Inc. Device for gripping a workpiece
US5839770A (en) * 1997-06-26 1998-11-24 Zaytran, Inc. Robotic gripper
JP2002539621A (ja) * 1999-03-16 2002-11-19 エーディーイー コーポレーション ウエーハグリッピングフィンガ
US7175214B2 (en) * 2000-03-16 2007-02-13 Ade Corporation Wafer gripping fingers to minimize distortion
US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
JP5043021B2 (ja) * 2005-10-04 2012-10-10 アプライド マテリアルズ インコーポレイテッド 基板を乾燥するための方法及び装置
FR3151136A1 (fr) * 2023-07-11 2025-01-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif de prehension de plaquettes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
US4695217A (en) * 1983-11-21 1987-09-22 Lau John J Semiconductor wafer transfer apparatus
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
JPS61244040A (ja) * 1985-04-22 1986-10-30 Sony Corp ウエハ移載具
US4846626A (en) * 1987-02-09 1989-07-11 The Perkin-Elmer Corporation Wafer handling system
FR2627760B1 (fr) * 1988-02-26 1993-01-22 Stephanois Rech Mec Dispositif pour le transfert d'articles d'au moins un organe support a au moins un autre organe support
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers

Also Published As

Publication number Publication date
US5054834A (en) 1991-10-08
IT8823031A0 (it) 1988-12-20

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961227