IT1231664B - Impianto da vuoto a doppia camera per processi di deposizione di strati sottili - Google Patents

Impianto da vuoto a doppia camera per processi di deposizione di strati sottili

Info

Publication number
IT1231664B
IT1231664B IT8948236A IT4823689A IT1231664B IT 1231664 B IT1231664 B IT 1231664B IT 8948236 A IT8948236 A IT 8948236A IT 4823689 A IT4823689 A IT 4823689A IT 1231664 B IT1231664 B IT 1231664B
Authority
IT
Italy
Prior art keywords
thin layer
layer deposition
vacuum system
deposition processes
chamber vacuum
Prior art date
Application number
IT8948236A
Other languages
English (en)
Other versions
IT8948236A0 (it
Inventor
Carlo Misiano
Enrico Simonetti
Original Assignee
Consorzio Ce Te V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consorzio Ce Te V filed Critical Consorzio Ce Te V
Priority to IT8948236A priority Critical patent/IT1231664B/it
Publication of IT8948236A0 publication Critical patent/IT8948236A0/it
Priority to EP19900201912 priority patent/EP0410504A3/en
Application granted granted Critical
Publication of IT1231664B publication Critical patent/IT1231664B/it
Priority to US07/863,389 priority patent/US5174827A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006Processes utilising sub-atmospheric pressure; Apparatus therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
IT8948236A 1989-07-26 1989-07-26 Impianto da vuoto a doppia camera per processi di deposizione di strati sottili IT1231664B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT8948236A IT1231664B (it) 1989-07-26 1989-07-26 Impianto da vuoto a doppia camera per processi di deposizione di strati sottili
EP19900201912 EP0410504A3 (en) 1989-07-26 1990-07-13 A double chamber vacuum plant for deposition processes of thin layers
US07/863,389 US5174827A (en) 1989-07-26 1992-04-03 Double chamber vacuum apparatus for thin layer deposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8948236A IT1231664B (it) 1989-07-26 1989-07-26 Impianto da vuoto a doppia camera per processi di deposizione di strati sottili

Publications (2)

Publication Number Publication Date
IT8948236A0 IT8948236A0 (it) 1989-07-26
IT1231664B true IT1231664B (it) 1991-12-18

Family

ID=11265408

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8948236A IT1231664B (it) 1989-07-26 1989-07-26 Impianto da vuoto a doppia camera per processi di deposizione di strati sottili

Country Status (2)

Country Link
EP (1) EP0410504A3 (it)
IT (1) IT1231664B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5766360A (en) * 1992-03-27 1998-06-16 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method
FI95421C (fi) * 1993-12-23 1996-01-25 Heikki Ihantola Puolijohteen, kuten piikiekon, prosessoinnissa käytettävä laitteisto ja menetelmä
BE1011252A3 (nl) * 1997-07-04 1999-06-01 Burcht Tandtech Lab Bvba Werkwijze en inrichting voor het aanbrengen van een bekleding op voorwerpen.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
JPS63157870A (ja) * 1986-12-19 1988-06-30 Anelva Corp 基板処理装置

Also Published As

Publication number Publication date
EP0410504A3 (en) 1991-08-07
EP0410504A2 (en) 1991-01-30
IT8948236A0 (it) 1989-07-26

Similar Documents

Publication Publication Date Title
IT8720748A0 (it) Impianto di rivestimento sotto vuoto per substrati ottici.
IT8620793A0 (it) Procedimento per il rivestimento di substrati in una camera a vuoto.
EP0476652A3 (en) Method for depositing thin film on substrate by sputtering process
DE59206344D1 (de) Magnetron-Zerstäubungskathode für Vakuumbeschichtungsanlagen
EP0476676A3 (en) Thin film deposition method
EP0451571A3 (en) Sputtering process for forming aluminum layer over stepped semiconductor wafer
ITMI911294A1 (it) Impianto per il rivestimento sotto vuoto di substrati ottici
FR2670693B1 (fr) Procede pour nettoyer la surface d'un substrat par plasma.
GB8718653D0 (en) Thin film deposition process
EP0444253A3 (en) Apparatus for the deposition of thin layers on a substrate
ITMI930025A0 (it) Impianto di rivestimento sotto alto vuoto
GB2193976B (en) Process for depositing a polysilicon film on a substrate
GB8707322D0 (en) Thin film deposition process
IT1231664B (it) Impianto da vuoto a doppia camera per processi di deposizione di strati sottili
GB9113636D0 (en) Thin film deposition apparatus
ITMI930460A0 (it) Impianto di rivestimento sotto alto vuoto
NO930793L (no) Fremgangsmaate for fremstilling av tynnplate-aluminium
AU7137087A (en) Process for forming deposited film
FR2732161B1 (fr) Procede de fabrication d'un substrat metallise
AU5329990A (en) Process for depositing a ceramic coating on a filament
IT1240811B (it) Metodo per la deposizione di strati sottili con assistenza di ioni da plasma rf.
KR900008714A (ko) 플라즈마 화학기상증착에 의한 박막제조방법
IT1197069B (it) Trappola a fluido refrigerante per evaporatori sotto vuoto per la deposizione di sottili pellicole metalliche
TR26836A (tr) Seramik esyalarin kaplanmasi icin uygun cam seramik bilesimi
IT8948027A0 (it) Metodo, del tipo "ion plating", per la deposizione di strati sottili sotto vuoto

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970404