IT1231887B - Procedimento per la produzione di circuiti integrati monolitici - Google Patents
Procedimento per la produzione di circuiti integrati monoliticiInfo
- Publication number
- IT1231887B IT1231887B IT8722216A IT2221687A IT1231887B IT 1231887 B IT1231887 B IT 1231887B IT 8722216 A IT8722216 A IT 8722216A IT 2221687 A IT2221687 A IT 2221687A IT 1231887 B IT1231887 B IT 1231887B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- production
- integrated circuits
- monolithic integrated
- monolithic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H10P14/6923—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/909—Controlled atmosphere
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8722216A IT1231887B (it) | 1987-10-09 | 1987-10-09 | Procedimento per la produzione di circuiti integrati monolitici |
| DE3854710T DE3854710T2 (de) | 1987-10-09 | 1988-09-16 | Verfahren zum Herstellen von monolithischen Halbleiterschaltungen. |
| EP88115210A EP0310839B1 (en) | 1987-10-09 | 1988-09-16 | A method of manufacturing monolithic integrated circuits |
| US07/249,788 US4920077A (en) | 1987-10-09 | 1988-09-27 | Method of manufacturing monolythic integrated circuits |
| JP63252237A JPH02313A (ja) | 1987-10-09 | 1988-10-07 | モノリシック集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8722216A IT1231887B (it) | 1987-10-09 | 1987-10-09 | Procedimento per la produzione di circuiti integrati monolitici |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8722216A0 IT8722216A0 (it) | 1987-10-09 |
| IT1231887B true IT1231887B (it) | 1992-01-15 |
Family
ID=11193182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT8722216A IT1231887B (it) | 1987-10-09 | 1987-10-09 | Procedimento per la produzione di circuiti integrati monolitici |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4920077A (it) |
| EP (1) | EP0310839B1 (it) |
| JP (1) | JPH02313A (it) |
| DE (1) | DE3854710T2 (it) |
| IT (1) | IT1231887B (it) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5432128A (en) * | 1994-05-27 | 1995-07-11 | Texas Instruments Incorporated | Reliability enhancement of aluminum interconnects by reacting aluminum leads with a strengthening gas |
| US5514628A (en) * | 1995-05-26 | 1996-05-07 | Texas Instruments Incorporated | Two-step sinter method utilized in conjunction with memory cell replacement by redundancies |
| US6013584A (en) * | 1997-02-19 | 2000-01-11 | Applied Materials, Inc. | Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications |
| US6073576A (en) | 1997-11-25 | 2000-06-13 | Cvc Products, Inc. | Substrate edge seal and clamp for low-pressure processing equipment |
| US6350673B1 (en) * | 1998-08-13 | 2002-02-26 | Texas Instruments Incorporated | Method for decreasing CHC degradation |
| WO2001078126A2 (en) * | 2000-04-07 | 2001-10-18 | Philips Semiconductors, Inc. | A method of passivating a metal line on a wafer |
| DE10114764B4 (de) * | 2001-03-26 | 2005-08-11 | Infineon Technologies Ag | Verfahren zur Herstellung eines integrierten Schaltkreises mit einer dynamischen Speicherzellen-Anordnung (DRAM) mit einer langen Retention-Time |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2058731A (en) * | 1979-09-12 | 1981-04-15 | Philips Electronic Associated | Method of making semiconductor devices |
| US4380115A (en) * | 1979-12-06 | 1983-04-19 | Solid State Scientific, Inc. | Method of making a semiconductor device with a seal |
| JPS5957458A (ja) * | 1982-09-27 | 1984-04-03 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH071764B2 (ja) * | 1984-06-01 | 1995-01-11 | テキサス インスツルメンツ インコ−ポレイテツド | 半導体装置の製造方法 |
| JPH0622234B2 (ja) * | 1984-07-20 | 1994-03-23 | 富士通株式会社 | 半導体装置の製造方法 |
| JPS61212025A (ja) * | 1985-03-18 | 1986-09-20 | Hitachi Ltd | Psg膜の形成方法 |
| EP0225224A3 (en) * | 1985-10-29 | 1987-11-19 | Thomson Components-Mostek Corporation | After oxide metal alloy process |
-
1987
- 1987-10-09 IT IT8722216A patent/IT1231887B/it active
-
1988
- 1988-09-16 EP EP88115210A patent/EP0310839B1/en not_active Expired - Lifetime
- 1988-09-16 DE DE3854710T patent/DE3854710T2/de not_active Expired - Fee Related
- 1988-09-27 US US07/249,788 patent/US4920077A/en not_active Expired - Lifetime
- 1988-10-07 JP JP63252237A patent/JPH02313A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0310839B1 (en) | 1995-11-22 |
| IT8722216A0 (it) | 1987-10-09 |
| US4920077A (en) | 1990-04-24 |
| EP0310839A1 (en) | 1989-04-12 |
| DE3854710T2 (de) | 1996-08-01 |
| JPH02313A (ja) | 1990-01-05 |
| DE3854710D1 (de) | 1996-01-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971030 |