IT1244184B - Struttura di alloggiamento per dispositivi a semiconduttore - Google Patents

Struttura di alloggiamento per dispositivi a semiconduttore

Info

Publication number
IT1244184B
IT1244184B IT02240190A IT2240190A IT1244184B IT 1244184 B IT1244184 B IT 1244184B IT 02240190 A IT02240190 A IT 02240190A IT 2240190 A IT2240190 A IT 2240190A IT 1244184 B IT1244184 B IT 1244184B
Authority
IT
Italy
Prior art keywords
semiconductor devices
housing structure
housing
semiconductor
devices
Prior art date
Application number
IT02240190A
Other languages
English (en)
Other versions
IT9022401A0 (it
IT9022401A1 (it
Inventor
Roger Filmore Calmead Bennett
David Charles Ham
Original Assignee
Westinghouse Brake & Signal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake & Signal filed Critical Westinghouse Brake & Signal
Publication of IT9022401A0 publication Critical patent/IT9022401A0/it
Publication of IT9022401A1 publication Critical patent/IT9022401A1/it
Application granted granted Critical
Publication of IT1244184B publication Critical patent/IT1244184B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
IT02240190A 1989-12-18 1990-12-17 Struttura di alloggiamento per dispositivi a semiconduttore IT1244184B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898928492A GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices

Publications (3)

Publication Number Publication Date
IT9022401A0 IT9022401A0 (it) 1990-12-17
IT9022401A1 IT9022401A1 (it) 1991-06-19
IT1244184B true IT1244184B (it) 1994-07-08

Family

ID=10668090

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02240190A IT1244184B (it) 1989-12-18 1990-12-17 Struttura di alloggiamento per dispositivi a semiconduttore

Country Status (4)

Country Link
JP (1) JPH0744050U (it)
DE (1) DE9016960U1 (it)
GB (2) GB8928492D0 (it)
IT (1) IT1244184B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469304B2 (ja) * 1994-04-12 2003-11-25 三菱電機株式会社 半導体装置
JP5709491B2 (ja) * 2010-11-30 2015-04-30 京セラクリスタルデバイス株式会社 電子デバイスの製造方法
US11380557B2 (en) * 2017-06-05 2022-07-05 Applied Materials, Inc. Apparatus and method for gas delivery in semiconductor process chambers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2941688A (en) * 1957-12-31 1960-06-21 Tung Sol Electric Inc Encapsulation of electronic component and method of making the same
GB1038686A (en) * 1964-06-04 1966-08-10 Westinghouse Brake & Signal Improvements relating to the encapsulation of semi-conductor devices
GB1176519A (en) * 1967-11-28 1970-01-07 Westinghouse Brake & Signal Semiconductor Devices and the Manufacture Thereof
US3753054A (en) * 1970-01-02 1973-08-14 Texas Instruments Inc Hermetically sealed electronic package
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
US3751800A (en) * 1970-08-04 1973-08-14 Gen Motors Corp Method of fabricating a semiconductor enclosure
FR2182791B1 (it) * 1972-05-03 1977-12-30 Siemens Ag
JPH065686B2 (ja) * 1985-09-04 1994-01-19 株式会社日立製作所 圧接型半導体装置

Also Published As

Publication number Publication date
GB2239127A (en) 1991-06-19
DE9016960U1 (de) 1991-04-04
GB9027122D0 (en) 1991-02-06
GB8928492D0 (en) 1990-02-21
IT9022401A0 (it) 1990-12-17
JPH0744050U (ja) 1995-10-24
GB2239127B (en) 1993-07-07
IT9022401A1 (it) 1991-06-19

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961223