IT1261464B - Procedimento per la connessione di un circuito integrato ad un circuito esterno. - Google Patents

Procedimento per la connessione di un circuito integrato ad un circuito esterno.

Info

Publication number
IT1261464B
IT1261464B ITRM930273A ITRM930273A IT1261464B IT 1261464 B IT1261464 B IT 1261464B IT RM930273 A ITRM930273 A IT RM930273A IT RM930273 A ITRM930273 A IT RM930273A IT 1261464 B IT1261464 B IT 1261464B
Authority
IT
Italy
Prior art keywords
circuit
integrated circuit
procedure
external circuit
external
Prior art date
Application number
ITRM930273A
Other languages
English (en)
Inventor
Pasquale Amideo
Roberto Salvati
Original Assignee
Consorzio Eagle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consorzio Eagle filed Critical Consorzio Eagle
Priority to ITRM930273A priority Critical patent/IT1261464B/it
Publication of ITRM930273A0 publication Critical patent/ITRM930273A0/it
Priority to EP94830204A priority patent/EP0622839A3/en
Publication of ITRM930273A1 publication Critical patent/ITRM930273A1/it
Application granted granted Critical
Publication of IT1261464B publication Critical patent/IT1261464B/it

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
    • G06F15/0216—Constructional details or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computing Systems (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wire Bonding (AREA)

Abstract

L'invenzione riguarda un procedimento per la connessione di un circuito integrato ad un circuito esterno, comprendente le fasi di:- allineare il circuito integrato con un circuito esterno,- disporre uno strato di materiale anisotropico tra il circuito integrato e il circuito esterno; e - connettere per termocompressione detto circuito integrato a detto circuito esterno.
ITRM930273A 1993-04-30 1993-04-30 Procedimento per la connessione di un circuito integrato ad un circuito esterno. IT1261464B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITRM930273A IT1261464B (it) 1993-04-30 1993-04-30 Procedimento per la connessione di un circuito integrato ad un circuito esterno.
EP94830204A EP0622839A3 (en) 1993-04-30 1994-04-29 Method for connecting an integrated circuit to an external circuit.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITRM930273A IT1261464B (it) 1993-04-30 1993-04-30 Procedimento per la connessione di un circuito integrato ad un circuito esterno.

Publications (3)

Publication Number Publication Date
ITRM930273A0 ITRM930273A0 (it) 1993-04-30
ITRM930273A1 ITRM930273A1 (it) 1994-10-30
IT1261464B true IT1261464B (it) 1996-05-23

Family

ID=11401735

Family Applications (1)

Application Number Title Priority Date Filing Date
ITRM930273A IT1261464B (it) 1993-04-30 1993-04-30 Procedimento per la connessione di un circuito integrato ad un circuito esterno.

Country Status (2)

Country Link
EP (1) EP0622839A3 (it)
IT (1) IT1261464B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW277152B (it) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
JP3928753B2 (ja) * 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225438A (ja) * 1984-04-23 1985-11-09 Seiko Epson Corp Ｉｃ実装構造
JPS62244143A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 半導体素子の電気的接続方法
JPH01129431A (ja) * 1987-11-16 1989-05-22 Sharp Corp 半導体チップ実装方式
US5123986A (en) * 1989-08-10 1992-06-23 Casio Computer Co., Ltd. Conductive connecting method

Also Published As

Publication number Publication date
ITRM930273A0 (it) 1993-04-30
ITRM930273A1 (it) 1994-10-30
EP0622839A3 (en) 1995-03-29
EP0622839A2 (en) 1994-11-02

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960411