IT1266517B1 - Procedimento ed apparecchio per la dissipazione di energia termica. - Google Patents

Procedimento ed apparecchio per la dissipazione di energia termica.

Info

Publication number
IT1266517B1
IT1266517B1 IT93RM000320A ITRM930320A IT1266517B1 IT 1266517 B1 IT1266517 B1 IT 1266517B1 IT 93RM000320 A IT93RM000320 A IT 93RM000320A IT RM930320 A ITRM930320 A IT RM930320A IT 1266517 B1 IT1266517 B1 IT 1266517B1
Authority
IT
Italy
Prior art keywords
heat sink
pins
sink body
dissipation
procedure
Prior art date
Application number
IT93RM000320A
Other languages
English (en)
Inventor
William D Jordan
Howard G Hinshaw
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Publication of ITRM930320A0 publication Critical patent/ITRM930320A0/it
Publication of ITRM930320A1 publication Critical patent/ITRM930320A1/it
Application granted granted Critical
Publication of IT1266517B1 publication Critical patent/IT1266517B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un apparecchio dissipatore termico per raffreddare dispositivi elettronici di grande dimensione è formato con un corpo di dissipatore termico avente una pluralità di perni che si estendono all'esterno dalla base del corpo del dissipatore termico ed un ventilatore rotante che ha una superficie di soffiatura montata adiacente alla estremità esterna dei perni. I perni sono separati da scanalature che si intersecano che forniscono una grande area superficiale per il corpo del dissipatore termico. L'area superficiale del corpo del dissipatore termico è sufficientemente grande per fornire una impedenza termica sostanzialmente minore di 1,0°C/W e il volume occupato dal dissipatore termico è sufficientemente piccolo per fornire un valore di prestazione di volume minore di circa 60°C pollici cubi/W.
IT93RM000320A 1993-03-30 1993-05-14 Procedimento ed apparecchio per la dissipazione di energia termica. IT1266517B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3995593A 1993-03-30 1993-03-30

Publications (3)

Publication Number Publication Date
ITRM930320A0 ITRM930320A0 (it) 1993-05-14
ITRM930320A1 ITRM930320A1 (it) 1994-11-14
IT1266517B1 true IT1266517B1 (it) 1996-12-30

Family

ID=21908286

Family Applications (1)

Application Number Title Priority Date Filing Date
IT93RM000320A IT1266517B1 (it) 1993-03-30 1993-05-14 Procedimento ed apparecchio per la dissipazione di energia termica.

Country Status (6)

Country Link
US (1) US5486980A (it)
JP (1) JP3415648B2 (it)
DE (1) DE4312927A1 (it)
FR (1) FR2703443B1 (it)
GB (1) GB2276763B (it)
IT (1) IT1266517B1 (it)

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WO1996036205A1 (en) * 1995-05-11 1996-11-14 International Electronic Research Corporation Enhanced heat sink
US5896917A (en) * 1996-02-22 1999-04-27 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
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US5957194A (en) 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US5740014A (en) * 1996-12-11 1998-04-14 Lin; Chun Sheng CPU heat sink
DE19712723A1 (de) * 1997-03-26 1998-10-01 Ego Elektro Geraetebau Gmbh Kühlkörper
US6301779B1 (en) 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
US6308771B1 (en) 1998-10-29 2001-10-30 Advanced Thermal Solutions, Inc. High performance fan tail heat exchanger
US7584780B1 (en) 1998-12-09 2009-09-08 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
JP3431004B2 (ja) * 2000-01-14 2003-07-28 松下電器産業株式会社 ヒートシンクおよびそれを用いた冷却装置
US6301110B1 (en) * 1999-09-30 2001-10-09 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
DE10009398C2 (de) * 2000-02-28 2002-03-14 Epcos Ag Kühlkörpermodul und Anordnung von Kühlkörpermodulen
US6334481B1 (en) * 2001-05-04 2002-01-01 Asia Vital Components Co., Ltd. Retainer for a cooling device
JP4468609B2 (ja) * 2001-05-21 2010-05-26 株式会社ルネサステクノロジ 半導体装置
USD465771S1 (en) 2001-07-24 2002-11-19 Hsieh Hsin-Mao Heat dissipating assembly
US6446708B1 (en) * 2001-10-17 2002-09-10 Tai-Sol Electronics Co., Ltd. Heat dissipating device
AT413163B (de) * 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog Kühlvorrichtung für einen chip sowie verfahren zur herstellung
US6633485B1 (en) * 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
CN2698566Y (zh) * 2004-03-27 2005-05-11 鸿富锦精密工业（深圳）有限公司 制造风扇框架的模具
US7147041B2 (en) * 2004-05-03 2006-12-12 Parker-Hannifin Corporation Lightweight heat sink
WO2006017301A2 (en) * 2004-07-13 2006-02-16 Thorrn Micro Technologies, Inc. Micro-channel heat sink
US20060021736A1 (en) * 2004-07-29 2006-02-02 International Rectifier Corporation Pin type heat sink for channeling air flow
JP4562770B2 (ja) 2005-04-15 2010-10-13 富士通株式会社 ヒートシンク、回路基板、電子機器
JP2006319142A (ja) * 2005-05-12 2006-11-24 Sanyo Denki Co Ltd 発熱体冷却装置及びヒートシンク
US7235895B2 (en) * 2005-10-13 2007-06-26 General Electric Company Method and apparatus for gravity induced thermal energy dissipation
US7289330B2 (en) * 2005-11-10 2007-10-30 Fu Shun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fan mounting device
US7373718B2 (en) * 2006-01-06 2008-05-20 Asia Vital Components Co., Ltd. Test device for a heat dissipating fan
CN101060763B (zh) * 2006-04-19 2011-08-24 鸿富锦精密工业（深圳）有限公司 散热装置
US7493940B2 (en) * 2006-10-10 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having mounting brackets
US20080128110A1 (en) * 2006-11-30 2008-06-05 Foxconn Technology Co., Ltd. Heat sink assembly having a fan mounting device
CN101212880B (zh) * 2006-12-29 2010-04-14 富准精密工业(深圳)有限公司 散热装置
US20090219687A1 (en) * 2008-03-03 2009-09-03 Jui-Nan Lin Memory heat-dissipating mechanism
CN101667733B (zh) * 2009-09-28 2012-03-07 常州市默顿电气有限公司 电容补偿投切开关
FI126380B (en) * 2014-10-27 2016-11-15 Kone Corp The drive unit
FR3063864B1 (fr) * 2017-03-09 2019-07-05 Aptiv Technologies Limited Dispositif electronique pour vehicule automobile
CN209893722U (zh) 2019-02-19 2020-01-03 青岛海尔电冰箱有限公司 冷藏冷冻装置
US12557251B1 (en) * 2023-05-09 2026-02-17 Brunswick Corporation Chassis for electronic device

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DE2618262C3 (de) * 1976-04-27 1980-01-10 Ing. Rolf Seifert Electronic, 5828 Ennepetal Wärmetauscher
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DE3041656A1 (de) * 1980-11-05 1982-05-13 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiter-schaltungsaufbau
JPS59202657A (ja) * 1983-04-29 1984-11-16 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション １体構造ヒ−トシンク
US4557225A (en) * 1984-01-18 1985-12-10 Mikuni Kogyo Kabushiki Kaisha Combined housing and heat sink for electronic engine control system components
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EP0267772B1 (en) * 1986-11-10 1993-01-13 Microelectronics and Computer Technology Corporation Heat exchanger and method of making same
GB2204181B (en) * 1987-04-27 1990-03-21 Thermalloy Inc Heat sink apparatus and method of manufacture
DE68923778T2 (de) * 1988-12-01 1996-04-11 Akzo Nobel Nv Halbleitermodul.
JPH062314Y2 (ja) * 1989-08-30 1994-01-19 ナカミチ株式会社 放熱装置
US5020586A (en) * 1989-09-08 1991-06-04 Hewlett-Packard Company Air-cooled heat exchanger for electronic circuit modules
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US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly

Also Published As

Publication number Publication date
GB2276763A8 (en) 1997-03-17
DE4312927A1 (de) 1994-10-06
FR2703443B1 (fr) 1996-02-02
GB2276763A (en) 1994-10-05
HK1006605A1 (en) 1999-03-05
GB2276763B (en) 1997-05-07
JPH0758470A (ja) 1995-03-03
JP3415648B2 (ja) 2003-06-09
US5486980A (en) 1996-01-23
GB9307046D0 (en) 1993-05-26
ITRM930320A0 (it) 1993-05-14
FR2703443A1 (fr) 1994-10-07
ITRM930320A1 (it) 1994-11-14

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960607