IT1269708B - Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato - Google Patents

Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato

Info

Publication number
IT1269708B
IT1269708B ITMI940172A ITMI940172A IT1269708B IT 1269708 B IT1269708 B IT 1269708B IT MI940172 A ITMI940172 A IT MI940172A IT MI940172 A ITMI940172 A IT MI940172A IT 1269708 B IT1269708 B IT 1269708B
Authority
IT
Italy
Prior art keywords
power components
heat
configuration
printed circuit
components mounted
Prior art date
Application number
ITMI940172A
Other languages
English (en)
Inventor
Reinhard Fassel
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI940172A0 publication Critical patent/ITMI940172A0/it
Publication of ITMI940172A1 publication Critical patent/ITMI940172A1/it
Application granted granted Critical
Publication of IT1269708B publication Critical patent/IT1269708B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Si propone una configurazione per la sottrazione di calore dai componenti di potenza montati su piastre a circuito stampato, la quale configurazione serve a dirottare verso la faccia opposta della piastra il calore prodotto e la piastra è provvista di fori per la trasmissione del calore e, in corrispondenza dei componenti di potenza e dei fori previsti per la trasmissione del calore come pure sulla faccia della piastra che è opposta ai componenti di potenza, è applicato un materiale termoconduttore e la faccia della piastra opposta a quella dei componenti di potenza è rivestita con una vernice isolante e con una vernice elastica termoconduttrice (figura).
ITMI940172A 1993-02-03 1994-02-01 Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato IT1269708B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4302917A DE4302917C1 (de) 1993-02-03 1993-02-03 Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen

Publications (3)

Publication Number Publication Date
ITMI940172A0 ITMI940172A0 (it) 1994-02-01
ITMI940172A1 ITMI940172A1 (it) 1995-08-01
IT1269708B true IT1269708B (it) 1997-04-15

Family

ID=6479459

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI940172A IT1269708B (it) 1993-02-03 1994-02-01 Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato

Country Status (5)

Country Link
US (1) US5394301A (it)
JP (1) JPH06244574A (it)
DE (1) DE4302917C1 (it)
FR (1) FR2701190A1 (it)
IT (1) IT1269708B (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699231A (en) * 1995-11-24 1997-12-16 Xerox Corporation Method of packaging high voltage components with low voltage components in a small space
US5831826A (en) * 1996-09-20 1998-11-03 Motorola, Inc. Heat transfer apparatus suitable for use in a circuit board assembly
DE19654606C2 (de) * 1996-12-20 1998-10-22 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
DE10035170B4 (de) * 2000-07-19 2005-11-24 Siemens Ag Keramikkörper mit Temperiervorrichtung, Verfahren zum Herstellen und Verwendung des Keramikkörpers
US6797889B1 (en) * 2002-05-30 2004-09-28 Johnson Controls Automotive Electronics Assembly of power circuits and numerical data printed on a multilayer board
DE10250697A1 (de) * 2002-10-31 2004-05-13 Hella Kg Hueck & Co. Leiterplatte
US7561430B2 (en) * 2007-04-30 2009-07-14 Watlow Electric Manufacturing Company Heat management system for a power switching device
ITRN20130032A1 (it) * 2013-08-10 2015-02-11 Rebernig Supervisioni Srl Dispositivo elettrico e/o elettronico comprendente almeno un circuito stampato.
CN107896422A (zh) * 2017-11-21 2018-04-10 生益电子股份有限公司 一种快速散热的pcb
CN107734839A (zh) * 2017-11-21 2018-02-23 生益电子股份有限公司 一种pcb
JP2022160336A (ja) * 2021-04-06 2022-10-19 日本電産エレシス株式会社 回路基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE330167C (de) * 1919-02-25 1922-02-17 Landw Lichen Bedarf G M B H Ge Verfahren zur Herstellung eines Duengemittels
DE2743647C3 (de) * 1977-09-28 1980-04-10 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur Kühlung von Bauelementen der elektrischen Nachrichten- und Meßtechnik
DE8114325U1 (de) * 1981-05-14 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Wärmeableitungsvorrichtung
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
FR2620587B1 (fr) * 1987-09-16 1993-07-02 Telemecanique Electrique Circuit imprime equipe d'un drain thermique
JPH01161888A (ja) * 1987-12-18 1989-06-26 Cmk Corp プリント配線板
DE3813364A1 (de) * 1988-04-21 1989-11-02 Bodenseewerk Geraetetech Vorrichtung zur waermeabfuhr von bauelementen auf einer leiterplatte
CA1307355C (en) * 1988-05-26 1992-09-08 David C. Degree Soft-faced semiconductor component backing
US4941067A (en) * 1989-04-07 1990-07-10 Motorola Inc. Thermal shunt for electronic circuits
US4965699A (en) * 1989-04-18 1990-10-23 Magnavox Government And Industrial Electronics Company Circuit card assembly cold plate
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same

Also Published As

Publication number Publication date
DE4302917C1 (de) 1994-07-07
FR2701190A1 (fr) 1994-08-05
US5394301A (en) 1995-02-28
ITMI940172A1 (it) 1995-08-01
JPH06244574A (ja) 1994-09-02
ITMI940172A0 (it) 1994-02-01

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Legal Events

Date Code Title Description
0001 Granted