IT1285334B1 - Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti - Google Patents

Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti

Info

Publication number
IT1285334B1
IT1285334B1 IT96TO000415A ITTO960415A IT1285334B1 IT 1285334 B1 IT1285334 B1 IT 1285334B1 IT 96TO000415 A IT96TO000415 A IT 96TO000415A IT TO960415 A ITTO960415 A IT TO960415A IT 1285334 B1 IT1285334 B1 IT 1285334B1
Authority
IT
Italy
Prior art keywords
equipment
control method
circuit plate
related processing
depth control
Prior art date
Application number
IT96TO000415A
Other languages
English (en)
Inventor
Gentile Sacchetti
Original Assignee
Pluritec Italia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pluritec Italia filed Critical Pluritec Italia
Priority to IT96TO000415A priority Critical patent/IT1285334B1/it
Publication of ITTO960415A0 publication Critical patent/ITTO960415A0/it
Priority to EP97107952A priority patent/EP0808087A3/en
Priority to US08/856,793 priority patent/US6015249A/en
Priority to JP9127034A priority patent/JPH1058284A/ja
Publication of ITTO960415A1 publication Critical patent/ITTO960415A1/it
Application granted granted Critical
Publication of IT1285334B1 publication Critical patent/IT1285334B1/it
Priority to US09/572,916 priority patent/US6309151B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
    • B23Q1/56—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism
    • B23Q1/58—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism a single sliding pair
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • B23Q17/2233—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the tool relative to the workpiece
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/26—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring depth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/16—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor
    • Y10T408/17—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor to control infeed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/16—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor
    • Y10T408/175—Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor to control relative positioning of Tool and work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
    • Y10T408/561—Having tool-opposing, work-engaging surface
    • Y10T408/5623—Having tool-opposing, work-engaging surface with presser foot
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/303752—Process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/306776—Axially
    • Y10T409/306832—Axially with infeed control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/307224—Milling including means to infeed rotary cutter toward work with infeed control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/308624—Milling with limit means to aid in positioning of cutter bit or work [e.g., gauge, stop, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
  • Supply And Installment Of Electrical Components (AREA)
IT96TO000415A 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti IT1285334B1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT96TO000415A IT1285334B1 (it) 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti
EP97107952A EP0808087A3 (en) 1996-05-17 1997-05-15 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards
US08/856,793 US6015249A (en) 1996-05-17 1997-05-15 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards
JP9127034A JPH1058284A (ja) 1996-05-17 1997-05-16 多層印刷回路板の切削機械の切削深さ制御装置及び制御方法
US09/572,916 US6309151B1 (en) 1996-05-17 1999-10-19 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT96TO000415A IT1285334B1 (it) 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti

Publications (3)

Publication Number Publication Date
ITTO960415A0 ITTO960415A0 (it) 1996-05-17
ITTO960415A1 ITTO960415A1 (it) 1997-11-17
IT1285334B1 true IT1285334B1 (it) 1998-06-03

Family

ID=11414642

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96TO000415A IT1285334B1 (it) 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti

Country Status (4)

Country Link
US (2) US6015249A (it)
EP (1) EP0808087A3 (it)
JP (1) JPH1058284A (it)
IT (1) IT1285334B1 (it)

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US6550118B2 (en) * 2001-02-02 2003-04-22 Electroimpact, Inc. Apparatus and method for accurate countersinking and rivet shaving for mechanical assembly operations
US6651866B2 (en) 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
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CN101547562A (zh) * 2003-09-19 2009-09-30 通道系统集团公司 闭合反钻系统
JP4367854B2 (ja) * 2004-06-01 2009-11-18 日立ビアメカニクス株式会社 プリント基板の穴あけ方法およびプリント基板加工機
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CN102883536B (zh) * 2012-09-29 2015-12-02 杭州华三通信技术有限公司 一种pcb板通孔加工方法及通孔结构
JP6023574B2 (ja) * 2012-12-10 2016-11-09 ビアメカニクス株式会社 基板穴明け装置及び基板穴明け方法
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CN103776361B (zh) * 2014-01-15 2017-01-04 中钞信用卡产业发展有限公司 一种双界面卡内天线的深度检测装置及检测方法
CN103791808B (zh) * 2014-02-26 2017-02-15 广州明森科技股份有限公司 一种双界面卡内天线的深度检测装置及检测方法
US9341670B2 (en) 2014-05-20 2016-05-17 International Business Machines Corporation Residual material detection in backdrilled stubs
US20150359110A1 (en) * 2014-06-06 2015-12-10 Keysight Technologies, Inc. Inner layer depth detection during controlled-depth drilling using continuity test coupon
EP2987576A1 (de) * 2014-08-19 2016-02-24 Skybrain Vermögensverwaltungs GmbH Verfahren zur Herstellung einer Bohrung und Bohrmaschine hierfür
US10237983B2 (en) 2014-12-23 2019-03-19 Sanmina Corporation Method for forming hole plug
CN104764395A (zh) * 2015-03-27 2015-07-08 深圳崇达多层线路板有限公司 一种印制电路板的切割深度测试方法及电路板
JP6485774B2 (ja) * 2015-11-11 2019-03-20 大船企業日本株式会社 多層プリント配線基板におけるバックドリル加工方法及び基板加工装置
JP7386034B2 (ja) * 2018-12-11 2023-11-24 ビアメカニクス株式会社 ドリル加工装置及びドリル加工方法
EP4133912A4 (en) 2020-04-07 2024-04-10 Nextgin Technology B.v. Methods and systems for back-drilling a multi-layer circuit board
CN112804825B (zh) * 2021-04-09 2021-09-14 苏州维嘉科技股份有限公司 控深钻孔的补偿方法和钻孔设备
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CN116546727B (zh) * 2023-05-04 2024-06-14 江西景旺精密电路有限公司 一种增加弯折能力以及控深精度的半刚挠产品控深铣工艺

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IT1285334B1 (it) * 1996-05-17 1998-06-03 Pluritec Italia Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti

Also Published As

Publication number Publication date
JPH1058284A (ja) 1998-03-03
EP0808087A2 (en) 1997-11-19
ITTO960415A0 (it) 1996-05-17
EP0808087A3 (en) 1998-09-09
US6309151B1 (en) 2001-10-30
ITTO960415A1 (it) 1997-11-17
US6015249A (en) 2000-01-18

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