IT1293021B1 - Modulo di potenza a semiconduttori. - Google Patents
Modulo di potenza a semiconduttori.Info
- Publication number
- IT1293021B1 IT1293021B1 IT97VI000107A ITVI970107A IT1293021B1 IT 1293021 B1 IT1293021 B1 IT 1293021B1 IT 97VI000107 A IT97VI000107 A IT 97VI000107A IT VI970107 A ITVI970107 A IT VI970107A IT 1293021 B1 IT1293021 B1 IT 1293021B1
- Authority
- IT
- Italy
- Prior art keywords
- power module
- semiconductor power
- semiconductor
- module
- power
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electronic Switches (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT97VI000107A IT1293021B1 (it) | 1997-07-10 | 1997-07-10 | Modulo di potenza a semiconduttori. |
| US09/025,790 US6137169A (en) | 1997-07-10 | 1998-02-19 | Heat reduction system for transistor assemblies |
| EP98112843A EP0892487A1 (en) | 1997-07-10 | 1998-07-10 | Power module using semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT97VI000107A IT1293021B1 (it) | 1997-07-10 | 1997-07-10 | Modulo di potenza a semiconduttori. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ITVI970107A1 ITVI970107A1 (it) | 1999-01-10 |
| IT1293021B1 true IT1293021B1 (it) | 1999-02-11 |
Family
ID=11426408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT97VI000107A IT1293021B1 (it) | 1997-07-10 | 1997-07-10 | Modulo di potenza a semiconduttori. |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6137169A (it) |
| EP (1) | EP0892487A1 (it) |
| IT (1) | IT1293021B1 (it) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19913450A1 (de) * | 1999-03-25 | 2000-09-28 | Mannesmann Sachs Ag | Leistungselektronik zum Steuern einer elektrischen Maschine |
| US6538405B1 (en) * | 2000-04-28 | 2003-03-25 | The Cherry Corporation | Accessory control system |
| EP1330866B1 (en) * | 2000-11-03 | 2015-12-30 | SMC Electrical Products, Inc. | Inverter for use in an AC drive |
| US6801433B2 (en) | 2001-04-19 | 2004-10-05 | General Electric Company | Method and apparatus for cooling electrical fuses |
| US6819561B2 (en) * | 2002-02-22 | 2004-11-16 | Satcon Technology Corporation | Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same |
| US6840308B2 (en) | 2002-05-31 | 2005-01-11 | General Electric Co. | Heat sink assembly |
| US7068507B2 (en) * | 2002-09-27 | 2006-06-27 | Rockwell Automation Technologies, Inc. | Compact liquid converter assembly |
| US6721181B1 (en) * | 2002-09-27 | 2004-04-13 | Rockwell Automation Technologies, Inc. | Elongated heat sink for use in converter assemblies |
| US6956742B2 (en) * | 2002-09-27 | 2005-10-18 | Rockwell Automation Technologies, Inc. | Compact liquid converter assembly |
| US6885553B2 (en) * | 2002-09-27 | 2005-04-26 | Rockwell Automation Technologies, Inc. | Bus bar assembly for use with a compact power conversion assembly |
| US6822850B2 (en) * | 2002-09-27 | 2004-11-23 | Rockwell Automation Technologies, Inc. | Laminated bus bar for use with a power conversion configuration |
| FI117838B (fi) * | 2003-06-04 | 2007-03-15 | Vacon Oyj | Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely |
| US20050099775A1 (en) * | 2003-11-12 | 2005-05-12 | Himanshu Pokharna | Pumped liquid cooling for computer systems using liquid metal coolant |
| US8081462B2 (en) * | 2007-09-13 | 2011-12-20 | Rockwell Automation Technologies, Inc. | Modular liquid cooling system |
| JP6596398B2 (ja) * | 2016-08-29 | 2019-10-23 | 本田技研工業株式会社 | 電力変換装置 |
| CN115943554A (zh) | 2020-08-18 | 2023-04-07 | 日立安斯泰莫株式会社 | 电力变换装置、电力变换装置的制造方法 |
| DE102020214795A1 (de) * | 2020-11-25 | 2022-05-25 | Robert Bosch Gesellschaft mit beschränkter Haftung | Leistungsmodul mit einer isoliert geteilten Wärmesenke und Fahrzeug mit dem Leistungsmodul |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4496609A (en) * | 1969-10-15 | 1985-01-29 | Applied Materials, Inc. | Chemical vapor deposition coating process employing radiant heat and a susceptor |
| US3971435A (en) * | 1971-07-13 | 1976-07-27 | Ncr Corporation | Heat transfer device |
| US4081313A (en) * | 1975-01-24 | 1978-03-28 | Applied Materials, Inc. | Process for preparing semiconductor wafers with substantially no crystallographic slip |
| US4341592A (en) * | 1975-08-04 | 1982-07-27 | Texas Instruments Incorporated | Method for removing photoresist layer from substrate by ozone treatment |
| JPS54105342A (en) * | 1978-02-07 | 1979-08-18 | Mitsubishi Electric Corp | Glow-discharge heating device |
| US4588023A (en) * | 1980-06-16 | 1986-05-13 | Showa Aluminum Corporation | Device for releasing heat |
| ZA815347B (en) * | 1980-08-28 | 1982-08-25 | Lucas Industries Ltd | Full wave rectifier assembly |
| GB2126802B (en) * | 1982-09-03 | 1985-06-05 | Standard Telephones Cables Ltd | High density packaging for electronic circuits |
| US4838983A (en) * | 1986-07-03 | 1989-06-13 | Emcore, Inc. | Gas treatment apparatus and method |
| US5019233A (en) * | 1988-10-31 | 1991-05-28 | Eaton Corporation | Sputtering system |
| US4944860A (en) * | 1988-11-04 | 1990-07-31 | Eaton Corporation | Platen assembly for a vacuum processing system |
| US4873613A (en) * | 1988-11-25 | 1989-10-10 | Iversen Arthur H | Compact high power modular RF semi-conductor systems packaging |
| US5263251A (en) * | 1991-04-02 | 1993-11-23 | Microunity Systems Engineering | Method of fabricating a heat exchanger for solid-state electronic devices |
| EP0509825A3 (en) * | 1991-04-16 | 1993-11-24 | Nec Corp | Package structure for semiconductor device |
| US5187645A (en) * | 1991-06-07 | 1993-02-16 | Ergo Computing, Inc. | Portable computer with docking connector for peripheral devices |
| US5271455A (en) * | 1991-06-25 | 1993-12-21 | Smoke/Fire Risk Management, Inc. | Temperature limiting apparatus for elevator controls |
| CA2088821C (en) * | 1992-02-05 | 1999-09-07 | Hironobu Ikeda | Cooling structure for integrated circuit |
| US5349498A (en) * | 1992-12-23 | 1994-09-20 | Hughes Aircraft Company | Integral extended surface cooling of power modules |
| US5448108A (en) * | 1993-11-02 | 1995-09-05 | Hughes Aircraft Company | Cooling of semiconductor power modules by flushing with dielectric liquid |
| US5539254A (en) * | 1994-03-09 | 1996-07-23 | Delco Electronics Corp. | Substrate subassembly for a transistor switch module |
| US5504378A (en) * | 1994-06-10 | 1996-04-02 | Westinghouse Electric Corp. | Direct cooled switching module for electric vehicle propulsion system |
| US5640995A (en) * | 1995-03-14 | 1997-06-24 | Baxter International Inc. | Electrofluidic standard module and custom circuit board assembly |
-
1997
- 1997-07-10 IT IT97VI000107A patent/IT1293021B1/it active IP Right Grant
-
1998
- 1998-02-19 US US09/025,790 patent/US6137169A/en not_active Expired - Fee Related
- 1998-07-10 EP EP98112843A patent/EP0892487A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US6137169A (en) | 2000-10-24 |
| ITVI970107A1 (it) | 1999-01-10 |
| EP0892487A1 (en) | 1999-01-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted |