IT1296027B1 - Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito - Google Patents

Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito

Info

Publication number
IT1296027B1
IT1296027B1 IT97VA000030A ITVA970030A IT1296027B1 IT 1296027 B1 IT1296027 B1 IT 1296027B1 IT 97VA000030 A IT97VA000030 A IT 97VA000030A IT VA970030 A ITVA970030 A IT VA970030A IT 1296027 B1 IT1296027 B1 IT 1296027B1
Authority
IT
Italy
Prior art keywords
arrangement
soldering
support board
eutectic alloy
circuit support
Prior art date
Application number
IT97VA000030A
Other languages
English (en)
Inventor
Fulvio Silvio Tondelli
Andrea Giovanni Cigada
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT97VA000030A priority Critical patent/IT1296027B1/it
Publication of ITVA970030A0 publication Critical patent/ITVA970030A0/it
Priority to EP98830098A priority patent/EP0902610A1/en
Priority to JP10254816A priority patent/JPH11150210A/ja
Publication of ITVA970030A1 publication Critical patent/ITVA970030A1/it
Application granted granted Critical
Publication of IT1296027B1 publication Critical patent/IT1296027B1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
IT97VA000030A 1997-09-10 1997-09-10 Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito IT1296027B1 (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT97VA000030A IT1296027B1 (it) 1997-09-10 1997-09-10 Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito
EP98830098A EP0902610A1 (en) 1997-09-10 1998-02-25 Arrangement of an ordered array of balls of solder alloy on respective pads of a baseplate of a BGA device
JP10254816A JPH11150210A (ja) 1997-09-10 1998-09-09 Ｂｇａデバイス用のボール整列システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT97VA000030A IT1296027B1 (it) 1997-09-10 1997-09-10 Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito

Publications (3)

Publication Number Publication Date
ITVA970030A0 ITVA970030A0 (it) 1997-09-10
ITVA970030A1 ITVA970030A1 (it) 1999-03-10
IT1296027B1 true IT1296027B1 (it) 1999-06-04

Family

ID=11423440

Family Applications (1)

Application Number Title Priority Date Filing Date
IT97VA000030A IT1296027B1 (it) 1997-09-10 1997-09-10 Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito

Country Status (3)

Country Link
EP (1) EP0902610A1 (it)
JP (1) JPH11150210A (it)
IT (1) IT1296027B1 (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
DE60020090T2 (de) 1999-03-17 2006-01-19 Novatec S.A. Verfahren und vorrichtung zum auftragen von kugeln in die öffnungen eines kugelbehälters
FR2792861B1 (fr) * 1999-04-30 2001-07-06 Eric Pilat Procede de realisation de plots de soudure sur un substrat et guide pour la mise en oeuvre du procede
US6766938B2 (en) * 2002-01-08 2004-07-27 Asm Assembly Automation Ltd. Apparatus and method of placing solder balls onto a substrate
JP2008141081A (ja) * 2006-12-05 2008-06-19 Minami Kk ボール供給装置等用マスク
CN106028651B (zh) * 2016-05-05 2019-04-30 广合科技（广州）有限公司 一种pcb上bga位置的背钻孔制作方法
CN112969309B (zh) * 2020-08-28 2022-04-19 重庆康佳光电技术研究院有限公司 电路板与发光器件的焊接方法、显示模组、面板及焊料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0795554B2 (ja) * 1987-09-14 1995-10-11 株式会社日立製作所 はんだ球整列装置
US5431332A (en) * 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5655704A (en) * 1994-08-30 1997-08-12 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
JP3214316B2 (ja) * 1995-09-29 2001-10-02 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法およびバンプの形成方法
JPH09107045A (ja) * 1995-10-13 1997-04-22 Japan Aviation Electron Ind Ltd Ｂｇａパッケージのボール取付け方法

Also Published As

Publication number Publication date
ITVA970030A0 (it) 1997-09-10
EP0902610A1 (en) 1999-03-17
ITVA970030A1 (it) 1999-03-10
JPH11150210A (ja) 1999-06-02

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