IT1400538B1 - Dispositivo elettronico e metodo di collegamento di una piastrina ad un terminale di connessione - Google Patents

Dispositivo elettronico e metodo di collegamento di una piastrina ad un terminale di connessione

Info

Publication number
IT1400538B1
IT1400538B1 ITTO2010A000448A ITTO20100448A IT1400538B1 IT 1400538 B1 IT1400538 B1 IT 1400538B1 IT TO2010A000448 A ITTO2010A000448 A IT TO2010A000448A IT TO20100448 A ITTO20100448 A IT TO20100448A IT 1400538 B1 IT1400538 B1 IT 1400538B1
Authority
IT
Italy
Prior art keywords
plate
electronic device
connection terminal
terminal
connection
Prior art date
Application number
ITTO2010A000448A
Other languages
English (en)
Inventor
Giuseppe Cristaldi
Agatino Minotti
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITTO2010A000448A priority Critical patent/IT1400538B1/it
Priority to US13/117,340 priority patent/US8513811B2/en
Publication of ITTO20100448A1 publication Critical patent/ITTO20100448A1/it
Application granted granted Critical
Publication of IT1400538B1 publication Critical patent/IT1400538B1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
ITTO2010A000448A 2010-05-28 2010-05-28 Dispositivo elettronico e metodo di collegamento di una piastrina ad un terminale di connessione IT1400538B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITTO2010A000448A IT1400538B1 (it) 2010-05-28 2010-05-28 Dispositivo elettronico e metodo di collegamento di una piastrina ad un terminale di connessione
US13/117,340 US8513811B2 (en) 2010-05-28 2011-05-27 Electronic device and method for connecting a die to a connection terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO2010A000448A IT1400538B1 (it) 2010-05-28 2010-05-28 Dispositivo elettronico e metodo di collegamento di una piastrina ad un terminale di connessione

Publications (2)

Publication Number Publication Date
ITTO20100448A1 ITTO20100448A1 (it) 2011-11-29
IT1400538B1 true IT1400538B1 (it) 2013-06-11

Family

ID=43304161

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO2010A000448A IT1400538B1 (it) 2010-05-28 2010-05-28 Dispositivo elettronico e metodo di collegamento di una piastrina ad un terminale di connessione

Country Status (2)

Country Link
US (1) US8513811B2 (it)
IT (1) IT1400538B1 (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4163960A1 (en) * 2021-10-07 2023-04-12 STMicroelectronics S.r.l. Method of manufacturing semiconductor devices, corresponding semiconductor device and ribbon for use therein

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6528880B1 (en) * 2001-06-25 2003-03-04 Lovoltech Inc. Semiconductor package for power JFET having copper plate for source and ribbon contact for gate
US20040217488A1 (en) * 2003-05-02 2004-11-04 Luechinger Christoph B. Ribbon bonding
EP1603157B1 (en) * 2004-05-31 2008-01-09 STMicroelectronics S.r.l. Vertical conduction power electronic device package and corresponding assembling method
JP4526957B2 (ja) * 2005-01-13 2010-08-18 ルネサスエレクトロニクス株式会社 半導体装置、ボンディング方法およびボンディングリボン
DE102005039165B4 (de) * 2005-08-17 2010-12-02 Infineon Technologies Ag Draht- und streifengebondetes Halbleiterleistungsbauteil und Verfahren zu dessen Herstellung
US7443018B2 (en) * 2005-11-09 2008-10-28 Stats Chippac Ltd. Integrated circuit package system including ribbon bond interconnect
JP2007220704A (ja) * 2006-02-14 2007-08-30 Mitsubishi Electric Corp 半導体装置
US8237268B2 (en) * 2007-03-20 2012-08-07 Infineon Technologies Ag Module comprising a semiconductor chip
TWI456707B (zh) * 2008-01-28 2014-10-11 瑞薩電子股份有限公司 半導體裝置及其製造方法
US8138585B2 (en) * 2008-05-28 2012-03-20 Fairchild Semiconductor Corporation Four mosfet full bridge module

Also Published As

Publication number Publication date
US20110291286A1 (en) 2011-12-01
ITTO20100448A1 (it) 2011-11-29
US8513811B2 (en) 2013-08-20

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