IT201700091702A1 - Elemento strutturale micromeccanico - Google Patents

Elemento strutturale micromeccanico

Info

Publication number
IT201700091702A1
IT201700091702A1 IT102017000091702A IT201700091702A IT201700091702A1 IT 201700091702 A1 IT201700091702 A1 IT 201700091702A1 IT 102017000091702 A IT102017000091702 A IT 102017000091702A IT 201700091702 A IT201700091702 A IT 201700091702A IT 201700091702 A1 IT201700091702 A1 IT 201700091702A1
Authority
IT
Italy
Prior art keywords
structural element
micromechanical structural
micromechanical
structural
Prior art date
Application number
IT102017000091702A
Other languages
English (en)
Inventor
Achim Breitling
Christof Schwenk
Hartmut Kueppers
Nicole Schittenhelm
Volker Schmitz
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IT201700091702A1 publication Critical patent/IT201700091702A1/it

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0035Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems ; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0035Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0041Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802Details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0228Inertial sensors
    • B81B2201/0235Accelerometers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0228Inertial sensors
    • B81B2201/025Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/03Static structures
    • B81B2203/0315Cavities
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00277Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00Measuring linear or angular speed; Measuring differences of linear or angular speeds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)
IT102017000091702A 2016-08-11 2017-08-08 Elemento strutturale micromeccanico IT201700091702A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102016214966.0A DE102016214966B4 (de) 2016-08-11 2016-08-11 Mikromechanisches Bauelement

Publications (1)

Publication Number Publication Date
IT201700091702A1 true IT201700091702A1 (it) 2019-02-08

Family

ID=61018696

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102017000091702A IT201700091702A1 (it) 2016-08-11 2017-08-08 Elemento strutturale micromeccanico

Country Status (5)

Country Link
US (1) US10059583B2 (it)
CN (1) CN107720686B (it)
DE (1) DE102016214966B4 (it)
IT (1) IT201700091702A1 (it)
TW (1) TWI707820B (it)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10352001A1 (de) 2003-11-07 2005-06-09 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements
JP2005238540A (ja) 2004-02-25 2005-09-08 Sony Corp 流体駆動装置と流体駆動装置の製造方法および静電駆動流体吐出装置と静電駆動流体吐出装置の製造方法
FR2876215B1 (fr) * 2004-10-04 2007-05-11 Commissariat Energie Atomique Capacite variable a fluide dielectrique
DE102006016260B4 (de) 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements
JP5436404B2 (ja) 2010-12-17 2014-03-05 三菱電機株式会社 半導体圧力センサ及びその製造方法
JP2013232626A (ja) * 2012-04-04 2013-11-14 Seiko Epson Corp 電子デバイス及びその製造方法、電子機器、並びに移動体
US9567210B2 (en) * 2015-02-24 2017-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-pressure MEMS package

Also Published As

Publication number Publication date
TW201815659A (zh) 2018-05-01
DE102016214966A1 (de) 2018-02-15
US20180044171A1 (en) 2018-02-15
CN107720686A (zh) 2018-02-23
DE102016214966B4 (de) 2025-05-22
CN107720686B (zh) 2022-12-06
TWI707820B (zh) 2020-10-21
US10059583B2 (en) 2018-08-28

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