IT201700091702A1 - Elemento strutturale micromeccanico - Google Patents
Elemento strutturale micromeccanicoInfo
- Publication number
- IT201700091702A1 IT201700091702A1 IT102017000091702A IT201700091702A IT201700091702A1 IT 201700091702 A1 IT201700091702 A1 IT 201700091702A1 IT 102017000091702 A IT102017000091702 A IT 102017000091702A IT 201700091702 A IT201700091702 A IT 201700091702A IT 201700091702 A1 IT201700091702 A1 IT 201700091702A1
- Authority
- IT
- Italy
- Prior art keywords
- structural element
- micromechanical structural
- micromechanical
- structural
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems ; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Micromachines (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016214966.0A DE102016214966B4 (de) | 2016-08-11 | 2016-08-11 | Mikromechanisches Bauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT201700091702A1 true IT201700091702A1 (it) | 2019-02-08 |
Family
ID=61018696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT102017000091702A IT201700091702A1 (it) | 2016-08-11 | 2017-08-08 | Elemento strutturale micromeccanico |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10059583B2 (it) |
| CN (1) | CN107720686B (it) |
| DE (1) | DE102016214966B4 (it) |
| IT (1) | IT201700091702A1 (it) |
| TW (1) | TWI707820B (it) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10352001A1 (de) | 2003-11-07 | 2005-06-09 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements |
| JP2005238540A (ja) | 2004-02-25 | 2005-09-08 | Sony Corp | 流体駆動装置と流体駆動装置の製造方法および静電駆動流体吐出装置と静電駆動流体吐出装置の製造方法 |
| FR2876215B1 (fr) * | 2004-10-04 | 2007-05-11 | Commissariat Energie Atomique | Capacite variable a fluide dielectrique |
| DE102006016260B4 (de) | 2006-04-06 | 2024-07-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements |
| JP5436404B2 (ja) | 2010-12-17 | 2014-03-05 | 三菱電機株式会社 | 半導体圧力センサ及びその製造方法 |
| JP2013232626A (ja) * | 2012-04-04 | 2013-11-14 | Seiko Epson Corp | 電子デバイス及びその製造方法、電子機器、並びに移動体 |
| US9567210B2 (en) * | 2015-02-24 | 2017-02-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-pressure MEMS package |
-
2016
- 2016-08-11 DE DE102016214966.0A patent/DE102016214966B4/de active Active
-
2017
- 2017-08-08 IT IT102017000091702A patent/IT201700091702A1/it unknown
- 2017-08-09 TW TW106126831A patent/TWI707820B/zh active
- 2017-08-09 US US15/673,118 patent/US10059583B2/en active Active
- 2017-08-10 CN CN201710680047.0A patent/CN107720686B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201815659A (zh) | 2018-05-01 |
| DE102016214966A1 (de) | 2018-02-15 |
| US20180044171A1 (en) | 2018-02-15 |
| CN107720686A (zh) | 2018-02-23 |
| DE102016214966B4 (de) | 2025-05-22 |
| CN107720686B (zh) | 2022-12-06 |
| TWI707820B (zh) | 2020-10-21 |
| US10059583B2 (en) | 2018-08-28 |
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