IT235591Y1 - Apparecchiatura per la spruzzatura di sostanze, in particolare per lapulizia e/o la disinfezione e/o la sanificazione ambientale e/o - Google Patents

Apparecchiatura per la spruzzatura di sostanze, in particolare per lapulizia e/o la disinfezione e/o la sanificazione ambientale e/o

Info

Publication number
IT235591Y1
IT235591Y1 IT1995RM000057U ITRM950057U IT235591Y1 IT 235591 Y1 IT235591 Y1 IT 235591Y1 IT 1995RM000057 U IT1995RM000057 U IT 1995RM000057U IT RM950057 U ITRM950057 U IT RM950057U IT 235591 Y1 IT235591 Y1 IT 235591Y1
Authority
IT
Italy
Prior art keywords
disinfection
cleaning
equipment
environmental sanitation
spraying substances
Prior art date
Application number
IT1995RM000057U
Other languages
English (en)
Original Assignee
Gregorio Vito Di
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gregorio Vito Di filed Critical Gregorio Vito Di
Publication of ITRM950057V0 publication Critical patent/ITRM950057V0/it
Publication of ITRM950057U1 publication Critical patent/ITRM950057U1/it
Application granted granted Critical
Publication of IT235591Y1 publication Critical patent/IT235591Y1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Motor Or Generator Frames (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IT1995RM000057U 1994-02-17 1995-03-24 Apparecchiatura per la spruzzatura di sostanze, in particolare per lapulizia e/o la disinfezione e/o la sanificazione ambientale e/o IT235591Y1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4404986A DE4404986B4 (de) 1994-02-17 1994-02-17 Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung

Publications (3)

Publication Number Publication Date
ITRM950057V0 ITRM950057V0 (it) 1995-03-24
ITRM950057U1 ITRM950057U1 (it) 1996-09-24
IT235591Y1 true IT235591Y1 (it) 2000-07-12

Family

ID=6510429

Family Applications (2)

Application Number Title Priority Date Filing Date
IT1995MI000057U IT236625Y1 (it) 1994-02-17 1995-01-31 Dispositivo per stabilire il contatto con conduttori elettrici e procedimento per la fabbricazione di un dispositivo di questo
IT1995RM000057U IT235591Y1 (it) 1994-02-17 1995-03-24 Apparecchiatura per la spruzzatura di sostanze, in particolare per lapulizia e/o la disinfezione e/o la sanificazione ambientale e/o

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IT1995MI000057U IT236625Y1 (it) 1994-02-17 1995-01-31 Dispositivo per stabilire il contatto con conduttori elettrici e procedimento per la fabbricazione di un dispositivo di questo

Country Status (5)

Country Link
US (1) US5685069A (it)
CH (1) CH689344A5 (it)
DE (1) DE4404986B4 (it)
FR (1) FR2716310B3 (it)
IT (2) IT236625Y1 (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19512255A1 (de) * 1995-03-31 1996-10-02 Siemens Ag Anordnung zur Aufnahme eines Einschubkörpers in einem Aufnahmekörper
DE19535813C1 (de) * 1995-09-26 1996-09-19 Siemens Ag Sende- und Empfangsvorrichtung für ein Diebstahlschutzsystem eines Kraftfahrzeugs
DE19604614A1 (de) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Elektronisches Steuergerät mit einem Gehäuse
DE19624478A1 (de) 1996-02-08 1998-01-02 Bayerische Motoren Werke Ag Verfahren zum Herstellen eines elektronischen Steuergeräts
JPH09289360A (ja) * 1996-04-19 1997-11-04 Matsushita Electric Ind Co Ltd 配線板とその製造方法
DE19615432A1 (de) * 1996-04-19 1997-10-23 Abb Patent Gmbh Montageplatte
FR2752137B1 (fr) * 1996-07-31 1998-10-23 Peugeot Procede de fabrication d'une plaque de circuit imprime et plaque obtenue par un tel procede
DE19710344C2 (de) * 1997-03-13 1999-08-12 Huettenberger Produktionstechn Verfahren zum Herstellen von elektrischen Leiterplatten und Vorrichtung zur Durchführung von Teilschritten des Verfahrens
DE10004310A1 (de) * 2000-02-01 2001-08-09 Bosch Gmbh Robert Stanzgitter mit integriertem Hall-Sensor für Drehzahlabgriff
DE10047897B4 (de) * 2000-09-26 2008-04-24 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Elektronische Baueinheit mit einer als Leadframe ausgebildeten Montageplatte und darauf befestigten SMD-Bauteilen
US6996897B2 (en) * 2002-07-31 2006-02-14 Freescale Semiconductor, Inc. Method of making a mount for electronic devices
DE10335015A1 (de) * 2003-07-31 2005-02-24 Robert Bosch Gmbh Verfahren zur Fixierung von elektrischen Leiterbahnen auf einer Grundplatte sowie Anordnung aus Leiterbahnen und Grundplatte
DE102012218847A1 (de) * 2012-10-16 2014-04-17 Robert Bosch Gmbh Anschlusselement für eine Antriebsanordnung sowie eine Antriebsanordnung mit einem Anschlussteil
DE102014116838A1 (de) * 2014-11-18 2016-05-19 Ebm-Papst Mulfingen Gmbh & Co. Kg Elektrische Verbindungsanordnung und Verfahren zu deren Herstellung
JP6744056B1 (ja) 2019-04-16 2020-08-19 三菱電機株式会社 リードフレーム及びこれを用いたセンサ装置
DE102022112115B3 (de) 2022-05-13 2023-07-06 Kyocera Avx Components (Werne) Gmbh Verfahren zur Herstellung einer Baugruppe durch Vereinzeln von Stanzgittern auf einer Leiterplatte

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
GB1339660A (en) * 1971-11-20 1973-12-05 Ferranti Ltd Supports for semiconductor devices
DE3142263A1 (de) * 1981-10-24 1983-05-05 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Verfahren zur serienfertigung von schaltungsanordnungen insbesondere fuer dynamische fernsprech-mikrofone
US4673837A (en) * 1984-05-11 1987-06-16 Amp Incorporated Motor brush assembly
US4796239A (en) * 1986-05-08 1989-01-03 Seikosha Co., Ltd. Circuit unit for timepiece and process for fabricating the same
US4766520A (en) * 1986-12-05 1988-08-23 Capsonic Group, Inc. Injection molded circuit housing
US4934045A (en) * 1988-02-05 1990-06-19 Semiconductor Energy Laboratory Co., Ltd. Method of producing electric circuit patterns
US4954872A (en) * 1988-04-29 1990-09-04 Altair International, Inc. Electrical contact stabilizer assembly
US4894018A (en) * 1988-08-08 1990-01-16 General Motors Corporation Low profile electrical connector
JP2751450B2 (ja) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
DE8912914U1 (de) * 1989-11-02 1989-12-28 IVO Irion & Vosseler GmbH & Co., 7730 Villingen-Schwenningen Leiteranordnung aus gestanzten Leiterbahnen
US4997517A (en) * 1990-01-09 1991-03-05 Olin Corporation Multi-metal layer interconnect tape for tape automated bonding
US5131138A (en) * 1990-03-23 1992-07-21 Optoswitch, Inc. Method of manufacturing an optical micro-switch apparatus
US5396701A (en) * 1993-06-29 1995-03-14 Texas Instruments Inc. Method for packaging an integrated circuit

Also Published As

Publication number Publication date
ITMI950057U1 (it) 1996-07-31
CH689344A5 (de) 1999-02-26
DE4404986B4 (de) 2008-08-21
FR2716310B3 (fr) 1996-01-05
ITRM950057U1 (it) 1996-09-24
ITMI950057V0 (it) 1995-01-31
ITRM950057V0 (it) 1995-03-24
IT236625Y1 (it) 2000-08-17
US5685069A (en) 1997-11-11
FR2716310A3 (fr) 1995-08-18
DE4404986A1 (de) 1995-08-24

Similar Documents

Publication Publication Date Title
BR9706998A (pt) Fomulação líquida limpadora e higienizadora
BR9706949A (pt) Composições desinfetantes e processos para desinfecção de superfícies
BR9706945A (pt) Composições desinfetantes e processos para disinfecção de superfícies
PL332421A1 (en) Liquid microemulsion-type general-purpose disinfecting and cleaning compositions
BR9508492A (pt) Produto para limpeza e sistema dispensador
IT235591Y1 (it) Apparecchiatura per la spruzzatura di sostanze, in particolare per lapulizia e/o la disinfezione e/o la sanificazione ambientale e/o
GB2336372B (en) Aqueous disinfecting and cleaning compositions
DE69725625D1 (de) Reinigungs- und/oder desinfektionsmittel
FI982684L (fi) Uusi bioaktiivinen tuote ja sen käyttö
BR9608646A (pt) Processos composições e/ou artigos de limpeza/sanitização para tecido
BR9610303A (pt) Composições desinfetantes sinérgicas tuberculocidade e processos de desinfecção
BR9707699A (pt) Composições desinfetantes e processos para desinfetar superfícies
PT1343864E (pt) Produto de limpeza e desinfeccao
GB2330765B (en) Disinfecting and sanitizing article
BR9707610A (pt) Composições desinfetantes e processos para desinfecção de superfícies
DK1027420T3 (da) Rengöring i födevareindustrien
TR28732A (tr) Hijyenik temizlik bilesimi ve bu bilesimi püskürtmeye mahsus cihaz.
DE69406781D1 (de) Flüssige reinigungsprodukte
DE69427137D1 (de) Flüssige Reinigungsprodukte
GB2336371A8 (en) Aqueous disinfecting and cleaning composition
GB2351293B (en) Aqueous disinfecting and cleaning compositions
GB2374604B (en) Aqueous disinfectant and cleaning compositions
ITGE950098A0 (it) Dispositivo modulare per la pulizia di superfici stradali ed assimilabili.
EP0651047A3 (de) Reinigungs- und Sterilisierlösungen und ihre Verwendung.
ITPR970040A0 (it) Dispositivo per il lavaggio e/o la sterilizzazione di contenitori.

Legal Events

Date Code Title Description
0001 Granted