Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
  • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D64/00—Electrodes of devices having potential barriers
  • H10D64/01—Manufacture or treatment
  • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
  • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/01—Manufacture or treatment

Landscapes

• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Weting (AREA)
• Die Bonding (AREA)
• Formation Of Insulating Films (AREA)
• Dicing (AREA)

Applications Claiming Priority (1)

Publications (2)

Family

ID=6013631

Family Applications (1)

Country Status (7)

Families Citing this family (6)

Family Cites Families (3)

• 1977
  • 1977-07-11 DE DE19772731221 patent/DE2731221A1/de not_active Withdrawn
• 1978
  • 1978-05-30 GB GB23885/78A patent/GB1604308A/en not_active Expired
  • 1978-06-29 BR BR7804249A patent/BR7804249A/pt unknown
  • 1978-06-30 CH CH713778A patent/CH629336A5/de not_active IP Right Cessation
  • 1978-07-06 FR FR7820232A patent/FR2397717A1/fr not_active Withdrawn
  • 1978-07-10 IT IT25515/78A patent/IT1098670B/it active
  • 1978-07-10 JP JP8311678A patent/JPS5419358A/ja active Pending

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