IT7868768A0 - Soluzione catalitica per la deposizione anelettrica di metalli - Google Patents
Soluzione catalitica per la deposizione anelettrica di metalliInfo
- Publication number
- IT7868768A0 IT7868768A0 IT7868768A IT6876878A IT7868768A0 IT 7868768 A0 IT7868768 A0 IT 7868768A0 IT 7868768 A IT7868768 A IT 7868768A IT 6876878 A IT6876878 A IT 6876878A IT 7868768 A0 IT7868768 A0 IT 7868768A0
- Authority
- IT
- Italy
- Prior art keywords
- metals
- catalytic solution
- electric deposition
- deposition
- electric
- Prior art date
Links
- 230000003197 catalytic effect Effects 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 150000002739 metals Chemical group 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT68768/78A IT1107840B (it) | 1978-07-25 | 1978-07-25 | Soluzione catalitica per la deposizione anelettrica di metalli |
| FR7917824A FR2432055A1 (fr) | 1978-07-25 | 1979-07-10 | Solution catalytique de depot non-galvanique de metaux et son procede de preparation |
| US06/056,398 US4244739A (en) | 1978-07-25 | 1979-07-10 | Catalytic solution for the electroless deposition of metals |
| GB7924130A GB2025782B (en) | 1978-07-25 | 1979-07-11 | Catalytic solution for the electroless deposition of metals |
| DE19792928699 DE2928699A1 (de) | 1978-07-25 | 1979-07-16 | Katalytische loesung zum stromlosen niederschlagen von metallen sowie verfahren fuer ihre herstellung |
| JP9251979A JPS5518595A (en) | 1978-07-25 | 1979-07-20 | Catalyst solution for nonelectrolytic metal coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT68768/78A IT1107840B (it) | 1978-07-25 | 1978-07-25 | Soluzione catalitica per la deposizione anelettrica di metalli |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT7868768A0 true IT7868768A0 (it) | 1978-07-25 |
| IT1107840B IT1107840B (it) | 1985-12-02 |
Family
ID=11310525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT68768/78A IT1107840B (it) | 1978-07-25 | 1978-07-25 | Soluzione catalitica per la deposizione anelettrica di metalli |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4244739A (it) |
| JP (1) | JPS5518595A (it) |
| DE (1) | DE2928699A1 (it) |
| FR (1) | FR2432055A1 (it) |
| GB (1) | GB2025782B (it) |
| IT (1) | IT1107840B (it) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4863758A (en) * | 1982-05-26 | 1989-09-05 | Macdermid, Incorporated | Catalyst solutions for activating non-conductive substrates and electroless plating process |
| EP0109402B1 (en) * | 1982-05-26 | 1988-06-01 | Macdermid, Incorporated | Catalyst solutions for activating non-conductive substrates and electroless plating process |
| US4741786A (en) * | 1986-06-10 | 1988-05-03 | Stanadyne, Inc. | Cold drawn free-machining steel bar including bismuth |
| JP2649749B2 (ja) * | 1991-06-13 | 1997-09-03 | 石原薬品 株式会社 | 銅系素材上への選択的無電解めっき方法 |
| US5264288A (en) * | 1992-10-01 | 1993-11-23 | Ppg Industries, Inc. | Electroless process using silylated polyamine-noble metal complexes |
| US5391395A (en) * | 1992-12-30 | 1995-02-21 | Witco Corporation | Method of preparing substrates for memory disk applications |
| EP1162289A1 (en) * | 2000-06-08 | 2001-12-12 | Lucent Technologies Inc. | Palladium electroplating bath and process for electroplating |
| DE10054544A1 (de) * | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
| US20020062760A1 (en) * | 2000-11-06 | 2002-05-30 | Ronald Redline | Catalyst solutions useful in activating substrates for subsequent plating |
| AU2001294928A1 (en) * | 2000-11-06 | 2002-05-15 | Macdermid, Incorporated | Catalyst solutions useful in activating substrates for subsequent plating |
| US6645557B2 (en) | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| JP4069248B2 (ja) * | 2002-12-09 | 2008-04-02 | 大阪市 | 無電解めっき用触媒組成物 |
| US20050170650A1 (en) * | 2004-01-26 | 2005-08-04 | Hongbin Fang | Electroless palladium nitrate activation prior to cobalt-alloy deposition |
| SG188351A1 (en) * | 2010-09-03 | 2013-04-30 | Omg Electronic Chemicals Llc | Electroless nickel alloy plating bath and process for depositing thereof |
| CN119173651A (zh) * | 2022-05-10 | 2024-12-20 | 奥野制药工业株式会社 | 钯催化剂液 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3650913A (en) * | 1969-09-08 | 1972-03-21 | Macdermid Inc | An electroless plating process employing a specially prepared palladium-tin activator solution |
| US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
| US3874882A (en) * | 1972-02-09 | 1975-04-01 | Shipley Co | Catalyst solution for electroless deposition of metal on substrate |
-
1978
- 1978-07-25 IT IT68768/78A patent/IT1107840B/it active
-
1979
- 1979-07-10 FR FR7917824A patent/FR2432055A1/fr active Granted
- 1979-07-10 US US06/056,398 patent/US4244739A/en not_active Expired - Lifetime
- 1979-07-11 GB GB7924130A patent/GB2025782B/en not_active Expired
- 1979-07-16 DE DE19792928699 patent/DE2928699A1/de active Granted
- 1979-07-20 JP JP9251979A patent/JPS5518595A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2432055B1 (it) | 1981-12-04 |
| GB2025782B (en) | 1983-04-27 |
| FR2432055A1 (fr) | 1980-02-22 |
| JPS5518595A (en) | 1980-02-08 |
| DE2928699A1 (de) | 1980-02-07 |
| DE2928699C2 (it) | 1988-03-24 |
| IT1107840B (it) | 1985-12-02 |
| GB2025782A (en) | 1980-01-30 |
| US4244739A (en) | 1981-01-13 |
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