IT7925034A0 - Bagno di elettroplaccatura erelativo procedimento di elettroplaccatura. - Google Patents

Bagno di elettroplaccatura erelativo procedimento di elettroplaccatura.

Info

Publication number
IT7925034A0
IT7925034A0 IT7925034A IT2503479A IT7925034A0 IT 7925034 A0 IT7925034 A0 IT 7925034A0 IT 7925034 A IT7925034 A IT 7925034A IT 2503479 A IT2503479 A IT 2503479A IT 7925034 A0 IT7925034 A0 IT 7925034A0
Authority
IT
Italy
Prior art keywords
electroplating
procedure
bath
electroplating bath
electroplating procedure
Prior art date
Application number
IT7925034A
Other languages
English (en)
Other versions
IT1195735B (it
Inventor
Whitlaw Keith John
Hill Ronald Thomas
Original Assignee
Lea Ronal Uk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lea Ronal Uk Ltd filed Critical Lea Ronal Uk Ltd
Publication of IT7925034A0 publication Critical patent/IT7925034A0/it
Application granted granted Critical
Publication of IT1195735B publication Critical patent/IT1195735B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Contacts (AREA)
IT25034/79A 1978-08-31 1979-08-09 Bagno di elettroplaccatura e reltativo procedimento di elettroplaccatura IT1195735B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7835086 1978-08-31

Publications (2)

Publication Number Publication Date
IT7925034A0 true IT7925034A0 (it) 1979-08-09
IT1195735B IT1195735B (it) 1988-10-27

Family

ID=10499359

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25034/79A IT1195735B (it) 1978-08-31 1979-08-09 Bagno di elettroplaccatura e reltativo procedimento di elettroplaccatura

Country Status (7)

Country Link
JP (1) JPS5937354B2 (it)
BE (1) BE878515A (it)
CH (1) CH645927A5 (it)
DE (1) DE2930035C2 (it)
FR (1) FR2434873A1 (it)
IT (1) IT1195735B (it)
NL (1) NL7906568A (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3032469A1 (de) * 1980-08-28 1982-04-01 Siemens AG, 1000 Berlin und 8000 München Cyanidische goldbaeder und verfahren zur galvanischen abscheidung von feststoffschmiermittel-haltigen gold-dispersionsueberzuegen und seine anwendung
JPS58199791A (ja) * 1982-05-18 1983-11-21 大塚化学株式会社 耐火断熱シ−ト
JPS60238496A (ja) * 1984-05-12 1985-11-27 Shinko Electric Ind Co Ltd 金めつき液
JPS6239235A (ja) * 1985-08-14 1987-02-20 松下電工株式会社 吸音板の製造方法
JPS6239234A (ja) * 1985-08-14 1987-02-20 松下電工株式会社 吸音板及びその製造法
JPS6239233A (ja) * 1985-08-14 1987-02-20 松下電工株式会社 ロツクウ−ル吸音板の製造法
JP2008133533A (ja) * 2006-11-01 2008-06-12 Ne Chemcat Corp 金−銀合金めっき液
JP5731802B2 (ja) * 2010-11-25 2015-06-10 ローム・アンド・ハース電子材料株式会社 金めっき液
DE102011114931B4 (de) * 2011-10-06 2013-09-05 Umicore Galvanotechnik Gmbh Verfahren zur selektiveren, elektrolytischen Abscheidung von Gold oder einer Goldlegierung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths

Also Published As

Publication number Publication date
NL7906568A (nl) 1980-03-04
FR2434873B1 (it) 1984-07-27
DE2930035C2 (de) 1983-09-08
JPS5534697A (en) 1980-03-11
DE2930035A1 (de) 1980-03-20
BE878515A (fr) 1979-12-17
CH645927A5 (en) 1984-10-31
FR2434873A1 (fr) 1980-03-28
JPS5937354B2 (ja) 1984-09-08
IT1195735B (it) 1988-10-27

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