IT8026733A0 - Disposizione per montare circuiti integrati in contenitori a doppia fila di connettori a circuiti a pellicola spessa sottile. - Google Patents

Disposizione per montare circuiti integrati in contenitori a doppia fila di connettori a circuiti a pellicola spessa sottile.

Info

Publication number
IT8026733A0
IT8026733A0 IT8026733A IT2673380A IT8026733A0 IT 8026733 A0 IT8026733 A0 IT 8026733A0 IT 8026733 A IT8026733 A IT 8026733A IT 2673380 A IT2673380 A IT 2673380A IT 8026733 A0 IT8026733 A0 IT 8026733A0
Authority
IT
Italy
Prior art keywords
arrangement
integrated circuits
double row
film circuit
circuit connector
Prior art date
Application number
IT8026733A
Other languages
English (en)
Other versions
IT1134771B (it
Inventor
George S Lychyk
Wayne E Neese
Original Assignee
Gte Automatic Electric Lab Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gte Automatic Electric Lab Inc filed Critical Gte Automatic Electric Lab Inc
Publication of IT8026733A0 publication Critical patent/IT8026733A0/it
Application granted granted Critical
Publication of IT1134771B publication Critical patent/IT1134771B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IT26733/80A 1979-12-19 1980-12-18 Dispositivo per montare circuiti integrati in contenitori a doppia fila di connettori a circuiti a pellicola spessa sottile IT1134771B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/105,180 US4272140A (en) 1979-12-19 1979-12-19 Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits

Publications (2)

Publication Number Publication Date
IT8026733A0 true IT8026733A0 (it) 1980-12-18
IT1134771B IT1134771B (it) 1986-08-13

Family

ID=22304486

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26733/80A IT1134771B (it) 1979-12-19 1980-12-18 Dispositivo per montare circuiti integrati in contenitori a doppia fila di connettori a circuiti a pellicola spessa sottile

Country Status (4)

Country Link
US (1) US4272140A (it)
BE (1) BE885601A (it)
CA (1) CA1146283A (it)
IT (1) IT1134771B (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495376A (en) * 1981-07-27 1985-01-22 Texas Instruments Incorporated Carrier for integrated circuit
US4642670A (en) * 1983-12-02 1987-02-10 At&T Bell Laboratories Chip carrier package
US4718855A (en) * 1984-12-03 1988-01-12 Amp Incorporated Socket for integrated circuit component
US4682829A (en) * 1985-06-13 1987-07-28 Amp Incorporated Surface mount socket for dual in-line package
DE3527043A1 (de) * 1985-07-27 1987-02-05 Grundig Emv Verfahren zum einloeten einer integrierten schaltung in eine leiterplatte
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4982267A (en) * 1985-11-18 1991-01-01 Atmel Corporation Integrated semiconductor package
US4764848A (en) * 1986-11-24 1988-08-16 International Business Machines Corporation Surface mounted array strain relief device
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US7566963B2 (en) * 2007-11-21 2009-07-28 Powertech Technology Inc. Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1152765A (en) * 1967-01-24 1969-05-21 Amp Inc An Electrical Circuit Assembly
NL7500568A (nl) * 1975-01-17 1976-07-20 Du Pont Montagevoet voor een geintegreerde keten.
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate

Also Published As

Publication number Publication date
US4272140A (en) 1981-06-09
BE885601A (fr) 1981-02-02
CA1146283A (en) 1983-05-10
IT1134771B (it) 1986-08-13

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