IT8468151A0 - Substrato di materiale plastico per l ancoraggio di rivestimenti metallici e procedimento per la metallizzazione ad umido di superfici - Google Patents

Substrato di materiale plastico per l ancoraggio di rivestimenti metallici e procedimento per la metallizzazione ad umido di superfici

Info

Publication number
IT8468151A0
IT8468151A0 IT8468151A IT6815184A IT8468151A0 IT 8468151 A0 IT8468151 A0 IT 8468151A0 IT 8468151 A IT8468151 A IT 8468151A IT 6815184 A IT6815184 A IT 6815184A IT 8468151 A0 IT8468151 A0 IT 8468151A0
Authority
IT
Italy
Prior art keywords
metalization
wet
procedure
plastic substrate
metallic coatings
Prior art date
Application number
IT8468151A
Other languages
English (en)
Other versions
IT8468151A1 (it
IT1179821B (it
Inventor
Ralf Liebler Manfred Munzer
Peter Quis
Petrus Egidius Jacobu Legierse
Original Assignee
Roehm Gmbh
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19833341536 external-priority patent/DE3341536A1/de
Priority claimed from DE19843435898 external-priority patent/DE3435898A1/de
Application filed by Roehm Gmbh, Philips Nv filed Critical Roehm Gmbh
Publication of IT8468151A0 publication Critical patent/IT8468151A0/it
Publication of IT8468151A1 publication Critical patent/IT8468151A1/it
Application granted granted Critical
Publication of IT1179821B publication Critical patent/IT1179821B/it

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/285Sensitising or activating with tin based compound or composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204Radiation, e.g. UV, laser
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
IT6815184A 1983-11-17 1984-11-16 Substrato di materiale plastico per l ancoraggio di rivestimenti metallici e procedimento per la metallizzazione ad umido di superfici IT1179821B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833341536 DE3341536A1 (de) 1983-11-17 1983-11-17 Kunststoffsubstrat zur verankerung von metallueberzuegen
DE19843435898 DE3435898A1 (de) 1984-09-29 1984-09-29 Kunststoffsubstrat zur verankerung von metallueberzuegen

Publications (3)

Publication Number Publication Date
IT8468151A0 true IT8468151A0 (it) 1984-11-16
IT8468151A1 IT8468151A1 (it) 1986-05-16
IT1179821B IT1179821B (it) 1987-09-16

Family

ID=25815681

Family Applications (1)

Application Number Title Priority Date Filing Date
IT6815184A IT1179821B (it) 1983-11-17 1984-11-16 Substrato di materiale plastico per l ancoraggio di rivestimenti metallici e procedimento per la metallizzazione ad umido di superfici

Country Status (7)

Country Link
US (1) US4663199A (it)
CH (1) CH662818A5 (it)
ES (1) ES8605833A1 (it)
FR (1) FR2555185A1 (it)
GB (1) GB2152062B (it)
IT (1) IT1179821B (it)
NL (1) NL8403498A (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87100440B (zh) * 1987-01-27 1988-05-11 中国人民解放军装甲兵工程学院 在不导电材料上刷镀铜的方法
US5271870A (en) * 1987-08-27 1993-12-21 The United States Of America As Represented By The Department Of Energy Process for introducing electrical conductivity into high-temperature polymeric materials
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
CN1228358C (zh) * 2001-05-25 2005-11-23 日本油漆株式会社 涂布塑料模制品的方法、用以蒸发金属的可紫外光固化底漆及塑料模制品
US8465469B2 (en) * 2002-09-12 2013-06-18 Medtronic Vascular, Inc. Reinforced catheter and methods of making
DE102005051632B4 (de) * 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
KR101678013B1 (ko) * 2016-02-15 2016-11-21 주식회사 베프스 금속성분의 액중 농도 지시체를 포함하는 도금액 및 이를 이용한 도금 방법
US20170251557A1 (en) * 2016-02-29 2017-08-31 Rohm And Haas Electronic Materials Llc Horizontal method of electroless metal plating of substrates with ionic catalysts

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3094430A (en) * 1961-12-11 1963-06-18 John E Marshall Jr Method of applying mirror coating to acrylic base
DE1569434A1 (de) * 1964-10-06 1969-06-26 Schering Ag Verfahren zum Modifizieren von Kunststoffoberflaechen fuer nachfolgende Galvanisierung
US3524754A (en) * 1967-04-28 1970-08-18 Shell Oil Co Metal plating of plastics
BE733892A (it) * 1969-05-30 1969-11-03
GB1343212A (en) * 1971-01-11 1974-01-10 Macdermid Ltd Treatmetn of resin substrates for the reception of metal doposits
US3779790A (en) * 1971-12-08 1973-12-18 Hooker Chemical Corp Metal plating of synthetic polymers
JPS4948171A (it) * 1972-09-11 1974-05-10
US3998602A (en) * 1975-02-07 1976-12-21 Carl Horowitz Metal plating of polymeric substrates
US4244789A (en) * 1979-01-24 1981-01-13 Stauffer Chemical Company Method of metallizing materials
US4246320A (en) * 1979-03-15 1981-01-20 Stauffer Chemical Company Plated acrylate/styrene/acrylonitrile article
US4363844A (en) * 1980-09-22 1982-12-14 Lewis Terry W Metallized information carrying discs
NL8103375A (nl) * 1981-07-16 1983-02-16 Philips Nv Methode voor de vervaardiging van een kunstsof voorwerp dat voorzien is van een metaallaag.

Also Published As

Publication number Publication date
ES8605833A1 (es) 1986-04-01
ES537729A0 (es) 1986-04-01
IT8468151A1 (it) 1986-05-16
GB8429143D0 (en) 1984-12-27
US4663199A (en) 1987-05-05
FR2555185A1 (fr) 1985-05-24
NL8403498A (nl) 1985-06-17
CH662818A5 (de) 1987-10-30
IT1179821B (it) 1987-09-16
GB2152062A (en) 1985-07-31
GB2152062B (en) 1988-02-03

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