IT8619667A0 - Complessi di circuiti elettronici. - Google Patents

Complessi di circuiti elettronici.

Info

Publication number: IT8619667A0
Authority: IT; Italy
Prior art keywords: complexes; electronic circuits; circuits; electronic; circuits complexes
Prior art date: 1985-03-15

Application number

IT8619667A

Other languages

English (en)

Other versions

IT1188581B (it

IT8619667A1 (it

Inventor

Conrad Raymond Crewe Maloney

Edward Stuart Eccles

Original Assignee

Smith Ind Plc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-03-15

Filing date

1986-03-07

Publication date

1986-03-07

1986-03-07 Application filed by Smith Ind Plc filed Critical Smith Ind Plc

1986-03-07 Publication of IT8619667A0 publication Critical patent/IT8619667A0/it

1987-09-07 Publication of IT8619667A1 publication Critical patent/IT8619667A1/it

1988-01-20 Application granted granted Critical

1988-01-20 Publication of IT1188581B publication Critical patent/IT1188581B/it

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/641—Adaptable interconnections, e.g. fuses or antifuses
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/941—Dispositions of bond pads
- H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

IT19667/86A 1985-03-15 1986-03-07 Complessi di circuiti elettronici IT1188581B (it)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB858506714A GB8506714D0 (en)	1985-03-15	1985-03-15	Electronic circuit assemblies

Publications (3)

Publication Number	Publication Date
IT8619667A0 true IT8619667A0 (it)	1986-03-07
IT8619667A1 IT8619667A1 (it)	1987-09-07
IT1188581B IT1188581B (it)	1988-01-20

Family

ID=10576034

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IT19667/86A IT1188581B (it)	1985-03-15	1986-03-07	Complessi di circuiti elettronici

Country Status (5)

Country	Link
JP (1)	JPS61214549A (it)
DE (1)	DE3607093A1 (it)
FR (1)	FR2579022A1 (it)
GB (2)	GB8506714D0 (it)
IT (1)	IT1188581B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5021869A (en) *	1988-12-27	1991-06-04	Hewlett-Packard Company	Monolithic semiconductor chip interconnection technique and arrangement
JPH05335529A (ja) *	1992-05-28	1993-12-17	Fujitsu Ltd	半導体装置およびその製造方法
DE4225138A1 (de) *	1992-07-30	1994-02-03	Daimler Benz Ag	Multichipmodul und Verfahren zu dessen Herstellung
WO1996001497A1 (de) *	1994-07-05	1996-01-18	Siemens Aktiengesellschaft	Verfahren zur herstellung einer dreidimensionalen schaltungsanordnung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1112992A (en) *	1964-08-18	1968-05-08	Texas Instruments Inc	Three-dimensional integrated circuits and methods of making same
US3879839A (en) *	1973-06-04	1975-04-29	Ibm	Method of manufacturing multi-function LSI wafers
FR2471048A1 (fr) *	1979-12-07	1981-06-12	Silicium Semiconducteur Ssc	Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire
GB2117564B (en) *	1982-03-26	1985-11-06	Int Computers Ltd	Mounting one integrated circuit upon another

1985
- 1985-03-15 GB GB858506714A patent/GB8506714D0/en active Pending
1986
- 1986-03-05 DE DE19863607093 patent/DE3607093A1/de not_active Withdrawn
- 1986-03-07 IT IT19667/86A patent/IT1188581B/it active
- 1986-03-07 GB GB08605664A patent/GB2172429A/en not_active Withdrawn
- 1986-03-11 FR FR8603549A patent/FR2579022A1/fr not_active Withdrawn
- 1986-03-15 JP JP61056113A patent/JPS61214549A/ja active Pending

Also Published As

Publication number	Publication date
GB8605664D0 (en)	1986-04-16
GB2172429A (en)	1986-09-17
GB8506714D0 (en)	1985-04-17
IT1188581B (it)	1988-01-20
FR2579022A1 (fr)	1986-09-19
DE3607093A1 (de)	1986-09-18
JPS61214549A (ja)	1986-09-24
IT8619667A1 (it)	1987-09-07

Publication	Publication Date	Title
DE3678808D1 (de)	1991-05-23	Induktive schaltungsanordnungen.
DE3481107D1 (de)	1990-02-22	Elektronische schaltungsanordnung.
DE3774911D1 (de)	1992-01-16	Matrix-strukturierte multiplizierschaltung.
DE3670154D1 (de)	1990-05-10	Elektronisches hubodometer.
NL191912C (nl)	1996-10-04	Geïntegreerd circuit.
FI853410A0 (fi)	1985-09-05	Kopplingsanordning.
DE3481880D1 (de)	1990-05-10	Schaltkreis.
IT8423413A0 (it)	1984-10-31	Connettore elettrico incorporante componenti di circuiti elettrici.
DE3587715D1 (de)	1994-02-17	Integrierte Schaltung.
DE3685071D1 (de)	1992-06-04	Integrierte halbleiterschaltung.
DE3672748D1 (de)	1990-08-23	Spannungsmultipliziererschaltung.
DE3679928D1 (de)	1991-08-01	Monolitisch integrierte mikrowellenschaltungsanordnung.
DE3685759D1 (de)	1992-07-30	Integrierte halbleiterschaltung.
DE3680265D1 (de)	1991-08-22	Halbleiterschaltungsanordnung.
DE3679962D1 (de)	1991-08-01	Elektronischer frankiermaschinenschaltkreis.
IT8423065A0 (it)	1984-10-09	Armadietto per circuiti stampati.
DE3677165D1 (de)	1991-02-28	Integrierte halbleiterschaltungsanordnung.
DE3684364D1 (de)	1992-04-23	Integrierte halbleiterschaltung.
DE3586810D1 (de)	1992-12-17	Halbleiterschaltung.
DE3482084D1 (de)	1990-05-31	Integrierte schaltung.
FI852164A0 (fi)	1985-05-30	Kopplingsanordning.
DE3669793D1 (de)	1990-04-26	Halbleiterkreiseinrichtung.
FI875141A7 (fi)	1988-05-26	Elektroninen hybridipiiri.
FI841558A0 (fi)	1984-04-18	Kopplingsanordning.
DE3485292D1 (de)	1992-01-09	Lade-entladekreis.