IT8647738A0 - Lappatrice a due plato' con dispositivo per la misura dello spessore del pezzo in lavorazione e con tavola di caricamento manuale dei satelliti - Google Patents
Lappatrice a due plato' con dispositivo per la misura dello spessore del pezzo in lavorazione e con tavola di caricamento manuale dei satellitiInfo
- Publication number
- IT8647738A0 IT8647738A0 IT8647738A IT4773886A IT8647738A0 IT 8647738 A0 IT8647738 A0 IT 8647738A0 IT 8647738 A IT8647738 A IT 8647738A IT 4773886 A IT4773886 A IT 4773886A IT 8647738 A0 IT8647738 A0 IT 8647738A0
- Authority
- IT
- Italy
- Prior art keywords
- processed
- measuring
- piece
- thickness
- loading table
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT47738/86A IT1190231B (it) | 1986-03-07 | 1986-03-07 | Lappatrice a due plato' con dispositivo per la misura spessore del pezzo in lavorazione e con tavola di caricamento manuale dei satelliti |
| DE8787830086T DE3781188T2 (de) | 1986-03-07 | 1987-03-05 | Zweischeiben-laeppmaschine mit komparator zum ununterbrochenen messen der werkstueckdicke. |
| EP87830086A EP0241433B1 (en) | 1986-03-07 | 1987-03-05 | A two-plate lapping machine with comparator for continuously measuring the workpiece tichness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT47738/86A IT1190231B (it) | 1986-03-07 | 1986-03-07 | Lappatrice a due plato' con dispositivo per la misura spessore del pezzo in lavorazione e con tavola di caricamento manuale dei satelliti |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8647738A0 true IT8647738A0 (it) | 1986-03-07 |
| IT1190231B IT1190231B (it) | 1988-02-16 |
Family
ID=11262207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT47738/86A IT1190231B (it) | 1986-03-07 | 1986-03-07 | Lappatrice a due plato' con dispositivo per la misura spessore del pezzo in lavorazione e con tavola di caricamento manuale dei satelliti |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0241433B1 (it) |
| DE (1) | DE3781188T2 (it) |
| IT (1) | IT1190231B (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115808145A (zh) * | 2022-12-02 | 2023-03-17 | 江苏希太芯科技有限公司 | 一种用于晶圆厚度多点测量装置及方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3818159A1 (de) * | 1988-05-28 | 1989-11-30 | Wolters Peter Fa | Verfahren und vorrichtung zur steuerung des betriebs von hon- oder schleifmaschinen |
| IT1243537B (it) * | 1990-10-19 | 1994-06-16 | Melchiorre Off Mecc | Metodo e dispositivo per il controllo al termine di ogni ciclo (post process) dei pezzi lavorati in una macchina lappatrice a doppio plateau |
| DE10007390B4 (de) * | 1999-03-13 | 2008-11-13 | Peter Wolters Gmbh | Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3097458A (en) * | 1960-05-13 | 1963-07-16 | Method of accurately machining semiconductor bodies | |
| US3304662A (en) * | 1964-04-28 | 1967-02-21 | Speedlap Corp | Apparatus for lapping |
| JPS57168109A (en) * | 1981-04-10 | 1982-10-16 | Shinetsu Eng Kk | Device for measuring thickness of work piece in lapping plate |
-
1986
- 1986-03-07 IT IT47738/86A patent/IT1190231B/it active
-
1987
- 1987-03-05 EP EP87830086A patent/EP0241433B1/en not_active Expired - Lifetime
- 1987-03-05 DE DE8787830086T patent/DE3781188T2/de not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115808145A (zh) * | 2022-12-02 | 2023-03-17 | 江苏希太芯科技有限公司 | 一种用于晶圆厚度多点测量装置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| IT1190231B (it) | 1988-02-16 |
| DE3781188T2 (de) | 1992-12-17 |
| EP0241433B1 (en) | 1992-08-19 |
| DE3781188D1 (de) | 1992-09-24 |
| EP0241433A3 (en) | 1989-07-26 |
| EP0241433A2 (en) | 1987-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19940330 |